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IKW50N65EH5XKSA1

Infineon Technologies

IKW50N65EH5XKSA1 by Infineon Technologies

IKW50N65EH5XKSA1 by Infineon Technologies is an N-CHANNEL IGBT with 650V max collector-emitter voltage and 80A max collector current. It features a single configuration with built-in diode, ideal for power control applications. With a turn-off time of 220ns and turn-on time of 54ns, it offers efficient performance in through-hole package style.

Median Price

$4.935

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 156 parts In-Stock

1+ parts

$0.736

100+ parts

$0.730

1k+ parts

$0.726

10k+ parts

$0.725

156

$0.736

$0.730

$0.726

$0.725

Chip1Stop

Japan . 197 parts In-Stock

1+ parts

$3.010

100+ parts

-

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197

$3.010

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-

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Farnell

UK . 230 parts In-Stock

1+ parts

$4.390

100+ parts

$2.810

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-

10k+ parts

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230

$4.390

$2.810

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Newark

USA . 186 parts In-Stock

1+ parts

$5.480

100+ parts

$3.380

1k+ parts

$2.890

10k+ parts

-

186

$5.480

$3.380

$2.890

-

Mouser Electronics

USA . 290 parts In-Stock

1+ parts

$5.490

100+ parts

$2.570

1k+ parts

$2.380

10k+ parts

-

290

$5.490

$2.570

$2.380

-

DigiKey

USA . 172 parts In-Stock

1+ parts

$5.490

100+ parts

$3.093

1k+ parts

$2.178

10k+ parts

$2.076

172

$5.490

$3.093

$2.178

$2.076

Verical

USA . 156 parts In-Stock

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-

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156

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Digiode

USA . 252 parts In-Stock

1+ parts

$2.613

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-

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252

$2.613

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 1,995 parts In-Stock

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1,995

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Distributors (Availability)

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Corphita

USA . 590 parts In-Stock

1+ parts

$2.476

100+ parts

-

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590

$2.476

-

-

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Modulus Dynamics

Lithuania . 8,485 parts In-Stock

1+ parts

$3.664

100+ parts

$3.517

1k+ parts

$3.371

10k+ parts

-

8,485

$3.664

$3.517

$3.371

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Microchip USA

USA . 4,601 parts In-Stock

1+ parts

$21.084

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4,601

$21.084

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QUARKTWIN TECHNOLOGY LTD

USA . 19,401 parts In-Stock

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19,401

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GreenTree Electronics

Israel . 14,400 parts In-Stock

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14,400

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Perfect Parts

USA . 1,093 parts In-Stock

1+ parts

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1,093

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iodParts Technologies Inc.

India . 188 parts In-Stock

1+ parts

-

100+ parts

$3.650

1k+ parts

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10k+ parts

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188

-

$3.650

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Overview

Unlock the power of efficiency and reliability with the IKW50N65EH5XKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With a maximum collector-emitter voltage of 650V and a nominal turn-off time of 220ns, this N-channel transistor offers superior performance and durability. Say goodbye to downtime and hello to seamless operations with the IKW50N65EH5XKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the IGBT, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speeds compared to P-channel IGBTs, making them efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for freewheeling current to bypass the IGBT during switching, improving efficiency and reducing stress on the device.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is optimized for handling high power levels efficiently and accurately.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in various electronic systems and circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection for external circuitry, enhancing the overall performance and stability of the IGBT.

Nominal Turn Off Time (toff): 220 ns

The fast turn-off time of 220 ns ensures quick switching and minimal power losses during operation, improving overall efficiency and performance.

No. of Terminals: 3

Having 3 terminals allows for easy integration into circuit designs and provides flexibility in connecting external components for complete power control.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers a secure and stable mounting option for industrial applications, ensuring reliable operation in harsh environments.

Maximum Collector-Emitter Voltage: 650 V

With a high maximum collector-emitter voltage of 650 V, this IGBT can handle high power levels and voltages, making it suitable for demanding power control tasks.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high performance, reliability, and efficiency, making this IGBT a durable and long-lasting choice for power control applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C allows for reliable performance in harsh environmental conditions, making this IGBT suitable for a wide range of applications.

Maximum Collector Current (IC): 80 A

With a maximum collector current of 80 A, this IGBT can handle high power levels and currents, making it ideal for demanding power control tasks in industrial settings.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures a reliable electrical connection, enhancing the overall performance and longevity of the IGBT.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and integration of the IGBT into circuit designs, making it easy to use in various power control applications.

Case Connection: COLLECTOR

The case connection to the collector allows for efficient heat dissipation and improved thermal management, ensuring reliable and stable operation even under high power loads.

Nominal Turn On Time (ton): 54 ns

The fast turn-on time of 54 ns ensures quick response and efficient switching, reducing power losses and improving the overall performance of the IGBT in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW50N65EH5XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

220 ns

Nominal Turn On Time (ton):

54 ns

Trade Compliance

IKW50N65EH5XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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