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FCPF190N60E-F154

Onsemi

FCPF190N60E-F154 by Onsemi

FCPF190N60E-F154 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 61.8A IDM and 0.19 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 39W and can handle up to 150°C operating temperature.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$5.000

100+ parts

$2.366

1k+ parts

$1.832

10k+ parts

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1,000

$5.000

$2.366

$1.832

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Mouser Electronics

USA . 1,000 parts In-Stock

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$5.000

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$2.370

1k+ parts

$2.100

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1,000

$5.000

$2.370

$2.100

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Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.840

1k+ parts

$1.650

10k+ parts

$1.550

5,000

-

$1.840

$1.650

$1.550

Flip Electronics (Authorized)

USA . 1,000 parts In-Stock

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Digiode

USA . 534 parts In-Stock

1+ parts

$1.938

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534

$1.938

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Nova Conductors

Japan . 50 parts In-Stock

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$2.198

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50

$2.198

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Vyrian

USA . 7,607 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,105 parts In-Stock

1+ parts

$1.730

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2,105

$1.730

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Corphita

USA . 83 parts In-Stock

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$1.836

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83

$1.836

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Corohmni

South Africa . 365 parts In-Stock

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$2.040

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365

$2.040

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Argo Parts USA

USA . 4,374 parts In-Stock

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$2.198

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4,374

$2.198

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Continental Prestige Electronics

USA . 1,387 parts In-Stock

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$2.198

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$2.154

1,387

$2.198

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$2.154

QUARKTWIN TECHNOLOGY LTD

USA . 27,737 parts In-Stock

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27,737

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Microchip USA

USA . 7,806 parts In-Stock

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TANS Electronics

Latvia . 5,559 parts In-Stock

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Kulean Microsystems

USA . 3,193 parts In-Stock

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Problanco Electronics

Mexico . 1,157 parts In-Stock

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1,157

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UHIMA Technologies

Türkiye . 601 parts In-Stock

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601

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SupplyDigital Components

Austria . 442 parts In-Stock

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Overview

Enhance your electronic projects with the FCPF190N60E-F154 Power Field Effect Transistor by Onsemi. With a high-quality design and reliable performance, this N-CHANNEL FET is perfect for switching applications. Its single configuration with built-in diode offers convenience and efficiency. From its impressive 600V DS Breakdown Voltage to its 400mJ Avalanche Energy Rating, this transistor delivers power and reliability in every use. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the FCPF190N60E-F154. Experience the value and benefits of this cutting-edge component today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, ensuring long-term performance and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for a wide range of applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage at the gate to turn on, which provides better control over switching operations.

Maximum Pulsed Drain Current (IDM): 61.8 A

The high pulsed drain current rating allows the transistor to handle high current spikes without damage, making it suitable for switching applications with varying loads.

Maximum Power Dissipation (Abs): 39 W

The high power dissipation rating ensures the FET can handle heat dissipation effectively, preventing overheating and ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in harsh environments without degrading performance, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) FCPF190N60E-F154 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

20.6 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

165 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

61.8 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

252 ns

Maximum Turn On Time (ton):

94 ns

Trade Compliance

FCPF190N60E-F154 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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