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FCPF260N65FL1

Onsemi

FCPF260N65FL1 by Onsemi

FCPF260N65FL1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage, 45A IDM, and 0.26 ohm RDS(ON). Ideal for SWITCHING applications due to its 293mJ EAS rating. Package: PLASTIC/EPOXY RECTANGULAR with THROUGH-HOLE terminals.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,523 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.200

10k+ parts

$1.070

3,523

-

$1.450

$1.200

$1.070

DigiKey

USA . 3,523 parts In-Stock

1+ parts

-

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$1.810

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3,523

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$1.810

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Verical

USA . 2,000 parts In-Stock

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$1.500

10k+ parts

$1.337

2,000

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$1.500

$1.337

Farnell

UK . 530 parts In-Stock

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$0.830

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530

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$0.830

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Distributors (In-Stock)

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Vyrian

USA . 785 parts In-Stock

1+ parts

$0.830

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-

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785

$0.830

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Digiode

USA . 3,176 parts In-Stock

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$1.130

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3,176

$1.130

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Distributors (Availability)

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Corohmni

South Africa . 315 parts In-Stock

1+ parts

$0.830

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-

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315

$0.830

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Corphita

USA . 1,577 parts In-Stock

1+ parts

$1.071

100+ parts

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1,577

$1.071

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Component Stockers USA

USA . 486 parts In-Stock

1+ parts

$1.240

100+ parts

$1.160

1k+ parts

$1.050

10k+ parts

-

486

$1.240

$1.160

$1.050

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Ampacity Inc.

Singapore . 1,305 parts In-Stock

1+ parts

$1.540

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1,305

$1.540

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,349 parts In-Stock

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14,349

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TANS Electronics

Latvia . 6,363 parts In-Stock

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Problanco Electronics

Mexico . 6,144 parts In-Stock

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Microchip USA

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,404 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,523 parts In-Stock

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$0.830

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3,523

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$0.830

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Supply Digital

USA . 2,251 parts In-Stock

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Kepictronics

USA . 2,200 parts In-Stock

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2,200

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SupplyDigital Components

Austria . 981 parts In-Stock

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981

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Native Components

USA . 848 parts In-Stock

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848

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Northwest PG Solutions

USA . 616 parts In-Stock

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UHIMA Technologies

Türkiye . 36 parts In-Stock

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36

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Overview

Experience the next level of power efficiency and reliability with the FCPF260N65FL1 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a breakthrough in technology and design, this N-CHANNEL transistor ensures seamless operation and enhanced functionality. Say goodbye to inefficiencies and hello to optimized power management with this innovative product. Upgrade your systems today and witness the difference that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the FET durable and reliable in various operating environments.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and allows for easier integration into systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and operation.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage provides protection against voltage spikes and overloads, enhancing the reliability of the FET.

Maximum Pulsed Drain Current (IDM): 45 A

High pulsed current rating allows for handling of peak loads without damage or performance degradation.

Maximum Drain Current (Abs) (ID): 15 A

Sufficient continuous drain current rating for various applications, ensuring reliable operation.

Maximum Power Dissipation (Abs): 36 W

Ability to dissipate high power levels without overheating, contributing to the overall reliability of the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Modern and efficient technology providing high performance and reliability in various applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for use in diverse environments and applications.

Maximum Turn On Time (ton): 86 ns

Fast turn-on time ensures quick response and switching characteristics in the circuit.

Maximum Turn Off Time (toff): 140 ns

Fast turn-off time helps in reducing switching losses and improving efficiency of the FET.

Maximum Drain-Source On Resistance: 0.26 ohm

Low on-resistance minimizes power losses and helps in efficient power delivery.

Technical Specifications

Power Field Effect Transistors (FET) FCPF260N65FL1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

293 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

36 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

140 ns

Maximum Turn On Time (ton):

86 ns

Trade Compliance

FCPF260N65FL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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