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IPA60R099C6XKSA1

Infineon Technologies

IPA60R099C6XKSA1 by Infineon Technologies

Infineon's IPA60R099C6XKSA1 is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 112A IDM, 796mJ EAS, and 0.099ohm RDS(ON). With a max operating temperature of 150°C, it offers reliable performance in various industrial settings.

Median Price

$4.970

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 313 parts In-Stock

1+ parts

$4.970

100+ parts

$3.050

1k+ parts

$2.310

10k+ parts

-

313

$4.970

$3.050

$2.310

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DigiKey

USA . 1,993 parts In-Stock

1+ parts

$7.130

100+ parts

$5.222

1k+ parts

$3.566

10k+ parts

-

1,993

$7.130

$5.222

$3.566

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Element14

Singapore . 282 parts In-Stock

1+ parts

$8.960

100+ parts

$6.090

1k+ parts

$4.630

10k+ parts

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282

$8.960

$6.090

$4.630

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Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.438

1k+ parts

$3.975

10k+ parts

$3.737

500

-

$4.438

$3.975

$3.737

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.550

1k+ parts

$3.180

10k+ parts

$2.990

500

-

$3.550

$3.180

$2.990

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$4.990

100+ parts

-

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300

$4.990

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TME

Poland . 1 parts In-Stock

1+ parts

$5.020

100+ parts

$3.710

1k+ parts

-

10k+ parts

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1

$5.020

$3.710

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-

Schukat

Germany . 88 parts In-Stock

1+ parts

$6.380

100+ parts

$3.660

1k+ parts

-

10k+ parts

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88

$6.380

$3.660

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Digiode

USA . 791 parts In-Stock

1+ parts

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791

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Contempo Components LLC

USA . 230 parts In-Stock

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Vyrian

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,051 parts In-Stock

1+ parts

$1.554

100+ parts

$1.492

1k+ parts

$1.430

10k+ parts

-

20,051

$1.554

$1.492

$1.430

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Continental Prestige Electronics

USA . 814 parts In-Stock

1+ parts

$6.550

100+ parts

$4.410

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-

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814

$6.550

$4.410

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AZTECH Wire

Italy . 121 parts In-Stock

1+ parts

$12.830

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121

$12.830

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Ampacity Inc.

Singapore . 25 parts In-Stock

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$46.050

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$46.050

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QUARKTWIN TECHNOLOGY LTD

USA . 24,372 parts In-Stock

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24,372

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Microchip USA

USA . 5,161 parts In-Stock

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Argo Parts USA

USA . 2,982 parts In-Stock

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2,982

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Corphita

USA . 274 parts In-Stock

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274

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your power management solutions with the IPA60R099C6XKSA1 by Infineon Technologies. As a trusted manufacturer in the field of Power Field Effect Transistors (FET), Infineon delivers unmatched quality and reliability. This N-CHANNEL transistor with built-in diode is ideal for switching applications, offering a maximum drain current of 37.9 A and a low on-resistance of 0.099 ohm. Whether you're looking to enhance your industrial equipment or automotive systems, this transistor's high voltage breakdown, efficient design, and robust construction ensure optimal performance under various operating conditions. Upgrade your projects today with the IPA60R099C6XKSA1 and experience the Infineon advantage firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, leading to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the transistor and simplifies circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in those scenarios.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this transistor can handle high voltages safely.

Maximum Pulsed Drain Current (IDM): 112 A

Capable of handling high currents during pulsed operation, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, ideal for various industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) IPA60R099C6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

796 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

37.9 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA60R099C6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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