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BSC079N03LSCGATMA1

Infineon Technologies

BSC079N03LSCGATMA1 by Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; Additional Features: AVALANCHE RATED, LOGIC LEVEL COMPATIBLE; Maximum Drain-Source On Resistance: .0127 ohm;

Median Price

$0.301

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,000 parts In-Stock

1+ parts

$0.238

100+ parts

$0.224

1k+ parts

$0.213

10k+ parts

$0.210

4,000

$0.238

$0.224

$0.213

$0.210

Farnell

UK . 5,860 parts In-Stock

1+ parts

$0.536

100+ parts

$0.247

1k+ parts

$0.174

10k+ parts

$0.165

5,860

$0.536

$0.247

$0.174

$0.165

Element14

Singapore . 6,153 parts In-Stock

1+ parts

$50.750

100+ parts

-

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6,153

$50.750

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Rochester

USA . 48,136 parts In-Stock

1+ parts

-

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$0.313

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$0.260

10k+ parts

$0.231

48,136

-

$0.313

$0.260

$0.231

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.289

15,000

-

-

-

$0.289

Chip1Stop

Japan . 4,630 parts In-Stock

1+ parts

-

100+ parts

$0.227

1k+ parts

$0.172

10k+ parts

$0.147

4,630

-

$0.227

$0.172

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 497 parts In-Stock

1+ parts

$0.243

100+ parts

-

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497

$0.243

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Vyrian

USA . 6,573 parts In-Stock

1+ parts

-

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6,573

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,364 parts In-Stock

1+ parts

$0.116

100+ parts

-

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6,364

$0.116

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Corphita

USA . 523 parts In-Stock

1+ parts

$0.230

100+ parts

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523

$0.230

-

-

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Modulus Dynamics

Lithuania . 12,208 parts In-Stock

1+ parts

$0.876

100+ parts

$0.841

1k+ parts

$0.806

10k+ parts

-

12,208

$0.876

$0.841

$0.806

-

Native Components

USA . 729 parts In-Stock

1+ parts

$1.339

100+ parts

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729

$1.339

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Advanced Electronics

New Zealand . 258 parts In-Stock

1+ parts

$1.352

100+ parts

$1.230

1k+ parts

$1.109

10k+ parts

-

258

$1.352

$1.230

$1.109

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Northwest PG Solutions

USA . 2,036 parts In-Stock

1+ parts

$1.473

100+ parts

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2,036

$1.473

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AZTECH Wire

Italy . 571 parts In-Stock

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$21.450

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571

$21.450

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Andel Nordic

Denmark . 597 parts In-Stock

1+ parts

$32.250

100+ parts

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$22.576

10k+ parts

$22.576

597

$32.250

-

$22.576

$22.576

Epart123

USA . 30,000 parts In-Stock

1+ parts

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$0.500

30,000

-

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$0.500

Microchip USA

USA . 7,901 parts In-Stock

1+ parts

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7,901

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GreenTree Electronics

Israel . 4,970 parts In-Stock

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4,970

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Perfect Parts

USA . 112 parts In-Stock

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112

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Technical Specifications

Power Field Effect Transistors (FET) BSC079N03LSCGATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

10 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0127 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

200 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC079N03LSCGATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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