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IPB80P03P4L04ATMA1

Infineon Technologies

IPB80P03P4L04ATMA1 by Infineon Technologies

Infineon's IPB80P03P4L04ATMA1 is a P-CHANNEL FET with 30V DS Breakdown Voltage, 80A ID, and 0.007 ohm RDS(on). Ideal for power applications due to its 320A IDM rating and 410mJ EAS. Features GULL WING terminals in a SMALL OUTLINE package.

Median Price

$2.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 786 parts In-Stock

1+ parts

$2.480

100+ parts

$1.530

1k+ parts

$1.130

10k+ parts

-

786

$2.480

$1.530

$1.130

-

Farnell

UK . 349 parts In-Stock

1+ parts

$3.230

100+ parts

$1.690

1k+ parts

-

10k+ parts

-

349

$3.230

$1.690

-

-

Element14

Singapore . 349 parts In-Stock

1+ parts

$3.840

100+ parts

$2.370

1k+ parts

$2.020

10k+ parts

-

349

$3.840

$2.370

$2.020

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.325

2,000

-

-

$1.413

$1.325

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.130

10k+ parts

$1.060

2,000

-

$1.260

$1.130

$1.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 34 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$1.330

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.960

-

-

-

Vyrian

USA . 6,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,435

-

-

-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,921 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

4,921

$0.610

-

-

-

Ampacity Inc.

Singapore . 10,563 parts In-Stock

1+ parts

$1.130

100+ parts

-

1k+ parts

-

10k+ parts

-

10,563

$1.130

-

-

-

Semicontronic

India . 10,530 parts In-Stock

1+ parts

$1.190

100+ parts

$1.160

1k+ parts

$1.154

10k+ parts

-

10,530

$1.190

$1.160

$1.154

-

Corphita

USA . 488 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

488

$1.260

-

-

-

Continental Prestige Electronics

USA . 985 parts In-Stock

1+ parts

$1.330

100+ parts

$1.280

1k+ parts

$1.220

10k+ parts

-

985

$1.330

$1.280

$1.220

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Argo Parts USA

USA . 3,385 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

-

10k+ parts

-

3,385

$1.960

-

-

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Modulus Dynamics

Lithuania . 2,610 parts In-Stock

1+ parts

$2.070

100+ parts

$1.987

1k+ parts

$1.904

10k+ parts

-

2,610

$2.070

$1.987

$1.904

-

Corohmni

South Africa . 93 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

93

$2.070

-

-

-

Advanced Electronics

New Zealand . 88 parts In-Stock

1+ parts

$2.132

100+ parts

$2.025

1k+ parts

$2.025

10k+ parts

-

88

$2.132

$2.025

$2.025

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Microchip USA

USA . 8,971 parts In-Stock

1+ parts

$10.723

100+ parts

-

1k+ parts

-

10k+ parts

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8,971

$10.723

-

-

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AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$12.470

100+ parts

-

1k+ parts

-

10k+ parts

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674

$12.470

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.921

1k+ parts

$1.862

10k+ parts

$1.823

2,000

-

$1.921

$1.862

$1.823

Perfect Parts

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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20

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Overview

Experience superior performance and reliability with the IPB80P03P4L04ATMA1 Power Field Effect Transistor by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers cutting-edge technology for a wide range of applications. This P-CHANNEL FET offers efficient power management with its built-in diode, ensuring optimal performance in enhancement mode. With a maximum drain current of 80 A and low on-resistance, customers can trust in the quality and value that this product provides for their projects. Trust Infineon for unparalleled innovation and reliability in power semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the FET, making it suitable for a wide range of applications.

Polarity or Channel Type: P-CHANNEL

P-Channel FETs are known for their low on-state resistance and high current-carrying capability, making them efficient for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in protection against reverse polarity and allows for easy integration into circuits without the need for additional components.

Surface Mount: YES

Surface mount capability allows for easy PCB assembly and saves space, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 30 V

Having a minimum breakdown voltage of 30V ensures reliable operation and protection against voltage spikes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high switching speeds and low gate drive power, making them suitable for power management applications where efficiency is key.

Maximum Pulsed Drain Current (IDM): 320 A

High pulsed drain current rating allows for handling of large current spikes, making it suitable for applications with high power demands.

Avalanche Energy Rating (EAS): 410 mJ

High avalanche energy rating ensures robustness and reliability in harsh operating conditions, making it suitable for rugged applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making it a reliable choice for power management applications.

Maximum Drain Current (ID): 80 A

High drain current rating allows for reliable operation under heavy load conditions, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.007 ohm

Low on-resistance reduces power loss and improves efficiency, making it suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB80P03P4L04ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

410 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB80P03P4L04ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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