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IPB80N06S405ATMA2

Infineon Technologies

IPB80N06S405ATMA2 by Infineon Technologies

Infineon's IPB80N06S405ATMA2 is a N-CHANNEL FET with 60V DS Breakdown Voltage, 320A IDM, and 0.0057 ohm RDS(on). Ideal for power applications due to its high drain current capacity and low on-resistance. Suitable for use in enhancement mode operation where high efficiency is required.

Median Price

$1.884

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 284 parts In-Stock

1+ parts

$2.710

100+ parts

$1.200

1k+ parts

$0.857

10k+ parts

-

284

$2.710

$1.200

$0.857

-

DigiKey

USA . 66 parts In-Stock

1+ parts

$2.850

100+ parts

$1.258

1k+ parts

$0.847

10k+ parts

$0.749

66

$2.850

$1.258

$0.847

$0.749

Rochester

USA . 2,899 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.847

10k+ parts

$0.755

2,899

-

$1.020

$0.847

$0.755

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.058

10k+ parts

$0.944

1,000

-

-

$1.058

$0.944

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 978 parts In-Stock

1+ parts

$0.790

100+ parts

-

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978

$0.790

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.853

100+ parts

-

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10

$0.853

-

-

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Vyrian

USA . 1,118 parts In-Stock

1+ parts

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1,118

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NAC Semi

USA . 1,000 parts In-Stock

1+ parts

-

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$1.570

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1,000

-

-

$1.570

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Bristol Electronics

USA . 136 parts In-Stock

1+ parts

-

100+ parts

$1.124

1k+ parts

$0.674

10k+ parts

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136

-

$1.124

$0.674

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Dan-Mar Components

USA . 136 parts In-Stock

1+ parts

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136

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ACDS - Activité Composants Distribution Service

France . 17 parts In-Stock

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Holdelec - ElecDif-Pro

France . 17 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,253 parts In-Stock

1+ parts

$0.710

100+ parts

$0.692

1k+ parts

$0.689

10k+ parts

-

1,253

$0.710

$0.692

$0.689

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Ampacity Inc.

Singapore . 1,226 parts In-Stock

1+ parts

$0.710

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1,226

$0.710

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Corphita

USA . 565 parts In-Stock

1+ parts

$0.749

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565

$0.749

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Argo Parts USA

USA . 2,990 parts In-Stock

1+ parts

$0.853

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2,990

$0.853

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Continental Prestige Electronics

USA . 1,424 parts In-Stock

1+ parts

$0.853

100+ parts

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1k+ parts

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10k+ parts

$0.836

1,424

$0.853

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-

$0.836

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.853

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1,000

$0.853

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Component Stockers USA

USA . 5,549 parts In-Stock

1+ parts

$1.050

100+ parts

$0.990

1k+ parts

$0.880

10k+ parts

-

5,549

$1.050

$0.990

$0.880

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Modulus Dynamics

Lithuania . 24,381 parts In-Stock

1+ parts

$1.370

100+ parts

$1.315

1k+ parts

$1.260

10k+ parts

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24,381

$1.370

$1.315

$1.260

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Corohmni

South Africa . 125 parts In-Stock

1+ parts

$1.370

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125

$1.370

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Aztec Data Supply Inc.

USA . 3,898 parts In-Stock

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$1.700

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3,898

$1.700

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Microchip USA

USA . 5,256 parts In-Stock

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$7.144

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5,256

$7.144

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Glotronic Ltd.

UK . 800 parts In-Stock

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800

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Overview

Unlock the power of cutting-edge technology with the IPB80N06S405ATMA2 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor boasts a single configuration with a built-in diode, offering unparalleled performance and reliability. Ideal for a wide range of applications, this transistor provides a breakthrough in efficiency and functionality. Experience seamless operation and enhanced energy savings with this innovative product, setting new standards in the industry. Choose quality, choose value, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and higher efficiency compared to P-channel FETs, making them a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can help protect against reverse voltage spikes.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during production.

Minimum DS Breakdown Voltage: 60 V

Suitable for applications where higher voltage handling is required, providing increased versatility.

Package Shape: RECTANGULAR

Compact shape that allows for efficient use of space on the PCB.

Terminal Form: GULL WING

Provides ease of soldering during assembly, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, offering better control over the switching characteristics.

Maximum Pulsed Drain Current (IDM): 320 A

High current handling capability allows for robust performance in demanding applications.

Avalanche Energy Rating (EAS): 152 mJ

Can withstand high energy spikes, providing reliability in transient overvoltage conditions.

No. of Terminals: 2

Simplifies circuit connections and reduces complexity in design.

Package Style (Meter): SMALL OUTLINE

Compact design that saves space on the PCB while providing high performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Common and reliable technology that offers good performance characteristics.

Transistor Element Material: SILICON

Silicon is a widely used material in semiconductor devices due to its stable and predictable behavior.

Terminal Finish: TIN

Tin provides a reliable and low-resistance connection for efficient current flow.

Maximum Drain Current (ID): 80 A

Sufficient current handling capability for medium to high power applications.

Maximum Drain-Source On Resistance: 0.0057 ohm

Low on-resistance minimizes power losses and improves efficiency in the circuit.

Terminal Position: SINGLE

Simplifies the connection process and reduces the chances of errors during assembly.

Case Connection: DRAIN

Drain connection for easy integration into the circuit and efficient heat dissipation.

Technical Specifications

Power Field Effect Transistors (FET) IPB80N06S405ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

152 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB80N06S405ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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