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IPB80N06S209ATMA2

Infineon Technologies

IPB80N06S209ATMA2 by Infineon Technologies

IPB80N06S209ATMA2 by Infineon Technologies is a N-CHANNEL power FET with a min DS breakdown voltage of 55V. It has a max pulsed drain current of 320A and a max drain-source on resistance of 0.0088 ohm. This transistor is commonly used in applications requiring high power and efficiency.

Median Price

$2.308

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 864 parts In-Stock

1+ parts

$3.190

100+ parts

$1.460

1k+ parts

$1.160

10k+ parts

-

864

$3.190

$1.460

$1.160

-

DigiKey

USA . 854 parts In-Stock

1+ parts

$3.220

100+ parts

$1.452

1k+ parts

$1.090

10k+ parts

$1.007

854

$3.220

$1.452

$1.090

$1.007

Verical

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.426

10k+ parts

$1.303

16,000

-

-

$1.426

$1.303

Rochester

USA . 977 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.140

10k+ parts

$1.010

977

-

$1.370

$1.140

$1.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 230 parts In-Stock

1+ parts

$1.064

100+ parts

-

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-

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230

$1.064

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.621

100+ parts

-

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-

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100

$1.621

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-

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Sensible Micro Corp

USA . 1,165 parts In-Stock

1+ parts

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1,165

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Vyrian

USA . 979 parts In-Stock

1+ parts

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979

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 38,515 parts In-Stock

1+ parts

$0.556

100+ parts

-

1k+ parts

-

10k+ parts

-

38,515

$0.556

-

-

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Modulus Dynamics

Lithuania . 10,768 parts In-Stock

1+ parts

$0.786

100+ parts

$0.755

1k+ parts

$0.723

10k+ parts

-

10,768

$0.786

$0.755

$0.723

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Ampacity Inc.

Singapore . 883 parts In-Stock

1+ parts

$0.950

100+ parts

-

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-

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883

$0.950

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-

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Corphita

USA . 628 parts In-Stock

1+ parts

$1.008

100+ parts

-

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628

$1.008

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-

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Corohmni

South Africa . 85 parts In-Stock

1+ parts

$1.060

100+ parts

-

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85

$1.060

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$1.588

100+ parts

-

1k+ parts

$1.525

10k+ parts

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2,000

$1.588

-

$1.525

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Argo Parts USA

USA . 2,028 parts In-Stock

1+ parts

$1.621

100+ parts

-

1k+ parts

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2,028

$1.621

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-

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Continental Prestige Electronics

USA . 1,253 parts In-Stock

1+ parts

$1.621

100+ parts

-

1k+ parts

-

10k+ parts

$1.588

1,253

$1.621

-

-

$1.588

RC Electronics

USA . 43,855 parts In-Stock

1+ parts

-

100+ parts

$1.650

1k+ parts

$1.510

10k+ parts

$1.460

43,855

-

$1.650

$1.510

$1.460

Overview

Experience superior power and performance with the IPB80N06S209ATMA2 by Infineon Technologies. As a leader in the industry, Infineon Technologies brings you top-quality power field effect transistors that are sure to exceed your expectations. With its N-channel configuration and built-in diode, this transistor offers unparalleled versatility for various applications. Its small outline package and gull wing terminal form make it easy to install and integrate into your designs. Enjoy enhanced efficiency and reliability with the IPB80N06S209ATMA2, delivering a maximum pulsed drain current of 320 A and a minimum DS breakdown voltage of 55 V. Don't settle for anything less when it comes to power transistors - choose Infineon Technologies for exceptional value and performance.

Feature Benefit Bullets

Package Body Material

Made with durable PLASTIC/EPOXY for long-lasting performance.

Polarity or Channel Type

N-CHANNEL design ensures efficient and reliable power transfer.

Configuration

SINGLE WITH BUILT-IN DIODE for simplified circuitry and enhanced protection.

Surface Mount

Enables easy installation and integration into various electronic applications.

Minimum DS Breakdown Voltage

Provides a robust 55 V capacity for handling high voltage requirements.

Package Shape

RECTANGULAR design for space-efficient placement in compact devices.

Terminal Form

GULL WING terminals ensure secure and reliable connections.

Operating Mode

ENHANCEMENT MODE supports improved power efficiency and control.

No. of Elements

Single element design simplifies circuit design and reduces complexity.

Maximum Pulsed Drain Current (IDM)

Impressive 320 A capability for handling high-power applications.

Avalanche Energy Rating (EAS)

Boasts a strong 370 mJ rating for added protection against sudden energy surges.

No. of Terminals

Simple 2-terminal configuration for easy integration into existing circuitry.

Package Style (Meter)

SMALL OUTLINE package style allows for compact and versatile installation options.

Field Effect Transistor Technology

Utilizes the reliable and efficient METAL-OXIDE SEMICONDUCTOR technology for optimal performance.

Transistor Element Material

SILICON material ensures superior durability and conductivity.

Terminal Finish

Tin finish for enhanced corrosion resistance and improved electrical conductivity.

Maximum Drain Current (ID)

Offers a substantial 80 A capacity, ideal for power-demanding applications.

Maximum Drain-Source On Resistance

Low 0.0088 ohm resistance for efficient power transfer and minimal energy loss.

Terminal Position

SINGLE terminal design for simplified installation and connection.

Moisture Sensitivity Level (MSL)

Level 1 moisture sensitivity ensures reliable operation in varied environmental conditions.

Case Connection

DRAIN case connection for effective heat dissipation and temperature management.

Technical Specifications

Power Field Effect Transistors (FET) IPB80N06S209ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

370 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB80N06S209ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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