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BSM75GD120DLC

Infineon Technologies

BSM75GD120DLC by Infineon Technologies

BSM75GD120DLC by Infineon is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It features a VCEsat of 2.6V, IC of 125A, and Pmax of 500W. Ideal for applications requiring high power dissipation and fast switching times like motor drives and inverters.

Median Price

$389.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 3 parts In-Stock

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$257.500

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Galco

USA . 1 parts In-Stock

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$521.450

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1

$521.450

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Vyrian

USA . 915 parts In-Stock

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915

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Digiode

USA . 477 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 80 parts In-Stock

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Corohmni

South Africa . 281 parts In-Stock

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$1.145

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Modulus Dynamics

Lithuania . 25,816 parts In-Stock

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$1.549

100+ parts

$1.487

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$1.425

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25,816

$1.549

$1.487

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Ampacity Inc.

Singapore . 873 parts In-Stock

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$29.050

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873

$29.050

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Component Stockers USA

USA . 2,160 parts In-Stock

1+ parts

$121.630

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$115.550

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$111.900

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2,160

$121.630

$115.550

$111.900

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A-Z Elektronik GmbH

Germany . 5,138 parts In-Stock

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Argo Parts USA

USA . 4,029 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,425 parts In-Stock

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Continental Prestige Electronics

USA . 1,282 parts In-Stock

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Corphita

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover the power and efficiency of the BSM75GD120DLC by Infineon Technologies, a top-tier manufacturer known for their high-quality products. This Insulated Gate Bipolar Transistor (IGBT) in N-CHANNEL configuration features a BRIDGE design with 6 elements and a built-in diode for seamless operation. With a maximum VCEsat of 2.6V and a maximum collector current of 125A, this IGBT offers exceptional performance in various applications. Experience reliable and effective power management with the BSM75GD120DLC, providing you with the value and benefits you need to succeed in your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer lower conduction losses and better efficiency compared to P-CHANNEL IGBTs, making them a preferred choice for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

Having a bridge configuration with built-in diodes simplifies circuit design and allows for easier implementation in various power electronics applications.

Maximum VCEsat: 2.6 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter terminals, leading to lower power dissipation and improved efficiency.

Package Shape: RECTANGULAR

Rectangular packages are easier to handle and mount on circuit boards, enhancing the convenience of integrating these IGBTs into electronic systems.

No. of Elements: 6

Having 6 elements in the IGBT allows for higher power handling capacity and increased reliability in demanding applications.

Nominal Turn Off Time (toff): 420 ns

A fast turn-off time ensures quick switching speeds, reducing power loss and improving overall performance of the IGBT.

Maximum Power Dissipation (Abs): 500 W

With a high maximum power dissipation rating, this IGBT can effectively handle high power levels without risking overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide secure and reliable mechanical mounting, ensuring stability and durability in industrial environments.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance allows for reliable operation in harsh environmental conditions without compromising performance.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating enables this IGBT to handle high voltage levels, making it suitable for a wide range of power applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high reliability, efficiency, and switching speeds, making them a popular choice for power electronics applications.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage rating provides greater flexibility in controlling the IGBT's switching behavior, ensuring precise and efficient operation.

Maximum Collector Current (IC): 125 A

The high collector current rating allows this IGBT to handle large current loads, making it suitable for high-power applications that require robust performance.

Terminal Position: UPPER

Upper terminal position simplifies the connection and integration of the IGBT in circuit layouts, improving overall system efficiency and reliability.

Case Connection: ISOLATED

Having an isolated case connection enhances safety by reducing the risk of short circuits and electrical interference in the circuitry.

Nominal Turn On Time (ton): 110 ns

A fast turn-on time ensures quick activation of the IGBT, facilitating rapid switching and efficient operation in high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) BSM75GD120DLC attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X39

No. of Elements:

6

No. of Terminals:

39

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

420 ns

Nominal Turn On Time (ton):

110 ns

Maximum VCEsat:

2.6 V

Trade Compliance

BSM75GD120DLC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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