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FCPF36N60NT

Onsemi

FCPF36N60NT by Onsemi

FCPF36N60NT by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a single configuration with built-in diode and can handle up to 108A IDM pulsed drain current. Operating in ENHANCEMENT MODE, this transistor has 0.09 ohm Drain-Source On Resistance and operates at a max temperature of 150 °C.

Median Price

$5.810

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,952 parts In-Stock

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-

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$5.170

1k+ parts

$4.620

10k+ parts

$4.350

5,952

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$5.170

$4.620

$4.350

Verical

USA . 242 parts In-Stock

1+ parts

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$6.450

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$5.775

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$5.425

242

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$6.450

$5.775

$5.425

Distributors (In-Stock)

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Digiode

USA . 1,208 parts In-Stock

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$5.462

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$5.462

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Vyrian

USA . 1,215 parts In-Stock

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$5.750

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$5.750

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Flip Electronics

USA . 7,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 586 parts In-Stock

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Bristol Electronics

USA . 586 parts In-Stock

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$2.195

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$1.929

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586

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$1.929

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Dan-Mar Components

USA . 586 parts In-Stock

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586

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DigiKey Marketplace

USA . 67 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Corphita

USA . 894 parts In-Stock

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$5.175

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$5.175

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Corohmni

South Africa . 490 parts In-Stock

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$5.750

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Native Components

USA . 645 parts In-Stock

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$12.454

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645

$12.454

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Northwest PG Solutions

USA . 1,422 parts In-Stock

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$13.699

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$12.329

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$13.699

$12.329

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Microchip USA

USA . 2,524 parts In-Stock

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$15.456

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QUARKTWIN TECHNOLOGY LTD

USA . 19,483 parts In-Stock

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Metaverse IC Inc.

Canada . 17,672 parts In-Stock

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TANS Electronics

Latvia . 6,312 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 2,105 parts In-Stock

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Supply Digital

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Problanco Electronics

Mexico . 500 parts In-Stock

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SupplyDigital Components

Austria . 423 parts In-Stock

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UHIMA Technologies

Türkiye . 231 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 50 parts In-Stock

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Overview

Discover the power of the FCPF36N60NT by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers reliable performance and efficiency. Whether you're looking to enhance your electronic projects or streamline your power systems, this transistor delivers exceptional value and benefits. Trust in Onsemi's reputation for excellence and unlock the potential of the FCPF36N60NT for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, allowing for faster switching speeds and lower resistance, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the FET from voltage spikes and reverse currents, improving reliability and performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient control of power flow and minimizing energy loss.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows for handling of high-power applications without risk of damage or failure.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and integrate into electronic circuits, saving space and facilitating installation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, reducing the risk of disconnection or malfunction.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, allowing for precise adjustment of power flow in the circuit.

Maximum Pulsed Drain Current (IDM): 108 A

High pulsed drain current rating enables the FET to handle short-duration high-power loads without overheating or damage.

Avalanche Energy Rating (EAS): 1800 mJ

A high avalanche energy rating means the FET can withstand high-energy spikes and surges, ensuring reliable operation in harsh conditions.

Maximum Drain Current (Abs) (ID): 36 A

The high maximum drain current rating allows for handling of high current loads, making it suitable for power applications.

No. of Terminals: 3

Having three terminals allows for easy connection to the circuit, providing a complete electrical path for current flow.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and thermal conductivity, ensuring efficient heat dissipation for the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, suitable for demanding power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the FET can withstand elevated temperatures without degradation of performance, ensuring reliable operation in hot environments.

Transistor Element Material: SILICON

Silicon material offers high efficiency, low resistance, and good thermal conductivity, making it a popular choice for power FETs.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable and low-resistance contact surface, ensuring optimal electrical conductivity for the FET.

Maximum Drain-Source On Resistance: 0.09 ohm

Low drain-source on resistance results in minimal power loss and heat generation when the FET is conducting, improving efficiency and performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, ensuring correct orientation and alignment for easy integration into the circuit.

Case Connection: ISOLATED

Isolated case connection prevents electrical interference and ensures safety in the circuit, reducing the risk of short circuits or malfunctions.

Technical Specifications

Power Field Effect Transistors (FET) FCPF36N60NT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1800 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

108 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF36N60NT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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