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IPB80P04P407XT

Infineon Technologies

IPB80P04P407XT by Infineon Technologies

IPB80P04P407XT by Infineon is a P-CHANNEL FET with 40V DS Breakdown Voltage, 320A IDM, and 0.0077 ohm RDS(on). Ideal for power applications due to its high drain current capacity and low on-resistance. Suitable for use in enhancement mode operation where high efficiency is required.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 1,065 parts In-Stock

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Digiode

USA . 372 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Modulus Dynamics

Lithuania . 15,849 parts In-Stock

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$1.524

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$1.463

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$1.402

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15,849

$1.524

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AZTECH Wire

Italy . 638 parts In-Stock

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$10.732

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Ampacity Inc.

Singapore . 1,285 parts In-Stock

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$26.050

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Continental Prestige Electronics

USA . 4,916 parts In-Stock

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Argo Parts USA

USA . 3,103 parts In-Stock

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Corphita

USA . 209 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the IPB80P04P407XT by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability. This P-channel Power Field Effect Transistor is designed for a wide range of applications, offering high performance and efficiency. With a maximum drain current of 80A and low on-resistance, this transistor delivers superior functionality. Experience seamless operation and enhanced productivity with the IPB80P04P407XT - the ultimate solution for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product long-lasting.

Polarity or Channel Type: P-CHANNEL

P-Channel FETs offer lower resistance and higher current handling capabilities, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space on the PCB, making it more efficient.

Surface Mount: YES

Surface mount technology allows for easy integration into compact electronic devices, saving valuable space on the board.

Minimum DS Breakdown Voltage: 40V

With a high breakdown voltage, this FET can handle high voltage applications without being damaged.

Package Shape: RECTANGULAR

Rectangular packages are common and easy to work with, ensuring compatibility with various electronic systems.

Terminal Form: GULL WING

Gull wing terminals provide mechanical stability and easy soldering during the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer faster switching speeds and lower power consumption, making them suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 320A

The high pulsed drain current rating allows for reliable performance in demanding scenarios with short bursts of power.

Avalanche Energy Rating (EAS): 31mJ

A high avalanche energy rating indicates the FET's ability to handle sudden voltage spikes without damage, ensuring reliability in unpredictable conditions.

No. of Terminals: 2

Having a simple two-terminal design simplifies circuit connections and reduces the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits and is ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption, making it suitable for a wide range of electronic applications.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability and efficiency, ensuring consistent performance over time.

Maximum Drain Current (ID): 80A

The high drain current rating allows for reliable operation in applications with high power requirements.

Maximum Drain-Source On Resistance: 0.0077 ohm

The low on-resistance minimizes power loss and heat dissipation, improving the overall efficiency of the FET.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures proper alignment in the circuit.

Case Connection: DRAIN

The case connection being at the drain terminal simplifies the thermal management and ensures efficient heat dissipation during operation.

Technical Specifications

Power Field Effect Transistors (FET) IPB80P04P407XT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

31 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0077 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

IPB80P04P407XT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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