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IPA60R060C7XKSA1

Infineon Technologies

IPA60R060C7XKSA1 by Infineon Technologies

Infineon's IPA60R060C7XKSA1 is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a 135A IDM and 0.06 ohm RDS(on), it operates in ENHANCEMENT MODE. The transistor's SILICON element and 159mJ EAS make it suitable for high-power tasks.

Median Price

$5.875

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 224 parts In-Stock

1+ parts

$7.550

100+ parts

$4.890

1k+ parts

$3.850

10k+ parts

-

224

$7.550

$4.890

$3.850

-

DigiKey

USA . 196 parts In-Stock

1+ parts

$7.890

100+ parts

$3.928

1k+ parts

$3.364

10k+ parts

-

196

$7.890

$3.928

$3.364

-

Rochester

USA . 28,500 parts In-Stock

1+ parts

-

100+ parts

$3.360

1k+ parts

$3.010

10k+ parts

$2.830

28,500

-

$3.360

$3.010

$2.830

Verical

USA . 28,500 parts In-Stock

1+ parts

-

100+ parts

$4.200

1k+ parts

$3.763

10k+ parts

$3.538

28,500

-

$4.200

$3.763

$3.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 286 parts In-Stock

1+ parts

$3.316

100+ parts

-

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286

$3.316

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Vyrian

USA . 5,140 parts In-Stock

1+ parts

-

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5,140

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Nova Conductors

Japan . 100 parts In-Stock

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-

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,226 parts In-Stock

1+ parts

$0.784

100+ parts

$0.753

1k+ parts

$0.721

10k+ parts

-

22,226

$0.784

$0.753

$0.721

-

Aztec Data Supply Inc.

USA . 372 parts In-Stock

1+ parts

$1.090

100+ parts

-

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-

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372

$1.090

-

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Corohmni

South Africa . 975 parts In-Stock

1+ parts

$1.732

100+ parts

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975

$1.732

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Ampacity Inc.

Singapore . 14,076 parts In-Stock

1+ parts

$2.970

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-

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14,076

$2.970

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Corphita

USA . 53 parts In-Stock

1+ parts

$3.141

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53

$3.141

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Microchip USA

USA . 2,184 parts In-Stock

1+ parts

$17.349

100+ parts

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2,184

$17.349

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Lixinc

USA . 7,278 parts In-Stock

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7,278

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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Continental Prestige Electronics

USA . 4,232 parts In-Stock

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4,232

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Argo Parts USA

USA . 3,043 parts In-Stock

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3,043

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Perfect Parts

USA . 616 parts In-Stock

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616

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unlock the power of the IPA60R060C7XKSA1 from Infineon Technologies, a high-quality N-CHANNEL Power FET that offers unparalleled performance in switching applications. With a robust design and built-in diode, this transistor delivers reliable operation and enhanced efficiency. Whether you're looking to optimize your power supply or improve motor control systems, this transistor's 600V DS breakdown voltage and low on resistance of just 0.06 ohm make it the perfect solution for your needs. Trust in Infineon's expertise and experience in semiconductor technology to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances the durability of the transistor while keeping the overall weight low.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel transistors, making this product a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient current flow and protection against reverse voltage, making this transistor suitable for various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and reliability in controlling electrical signals.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage ensures that the transistor can handle high voltage levels without failure, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easier mounting and integration into electronic circuits, providing convenience in assembly and maintenance.

Terminal Form: THROUGH-HOLE

The through-hole terminals facilitate easy soldering and secure connection to circuit boards, ensuring reliable performance in various operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the flow of current, providing precise switching capabilities for improved efficiency in electronic circuits.

Maximum Pulsed Drain Current (IDM): 135 A

The high pulsed drain current rating allows the transistor to handle sudden current surges, making it suitable for demanding applications that require high power delivery.

Avalanche Energy Rating (EAS): 159 mJ

The high avalanche energy rating indicates the ability of the transistor to withstand voltage spikes and transient events, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 3

With three terminals, this transistor offers versatile connectivity options for different circuit configurations, enhancing its compatibility with various electronic systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and secure attachment to heat sinks or mounting surfaces, enabling efficient heat dissipation for improved thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high efficiency and reliability in signal amplification and switching applications, making this transistor a suitable choice for demanding electronic circuits.

Transistor Element Material: SILICON

Silicon-based transistors are known for their high performance, low power consumption, and reliability, making this product a preferred choice for critical electronic applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability and stable performance in various environmental conditions.

Maximum Drain Current (ID): 16 A

The high maximum drain current rating allows the transistor to handle large current flows, making it suitable for high-power applications that require efficient current control.

Maximum Drain-Source On Resistance: 0.06 ohm

The low drain-source on resistance minimizes power loss and heat dissipation, improving the overall efficiency and performance of the transistor in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies the connectivity and installation process, providing ease of use and convenience in integrating the transistor into electronic circuits.

Case Connection: ISOLATED

The isolated case connection enhances safety and prevents short circuits in the transistor, ensuring reliable operation and protection against electrical faults.

Technical Specifications

Power Field Effect Transistors (FET) IPA60R060C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

159 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

135 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA60R060C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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