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BSC046N10NS3GATMA1

Infineon Technologies

BSC046N10NS3GATMA1 by Infineon Technologies

Infineon's BSC046N10NS3GATMA1 is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 400A IDM, 350mJ EAS, and 0.0046 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 150°C. Suitable for high-power circuits due to its 156W Pd rating.

Median Price

$1.367

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$1.367

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VNN

France . 4,151 parts In-Stock

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Vyrian

USA . 3,969 parts In-Stock

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Digiode

USA . 199 parts In-Stock

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Prism Electronics

USA . 12 parts In-Stock

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Semtec, LLC

USA . 5 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 7,119 parts In-Stock

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$1.328

100+ parts

$1.275

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$1.222

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Argo Parts USA

USA . 2,681 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.367

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Continental Prestige Electronics

USA . 753 parts In-Stock

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$1.367

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$1.340

753

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$1.394

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$1.394

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70

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Corohmni

South Africa . 261 parts In-Stock

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$1.833

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Aztec Data Supply Inc.

USA . 143 parts In-Stock

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$1.870

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AZTECH Wire

Italy . 279 parts In-Stock

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$9.798

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Semicontronic

India . 700 parts In-Stock

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$35.050

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$34.174

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$33.998

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Ampacity Inc.

Singapore . 315 parts In-Stock

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$39.050

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Component Stockers USA

USA . 286 parts In-Stock

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$99.990

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RC Electronics

USA . 18,000 parts In-Stock

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$1.440

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Perfect Parts

USA . 6,142 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the BSC046N10NS3GATMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a high DS breakdown voltage of 100V and a maximum drain current of 17A, this transistor ensures reliable and efficient operation. Say goodbye to overheating and hello to optimized power dissipation with its low on-resistance of 0.0046 ohm. Experience the future of electronics with Infineon Technologies and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight casing for the FET, ensuring long-lasting performance in various applications.

Avalanche Energy Rating (EAS): 350 mJ

With a high avalanche energy rating, this FET can safely handle transient voltage spikes and protect the circuit from damage.

Maximum Drain-Source On Resistance: 0.0046 ohm

Low on-resistance ensures efficient power transfer and minimal power loss in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) BSC046N10NS3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.0046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC046N10NS3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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