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FS75R07N2E4B11BOSA1

Infineon Technologies

FS75R07N2E4B11BOSA1 by Infineon Technologies

Infineon FS75R07N2E4B11BOSA1 is a N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max voltage of 650V and turn off time of 320ns. Ideal for power control applications, UL approved with flange mount package style.

Median Price

$62.210

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$62.210

1k+ parts

$55.660

10k+ parts

$52.380

3

-

$62.210

$55.660

$52.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 788 parts In-Stock

1+ parts

$65.826

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788

$65.826

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Vyrian

USA . 4,315 parts In-Stock

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4,315

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Distributors (Availability)

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Native Components

USA . 884 parts In-Stock

1+ parts

$0.074

100+ parts

-

1k+ parts

-

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$0.071

884

$0.074

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$0.071

Northwest PG Solutions

USA . 278 parts In-Stock

1+ parts

$0.081

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-

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$0.071

278

$0.081

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$0.071

Modulus Dynamics

Lithuania . 15,397 parts In-Stock

1+ parts

$0.765

100+ parts

$0.734

1k+ parts

$0.704

10k+ parts

-

15,397

$0.765

$0.734

$0.704

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AZTECH Wire

Italy . 260 parts In-Stock

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$15.550

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-

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260

$15.550

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Corphita

USA . 65 parts In-Stock

1+ parts

$62.361

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65

$62.361

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Microchip USA

USA . 4,715 parts In-Stock

1+ parts

$138.862

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4,715

$138.862

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Overview

Unleash the power of the FS75R07N2E4B11BOSA1 from Infineon Technologies, a top-tier manufacturer known for delivering cutting-edge solutions. This Insulated Gate Bipolar Transistor (IGBT) is designed for power control applications, offering unmatched performance and reliability. With its N-CHANNEL polarity and 6-element configuration with built-in diode and thermistor, this device ensures seamless operation and maximum efficiency. Whether you're in need of precision control or high-power applications, this IGBT is the perfect choice. Elevate your projects with the quality and value that only Infineon Technologies can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their higher conductivity and faster switching speed, making them suitable for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration allows for easier integration into power control systems, while the built-in diode and thermistor provide additional protection and functionality.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance in managing power flow.

No. of Elements: 6

Having 6 elements increases the power handling capability of the IGBT, making it suitable for high power applications.

Nominal Turn Off Time (toff): 320 ns

The fast turn-off time of 320 ns results in efficient switching and low power loss, improving overall performance and energy efficiency.

No. of Terminals: 25

The 25 terminals provide ample connectivity options for integration into complex power control systems or circuits.

Maximum Collector-Emitter Voltage: 650 V

The high collector-emitter voltage rating of 650 V allows for usage in high voltage applications without risk of damage.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stability and durability in operation.

Nominal Turn On Time (ton): 45 ns

The fast turn-on time of 45 ns allows for quick response and precise control in power switching applications.

Reference Standard: UL APPROVED

Having UL approval indicates that the product meets safety and quality standards, providing assurance of reliability and compliance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS75R07N2E4B11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

650 V

JESD-30 Code:

R-XUFM-X25

No. of Elements:

6

No. of Terminals:

25

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

45 ns

Trade Compliance

FS75R07N2E4B11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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