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FCPF11N60T

Onsemi

FCPF11N60T by Onsemi

FCPF11N60T by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max ID of 11A, 0.38 ohm Drain-Source Resistance, and an EAS of 340mJ. This METAL-OXIDE SEMICONDUCTOR transistor operates in ENHANCEMENT MODE at up to 150°C temperature.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 547 parts In-Stock

1+ parts

$1.690

100+ parts

$1.660

1k+ parts

$1.620

10k+ parts

-

547

$1.690

$1.660

$1.620

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DigiKey

USA . 907 parts In-Stock

1+ parts

$4.490

100+ parts

$2.099

1k+ parts

$1.611

10k+ parts

$1.584

907

$4.490

$2.099

$1.611

$1.584

Future Electronics

Canada . 9,950 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.500

10k+ parts

$1.480

9,950

-

$1.550

$1.500

$1.480

EBV Elektronik

Germany . 1,000 parts In-Stock

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1,000

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$1.905

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10

$1.905

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Digiode

USA . 2,298 parts In-Stock

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$4.142

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2,298

$4.142

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Chip Stock

USA . 91,200 parts In-Stock

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91,200

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Vyrian

USA . 19,934 parts In-Stock

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19,934

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Flip Electronics

USA . 18,000 parts In-Stock

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18,000

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IBS Electronics

USA . 9,900 parts In-Stock

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$2.132

1k+ parts

$2.062

10k+ parts

$2.020

9,900

-

$2.132

$2.062

$2.020

Magnum Semiconductors LLP

India . 7,100 parts In-Stock

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7,100

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NAC Semi

USA . 1,600 parts In-Stock

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$8.070

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$7.450

1,600

-

$8.070

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$7.450

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 942 parts In-Stock

1+ parts

$0.593

100+ parts

-

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942

$0.593

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Ampacity Inc.

Singapore . 19,492 parts In-Stock

1+ parts

$1.350

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19,492

$1.350

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Semicontronic

India . 5,014 parts In-Stock

1+ parts

$1.350

100+ parts

$1.316

1k+ parts

$1.310

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5,014

$1.350

$1.316

$1.310

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Corohmni

South Africa . 170 parts In-Stock

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$1.680

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170

$1.680

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Continental Prestige Electronics

USA . 4,462 parts In-Stock

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$1.905

100+ parts

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$1.867

4,462

$1.905

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-

$1.867

Argo Parts USA

USA . 1,676 parts In-Stock

1+ parts

$1.905

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1,676

$1.905

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Component Stockers USA

USA . 559 parts In-Stock

1+ parts

$3.340

100+ parts

$2.270

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559

$3.340

$2.270

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Corphita

USA . 1,161 parts In-Stock

1+ parts

$3.924

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1,161

$3.924

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,543 parts In-Stock

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8,543

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TANS Electronics

Latvia . 6,607 parts In-Stock

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Microchip USA

USA . 6,376 parts In-Stock

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Problanco Electronics

Mexico . 6,285 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Supply Digital

USA . 2,623 parts In-Stock

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2,623

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Kulean Microsystems

USA . 1,679 parts In-Stock

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1,679

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SupplyDigital Components

Austria . 1,086 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.867

1k+ parts

$1.810

10k+ parts

$1.772

500

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$1.867

$1.810

$1.772

UHIMA Technologies

Türkiye . 457 parts In-Stock

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457

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Andel Nordic

Denmark . 195 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the Onsemi FCPF11N60T Power Field Effect Transistor. Manufactured by the reputable Onsemi, this N-CHANNEL transistor offers superior quality and reliability. Ideal for switching applications, it provides a minimum DS breakdown voltage of 600V and a maximum pulsed drain current of 33A. With a compact rectangular package shape and through-hole terminals, this transistor is easy to integrate into your designs. Trust in the expertise of Onsemi and experience the value and benefits that the FCPF11N60T brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY -

The use of plastic/epoxy material makes this FET lightweight and durable, ideal for applications where weight is a concern.

Polarity or Channel Type: N-CHANNEL -

N-channel FETs are known for their high efficiency and fast switching speeds, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE -

The built-in diode simplifies circuit design and provides reverse voltage protection, making this FET a versatile choice for various applications.

Transistor Application: SWITCHING -

Designed for switching applications, this FET offers low on-resistance and high current handling capabilities, making it reliable for switching tasks.

Minimum DS Breakdown Voltage: 600 V -

With a high breakdown voltage of 600V, this FET can withstand high voltage levels, making it suitable for industrial and power supply applications.

Package Shape: RECTANGULAR -

The rectangular shape allows for easy mounting and efficient use of space in a circuit layout, making this FET convenient for compact designs.

Terminal Form: THROUGH-HOLE -

The through-hole terminals provide a secure mechanical connection and ease of soldering, ensuring a reliable electrical connection in applications.

Operating Mode: ENHANCEMENT MODE -

The enhancement mode operation offers precise control over the FET's conductivity, allowing for efficient power management in various applications.

Maximum Pulsed Drain Current (IDM): 33 A -

With a high pulse drain current rating of 33A, this FET can handle short bursts of high current, making it suitable for power electronics and motor control applications.

Avalanche Energy Rating (EAS): 340 mJ -

The high avalanche energy rating of 340mJ ensures reliable operation in rugged environments, making this FET ideal for applications with high voltage spikes.

No. of Terminals: 3 -

The three terminals provide easy connectivity and flexibility in circuit design, making this FET versatile and suitable for various applications.

Technical Specifications

Power Field Effect Transistors (FET) FCPF11N60T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF11N60T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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