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BCX5316H6327XTSA1

Infineon Technologies

BCX5316H6327XTSA1 by Infineon Technologies

Infineon's BCX5316H6327XTSA1 is a PNP BJT with 2W power dissipation, hFE of 100, and IC of 1A. Ideal for surface mount applications, it operates up to 150°C making it suitable for power management in various electronic devices.

Median Price

$0.136

Lifecycle Status

EOL

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11,000 parts In-Stock

1+ parts

-

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$0.136

10k+ parts

$0.110

11,000

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-

$0.136

$0.110

Verical

USA . 7,000 parts In-Stock

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$0.137

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$0.110

7,000

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$0.137

$0.110

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.130

1k+ parts

$0.107

10k+ parts

$0.096

2,000

-

$0.130

$0.107

$0.096

Chip1Stop

Japan . 1,000 parts In-Stock

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$0.144

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$0.144

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Distributors (In-Stock)

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Digiode

USA . 453 parts In-Stock

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$0.101

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453

$0.101

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Nova Conductors

Japan . 69 parts In-Stock

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$0.215

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69

$0.215

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TME

Poland . 11,000 parts In-Stock

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$0.141

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11,000

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$0.141

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Vyrian

USA . 8,022 parts In-Stock

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VNN

France . 3,130 parts In-Stock

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3,130

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NAC Semi

USA . 3,000 parts In-Stock

1+ parts

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$0.450

10k+ parts

$0.415

3,000

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$0.450

$0.415

Component Sense

UK . 1,708 parts In-Stock

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1,708

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Rutronik

Germany . 1,000 parts In-Stock

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$0.133

10k+ parts

$0.128

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$0.133

$0.128

Sensible Micro Corp

USA . 444 parts In-Stock

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444

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Cyclops Electronics Ltd

UK . 111 parts In-Stock

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ComSIT Distribution GmbH

Germany . 83 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,528 parts In-Stock

1+ parts

$0.090

100+ parts

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4,528

$0.090

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Semicontronic

India . 3,380 parts In-Stock

1+ parts

$0.090

100+ parts

$0.088

1k+ parts

$0.087

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-

3,380

$0.090

$0.088

$0.087

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Corphita

USA . 273 parts In-Stock

1+ parts

$0.095

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273

$0.095

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Continental Prestige Electronics

USA . 3,122 parts In-Stock

1+ parts

$0.175

100+ parts

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$0.172

3,122

$0.175

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$0.172

Argo Parts USA

USA . 2,241 parts In-Stock

1+ parts

$0.175

100+ parts

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$0.170

2,241

$0.175

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$0.170

Modulus Dynamics

Lithuania . 25,277 parts In-Stock

1+ parts

$0.195

100+ parts

$0.187

1k+ parts

$0.179

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25,277

$0.195

$0.187

$0.179

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Corohmni

South Africa . 4 parts In-Stock

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$0.195

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4

$0.195

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$0.201

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$0.191

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$0.191

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150

$0.201

$0.191

$0.191

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.211

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$0.202

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$0.211

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$0.202

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Aztec Data Supply Inc.

USA . 3,134 parts In-Stock

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$1.101

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$1.101

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AZTECH Wire

Italy . 54 parts In-Stock

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$18.420

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54

$18.420

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Eastek

USA . 28,000 parts In-Stock

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$0.409

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$0.409

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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Lixinc

USA . 2,508 parts In-Stock

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2,508

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Benley Electronics

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Enhance your electronic designs with the BCX5316H6327XTSA1 by Infineon Technologies, a top-notch Power Bipolar Junction Transistor (BJT) that offers unparalleled quality and reliability. Manufactured by industry leader Infineon Technologies, this PNP transistor is ideal for a wide range of applications. With a maximum power dissipation of 2W and a minimum DC current gain of 100, this transistor delivers exceptional performance. Whether you're working on automotive, industrial, or consumer electronics projects, the BCX5316H6327XTSA1 provides the value, benefits, and advantages you need to bring your designs to life.

Feature Benefit Bullets

Polarity or Channel Type: PNP

PNP transistors are commonly used in high-power applications and have good switching characteristics.

Configuration: SINGLE

Single configuration makes it easier to design circuits and ensures reliable performance.

Surface Mount: YES

Surface mount package allows for easy installation on PCBs and saves space.

Maximum Power Dissipation (Abs): 2 W

With a maximum power dissipation of 2W, this transistor can handle moderate power levels without overheating.

Minimum DC Current Gain (hFE): 100

Having a minimum DC current gain of 100 ensures amplification of signals with high accuracy.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without affecting performance, suitable for demanding applications.

Maximum Collector Current (IC): 1 A

With a high collector current rating of 1A, this transistor can handle large currents effectively.

Terminal Finish: TIN

TIN terminal finish provides good solderability and corrosion resistance for a reliable connection.

Peak Reflow Temperature °C: 245

Can withstand high reflow temperatures during the manufacturing process without damage.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BCX5316H6327XTSA1 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

1 A

Configuration:

Minimum DC Current Gain (hFE):

100

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

2 W

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

BCX5316H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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