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FZ3600R17HP4HOSA2

Infineon Technologies

FZ3600R17HP4HOSA2 by Infineon Technologies

FZ3600R17HP4HOSA2 by Infineon Technologies is an N-CHANNEL IGBT with 3 elements, max. Vce of 1700V, and ton of 1075ns. It is used for POWER CONTROL applications due to its complex configuration and isolated case connection in a rectangular package style.

Median Price

$1,655.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 37 parts In-Stock

1+ parts

$1,248.775

100+ parts

-

1k+ parts

-

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37

$1,248.775

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TME

Poland . 40 parts In-Stock

1+ parts

$1,655.110

100+ parts

-

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-

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-

40

$1,655.110

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-

-

NAC Semi

USA . 32 parts In-Stock

1+ parts

$3,620.170

100+ parts

$3,258.160

1k+ parts

-

10k+ parts

-

32

$3,620.170

$3,258.160

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-

Vyrian

USA . 3,761 parts In-Stock

1+ parts

-

100+ parts

-

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3,761

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 296 parts In-Stock

1+ parts

$0.735

100+ parts

-

1k+ parts

-

10k+ parts

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296

$0.735

-

-

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Modulus Dynamics

Lithuania . 20,747 parts In-Stock

1+ parts

$1.766

100+ parts

$1.695

1k+ parts

$1.625

10k+ parts

-

20,747

$1.766

$1.695

$1.625

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Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$1,117.330

100+ parts

-

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2

$1,117.330

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Corphita

USA . 680 parts In-Stock

1+ parts

$1,183.050

100+ parts

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680

$1,183.050

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Component Stockers USA

USA . 3 parts In-Stock

1+ parts

$1,329.430

100+ parts

-

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3

$1,329.430

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Microchip USA

USA . 3,573 parts In-Stock

1+ parts

$1,399.130

100+ parts

-

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3,573

$1,399.130

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Argo Parts USA

USA . 4,814 parts In-Stock

1+ parts

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4,814

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Continental Prestige Electronics

USA . 1,250 parts In-Stock

1+ parts

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1,250

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Elevate your power control capabilities with the FZ3600R17HP4HOSA2 by Infineon Technologies. As a leading manufacturer in insulated gate bipolar transistors, Infineon delivers unmatched quality and reliability in every product. This N-CHANNEL transistor with complex configuration is designed for a variety of applications, offering superior performance and efficiency. With a maximum collector-emitter voltage of 1700 V and fast turn-on/off times, this transistor provides exceptional power control for your projects. Trust Infineon to deliver cutting-edge technology that drives your success.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making this product suitable for power control applications.

Configuration: COMPLEX

Complex configurations provide enhanced performance and better control over power management, making this IGBT ideal for complex power control systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers reliable performance and precise power management capabilities.

Package Shape: RECTANGULAR

Rectangular packages are compatible with standard mounting systems and offer efficient heat dissipation, ensuring reliable operation in various applications.

Nominal Turn Off Time (toff): 2095 ns

With a turn-off time of 2095 ns, this IGBT provides efficient switching and reliable power management, enhancing overall system performance.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and allows for easy integration into power control circuits.

Maximum Collector-Emitter Voltage: 1700 V

With a high collector-emitter voltage rating of 1700 V, this IGBT is capable of handling high-power applications and voltages, ensuring long-term reliability.

Transistor Element Material: SILICON

Silicon-based IGBTs offer excellent thermal performance and reliability, making them suitable for demanding power control applications.

Terminal Position: UPPER

Having the terminals positioned at the upper end simplifies the layout and allows for efficient heat dissipation, improving overall system performance.

Case Connection: ISOLATED

An isolated case connection ensures safety and prevents electrical interference, making this IGBT suitable for applications where isolation is critical.

Nominal Turn On Time (ton): 1075 ns

With a fast turn-on time of 1075 ns, this IGBT enables quick and efficient power switching, enhancing system responsiveness and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ3600R17HP4HOSA2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1700 V

Configuration:

JESD-30 Code:

R-XUFM-X3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

3

No. of Terminals:

3

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

2095 ns

Nominal Turn On Time (ton):

1075 ns

Trade Compliance

FZ3600R17HP4HOSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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