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IPA60R299CPXKSA1

Infineon Technologies

IPA60R299CPXKSA1 by Infineon Technologies

Infineon's IPA60R299CPXKSA1 is a N-CHANNEL FET with 600V DS breakdown voltage and 34A IDM. Ideal for switching applications, it features a built-in diode, 0.299 ohm RDS(on), and operates in enhancement mode. The transistor has a max operating temperature of 150°C and comes in a rectangular package with through-hole terminals.

Median Price

$1.413

Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip1Stop

Japan . 135 parts In-Stock

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$2.170

100+ parts

$1.220

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135

$2.170

$1.220

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Rochester

USA . 356,126 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

356,126

-

$1.360

$1.130

$1.010

Verical

USA . 313,999 parts In-Stock

1+ parts

-

100+ parts

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$1.413

10k+ parts

$1.262

313,999

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-

$1.413

$1.262

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Digiode

USA . 778 parts In-Stock

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$0.950

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778

$0.950

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Vyrian

USA . 5,108 parts In-Stock

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5,108

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Modulus Dynamics

Lithuania . 25,376 parts In-Stock

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$0.818

100+ parts

$0.785

1k+ parts

$0.753

10k+ parts

-

25,376

$0.818

$0.785

$0.753

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Component Stockers USA

USA . 687,094 parts In-Stock

1+ parts

$0.870

100+ parts

$0.750

1k+ parts

$1.340

10k+ parts

$1.340

687,094

$0.870

$0.750

$1.340

$1.340

Corphita

USA . 684 parts In-Stock

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$0.900

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684

$0.900

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Microchip USA

USA . 9,904 parts In-Stock

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$13.846

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9,904

$13.846

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AZTECH Wire

Italy . 615 parts In-Stock

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$19.140

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615

$19.140

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Perfect Parts

USA . 335 parts In-Stock

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335

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Overview

Unleash the power of Infineon Technologies' IPA60R299CPXKSA1 Power Field Effect Transistor and experience unmatched performance in switching applications. This N-CHANNEL transistor with a built-in diode offers a breakthrough in efficiency, reliability, and durability. With a high minimum DS breakdown voltage of 600V and maximum pulsed drain current of 34A, this transistor is designed to handle the toughest tasks with ease. Whether you're working on industrial equipment, automotive systems, or renewable energy solutions, this transistor's enhanced mode operation and low on-resistance of 0.299 ohm ensure optimal performance every time. Elevate your projects to new heights with the IPA60R299CPXKSA1 and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good insulation and protection for the transistor, making it durable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility compared to P-channel FETs, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this transistor can handle high voltage applications without the risk of breakdown or failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage at the gate to turn them on, which can be advantageous for certain applications.

Maximum Pulsed Drain Current (IDM): 34 A

High pulsed drain current rating allows the transistor to handle sudden surges in current without damage, suitable for demanding switching applications.

Avalanche Energy Rating (EAS): 290 mJ

High avalanche energy rating indicates that the transistor can withstand and dissipate energy spikes effectively, ensuring reliability in harsh operating conditions.

Maximum Drain Current (ID): 11 A

The high drain current rating of 11A indicates that this transistor can handle high continuous current flow, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.299 ohm

Low drain-source on resistance of 0.299 ohm results in minimal power loss and heat generation, improving efficiency in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) IPA60R299CPXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

290 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA60R299CPXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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