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IPB180N08S402ATMA1

Infineon Technologies

IPB180N08S402ATMA1 by Infineon Technologies

Infineon's IPB180N08S402ATMA1 is a N-CHANNEL FET with 80V DS Breakdown Voltage, 720A IDM, and 0.0022 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$3.944

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 3,451 parts In-Stock

1+ parts

$3.944

100+ parts

$2.934

1k+ parts

$2.617

10k+ parts

-

3,451

$3.944

$2.934

$2.617

-

Arrow

USA . 7,948 parts In-Stock

1+ parts

$4.015

100+ parts

$3.206

1k+ parts

$2.948

10k+ parts

-

7,948

$4.015

$3.206

$2.948

-

Chip1Stop

Japan . 6,950 parts In-Stock

1+ parts

$5.270

100+ parts

$3.200

1k+ parts

$2.880

10k+ parts

-

6,950

$5.270

$3.200

$2.880

-

DigiKey

USA . 33 parts In-Stock

1+ parts

$6.470

100+ parts

-

1k+ parts

-

10k+ parts

$2.693

33

$6.470

-

-

$2.693

Rochester

USA . 22,468 parts In-Stock

1+ parts

-

100+ parts

$2.690

1k+ parts

$2.410

10k+ parts

$2.260

22,468

-

$2.690

$2.410

$2.260

Verical

USA . 16,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.013

10k+ parts

$2.825

16,758

-

-

$3.013

$2.825

Farnell

UK . 2,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.930

10k+ parts

-

2,342

-

-

$2.930

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 840 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

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840

$2.840

-

-

-

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$3.361

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$3.361

-

-

-

Tomark Electronics Ltd

UK . 214 parts In-Stock

1+ parts

$14.150

100+ parts

-

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-

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214

$14.150

-

-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,500

-

-

-

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Vyrian

USA . 2,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,932

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 16,945 parts In-Stock

1+ parts

$1.306

100+ parts

$1.254

1k+ parts

$1.202

10k+ parts

-

16,945

$1.306

$1.254

$1.202

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Ampacity Inc.

Singapore . 4,657 parts In-Stock

1+ parts

$2.520

100+ parts

-

1k+ parts

-

10k+ parts

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4,657

$2.520

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-

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Corphita

USA . 470 parts In-Stock

1+ parts

$2.691

100+ parts

-

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-

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470

$2.691

-

-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

$3.162

10k+ parts

-

500

$3.294

-

$3.162

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Argo Parts USA

USA . 2,122 parts In-Stock

1+ parts

$3.361

100+ parts

-

1k+ parts

-

10k+ parts

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2,122

$3.361

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-

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Continental Prestige Electronics

USA . 6,536 parts In-Stock

1+ parts

$3.930

100+ parts

$2.880

1k+ parts

$2.050

10k+ parts

-

6,536

$3.930

$2.880

$2.050

-

Microchip USA

USA . 7,755 parts In-Stock

1+ parts

$20.586

100+ parts

-

1k+ parts

-

10k+ parts

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7,755

$20.586

-

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Infinite Electronics LLP (Excess)

. 89,997 parts In-Stock

1+ parts

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100+ parts

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89,997

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Perfect Parts

USA . 336 parts In-Stock

1+ parts

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100+ parts

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336

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Overview

Unlock the power of innovation with the IPB180N08S402ATMA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies sets the standard for quality and reliability. This Power Field Effect Transistor (FET) offers unparalleled performance and efficiency, making it ideal for a wide range of applications. With its N-CHANNEL design and built-in diode, this transistor delivers exceptional value and benefits to customers seeking cutting-edge technology. Experience the difference that the IPB180N08S402ATMA1 can make in your next project.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - Allows for efficient current flow and control, making it ideal for power switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space, making it easier to integrate into different systems.

Surface Mount:

YES - Enables easy and secure installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage:

80 V - Offers a high voltage tolerance, ensuring reliable operation in demanding environments.

Package Shape:

RECTANGULAR - Allows for efficient heat dissipation and optimal placement within the circuit layout.

Terminal Form:

GULL WING - Provides secure and reliable connections, reducing the risk of signal loss or interference.

Operating Mode:

ENHANCEMENT MODE - Offers precise control over the power output, enhancing overall performance and efficiency.

Maximum Pulsed Drain Current (IDM):

720 A - Can handle high current surges without overheating or damage, increasing reliability under peak load conditions.

Avalanche Energy Rating (EAS):

640 mJ - Provides protection against voltage spikes and surges, ensuring longevity and dependability in harsh environments.

No. of Terminals:

6 - Offers flexibility in circuit configuration and connections, accommodating different system requirements.

Package Style (Meter):

SMALL OUTLINE - Enables compact and space-saving designs, making it suitable for applications with limited space.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Delivers high performance and efficiency, enhancing overall system operation.

Transistor Element Material:

SILICON - Ensures reliable and consistent performance over a wide range of operating conditions.

Terminal Finish:

TIN - Provides corrosion resistance and reliable connections, ensuring long-term stability and performance.

Maximum Drain Current (ID):

180 A - Supports high-power applications, delivering consistent and reliable performance under heavy loads.

Maximum Drain-Source On Resistance:

0.0022 ohm - Offers low power dissipation and high efficiency, reducing heat generation and energy consumption.

Terminal Position:

SINGLE - Simplifies installation and connection to external components, improving overall system integration.

Case Connection:

DRAIN - Provides efficient heat dissipation and helps maintain optimal operating temperatures, enhancing long-term reliability.

Reference Standard:

AEC-Q101 - Meets industry standards for quality and reliability, ensuring consistent performance in automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB180N08S402ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

ULTRA LOW RESISTANCE

Avalanche Energy Rating (EAS):

640 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB180N08S402ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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