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FCPF190N60E-F152

Onsemi

FCPF190N60E-F152 by Onsemi

FCPF190N60E-F152 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features 61.8A Max Pulsed Drain Current and 400mJ Avalanche Energy Rating, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it has a max power dissipation of 39W and operates b/w -55 to 150 °C temperature range.

Median Price

$1.513

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 92 parts In-Stock

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Vyrian

USA . 3,563 parts In-Stock

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Digiode

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Aranea Global

USA . 1,000 parts In-Stock

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$1.483

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$1.423

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Corohmni

South Africa . 406 parts In-Stock

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Argo Parts USA

USA . 8,506 parts In-Stock

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Continental Prestige Electronics

USA . 7,322 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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AZTECH Wire

Italy . 1,133 parts In-Stock

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$6.325

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Ampacity Inc.

Singapore . 1,269 parts In-Stock

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$64.050

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QUARKTWIN TECHNOLOGY LTD

USA . 12,547 parts In-Stock

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Problanco Electronics

Mexico . 4,151 parts In-Stock

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SupplyDigital Components

Austria . 3,819 parts In-Stock

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TANS Electronics

Latvia . 2,017 parts In-Stock

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Corphita

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Supply Digital

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 194 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of the FCPF190N60E-F152 by Onsemi, a high-quality Power Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this N-Channel transistor is perfect for switching applications with its built-in diode configuration. With a maximum breakdown voltage of 600V and a pulsing drain current of 61.8A, this transistor delivers exceptional power and efficiency. Whether you're looking to enhance your electronics or boost your system's performance, the FCPF190N60E-F152 is the perfect choice. Upgrade your projects today with this cutting-edge transistor from Onsemi!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal conductivity and protection for the internal components, ensuring durability and longevity.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenience of having a built-in diode simplifies circuit design and saves space in the overall system.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage allows for reliable operation in high voltage applications, making it a dependable choice.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the transistor's conductivity, enabling efficient switching.

Maximum Power Dissipation (Abs): 39 W

High power dissipation capability ensures the transistor can handle high power environments without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for operation in harsh environments, increasing the versatility of the product.

Technical Specifications

Power Field Effect Transistors (FET) FCPF190N60E-F152 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20.6 A

Maximum Drain Current (ID):

20.6 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

165 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

61.8 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

252 ns

Maximum Turn On Time (ton):

94 ns

Trade Compliance

FCPF190N60E-F152 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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