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IPA65R099C6XKSA1

Infineon Technologies

IPA65R099C6XKSA1 by Infineon Technologies

Infineon's IPA65R099C6XKSA1 is a N-CHANNEL FET with 650V DS breakdown voltage, 0.099 ohm RDS(on), and 115A IDM. Ideal for switching applications, it features a built-in diode, 845mJ EAS rating, and operates in enhancement mode. The transistor has a plastic/epoxy body, through-hole terminals, and isolated case connection.

Median Price

$2.969

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,933 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

2,933

-

$2.800

$2.510

$2.360

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

2,500

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$2.835

100+ parts

-

1k+ parts

-

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-

550

$2.835

-

-

-

Digiode

USA . 745 parts In-Stock

1+ parts

$2.974

100+ parts

-

1k+ parts

-

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745

$2.974

-

-

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Vyrian

USA . 3,279 parts In-Stock

1+ parts

-

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3,279

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Chip Stock

USA . 2,510 parts In-Stock

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2,510

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 126 parts In-Stock

1+ parts

$2.660

100+ parts

-

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-

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-

126

$2.660

-

-

-

Modulus Dynamics

Lithuania . 15,588 parts In-Stock

1+ parts

$2.813

100+ parts

$2.700

1k+ parts

$2.588

10k+ parts

-

15,588

$2.813

$2.700

$2.588

-

Corphita

USA . 514 parts In-Stock

1+ parts

$2.817

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$2.817

-

-

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Argo Parts USA

USA . 2,948 parts In-Stock

1+ parts

$2.835

100+ parts

-

1k+ parts

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10k+ parts

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2,948

$2.835

-

-

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Continental Prestige Electronics

USA . 384 parts In-Stock

1+ parts

$2.835

100+ parts

-

1k+ parts

-

10k+ parts

$2.778

384

$2.835

-

-

$2.778

AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$18.007

100+ parts

-

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358

$18.007

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Microchip USA

USA . 5,145 parts In-Stock

1+ parts

$19.500

100+ parts

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5,145

$19.500

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Perfect Parts

USA . 728 parts In-Stock

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728

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.778

1k+ parts

$2.693

10k+ parts

$2.637

500

-

$2.778

$2.693

$2.637

Overview

Experience the unmatched power and reliability of Infineon Technologies with the IPA65R099C6XKSA1 Power Field Effect Transistor. This N-CHANNEL transistor, configured with a built-in diode, is designed for high-performance switching applications. With a minimum DS Breakdown Voltage of 650V and maximum Pulsed Drain Current of 115A, this transistor offers superior performance and efficiency. Trust in Infineon's cutting-edge technology and quality to enhance your projects and drive innovation forward. Elevate your designs with the IPA65R099C6XKSA1 and experience the difference Infineon can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good insulation and protection for the transistor, ensuring durability and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and switching speeds compared to P-channel FETs, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient and efficient switching operations, reducing the need for external components and simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance for efficient power control.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage levels without breakdown, ensuring safe and reliable operation in high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB mounting and space-saving integration within circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering onto circuit boards, enhancing the overall reliability of the FET in a variety of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control over the switching operation, making them ideal for applications where precise voltage regulation is required.

Maximum Pulsed Drain Current (IDM): 115 A

The high pulsed drain current rating allows for handling sudden surge currents, making this FET suitable for demanding applications where transient power levels may be present.

Avalanche Energy Rating (EAS): 845 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient overloads, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 3

The 3-terminal configuration offers simple and straightforward connections, reducing complexity in circuit design and assembly processes.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and secure mounting options, suitable for rugged or high-vibration environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage currents and fast switching speeds, making this FET efficient for power control applications.

Transistor Element Material: SILICON

Silicon-based FETs are known for their high thermal conductivity and reliability, ensuring stable performance under varying operating conditions.

Terminal Finish: TIN

The tin terminal finish provides excellent solderability and corrosion resistance, enhancing the overall durability and lifespan of the FET.

Maximum Drain-Source On Resistance: 0.099 ohm

The low on-resistance of 0.099 ohm minimizes power losses and heat generation, making this FET energy-efficient for high-power applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and contributes to a more compact and space-efficient layout on the PCB.

Case Connection: ISOLATED

The isolated case connection prevents electrical interference and ensures reliable operation in circuits with different potential levels, enhancing overall safety and stability.

Technical Specifications

Power Field Effect Transistors (FET) IPA65R099C6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

845 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

115 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA65R099C6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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