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IGP30N65H5XKSA1

Infineon Technologies

IGP30N65H5XKSA1 by Infineon Technologies

Infineon's IGP30N65H5XKSA1 is an N-CHANNEL IGBT with 650V VCE, 55A IC, and 224ns toff. Ideal for POWER CONTROL applications, it features a SINGLE configuration in a PLASTIC/EPOXY package with THROUGH-HOLE terminals.

Median Price

$1.312

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 990 parts In-Stock

1+ parts

$1.400

100+ parts

$0.963

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990

$1.400

$0.963

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Arrow

USA . 490 parts In-Stock

1+ parts

$2.478

100+ parts

$1.208

1k+ parts

$0.904

10k+ parts

$0.806

490

$2.478

$1.208

$0.904

$0.806

Rochester

USA . 7,340 parts In-Stock

1+ parts

-

100+ parts

$1.180

1k+ parts

$0.979

10k+ parts

$0.873

7,340

-

$1.180

$0.979

$0.873

Verical

USA . 4,916 parts In-Stock

1+ parts

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100+ parts

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$1.224

10k+ parts

$1.091

4,916

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-

$1.224

$1.091

Distributors (In-Stock)

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Digiode

USA . 127 parts In-Stock

1+ parts

$1.330

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127

$1.330

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Vyrian

USA . 93 parts In-Stock

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$1.400

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93

$1.400

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Schukat

Germany . 472 parts In-Stock

1+ parts

$3.698

100+ parts

$2.123

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472

$3.698

$2.123

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-

IBS Electronics

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$1.557

1k+ parts

$1.515

10k+ parts

$1.473

150

-

$1.557

$1.515

$1.473

Nova Conductors

Japan . 63 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 561 parts In-Stock

1+ parts

$1.260

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561

$1.260

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Corohmni

South Africa . 15 parts In-Stock

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$1.352

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15

$1.352

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Component Stockers USA

USA . 14,081 parts In-Stock

1+ parts

$1.690

100+ parts

$1.690

1k+ parts

$1.300

10k+ parts

-

14,081

$1.690

$1.690

$1.300

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Modulus Dynamics

Lithuania . 10,299 parts In-Stock

1+ parts

$1.884

100+ parts

$1.809

1k+ parts

$1.733

10k+ parts

-

10,299

$1.884

$1.809

$1.733

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Ampacity Inc.

Singapore . 2,487 parts In-Stock

1+ parts

$2.590

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$2.590

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Microchip USA

USA . 7,514 parts In-Stock

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$12.673

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$12.673

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Lixinc

USA . 8,738 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,954 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,636 parts In-Stock

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Continental Prestige Electronics

USA . 3,590 parts In-Stock

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Perfect Parts

USA . 1,848 parts In-Stock

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1,848

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Aranea Global

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 381 parts In-Stock

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GreenTree Electronics

Israel . 67 parts In-Stock

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Overview

Unleash the power of innovation with the IGP30N65H5XKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. This N-Channel transistor offers exceptional performance and reliability, with a maximum collector-emitter voltage of 650V and a collector current of 55A. Its fast turn-on and turn-off times ensure efficient power management, making it ideal for a wide range of electronic devices. Elevate your projects with the IGP30N65H5XKSA1 and experience the difference Infineon Technologies can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and durability, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-Channel types.

Configuration: SINGLE

Simplifies circuit design and makes it easier to integrate into existing systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in such scenarios.

Package Shape: RECTANGULAR

Provides a compact and efficient physical form factor for easy mounting and handling.

Terminal Form: THROUGH-HOLE

Allows for easy and secure connections on circuit boards or other components.

Nominal Turn Off Time (toff): 224 ns

Fast turn-off time helps to reduce power losses and improve efficiency in power control applications.

No. of Terminals: 3

Simplified terminal configuration for easier integration into circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting options in various systems.

Maximum Collector-Emitter Voltage: 650 V

Can handle relatively high voltage levels, suitable for power control applications.

Transistor Element Material: SILICON

Silicon-based elements provide good performance and reliability in power control applications.

Minimum Operating Temperature: -40 °C

Capable of operating in a wide range of temperatures, making it suitable for various environments and conditions.

Maximum Collector Current (IC): 55 A

Can handle high current levels, suitable for power control applications that require higher current handling.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and corrosion resistance for reliable connections.

Terminal Position: SINGLE

Simplified terminal configuration for easier integration into circuits.

Case Connection: COLLECTOR

Collector case connection provides a reliable and efficient connection for power control applications.

Nominal Turn On Time (ton): 28 ns

Fast turn-on time helps to improve switching speed and efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGP30N65H5XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

224 ns

Nominal Turn On Time (ton):

28 ns

Trade Compliance

IGP30N65H5XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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