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LTC5591IUH#TRPBF

Analog Devices

LTC5591IUH#TRPBF by Analog Devices

LTC5591IUH#TRPBF by Analog Devices is a cellphone IC with 24 terminals in a square chip carrier package. It operates at 3.3V, suitable for RF and baseband circuits. With CMOS technology, it has a low profile of 0.8mm making it ideal for compact mobile devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 11,134 parts In-Stock

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Chip Stock

USA . 4,010 parts In-Stock

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Digiode

USA . 3,972 parts In-Stock

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Anansix

USA . 2,673 parts In-Stock

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AZTECH Wire

Italy . 375 parts In-Stock

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$10.234

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$10.234

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MARBEL Systems

Belgium . 2,502 parts In-Stock

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$15.078

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Parana Technologies

USA . 1,024 parts In-Stock

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$15.262

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$14.194

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

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$16.411

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$15.590

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$15.590

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Texas Native Microelectronics

USA . 274 parts In-Stock

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$17.331

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$16.118

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$15.251

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Kenton Components

USA . 10,805 parts In-Stock

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$20.797

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$18.302

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DigiPath Technology Company

USA . 2,806 parts In-Stock

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$25.601

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$24.577

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Qasali Group International

UK . 1,132 parts In-Stock

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$46.794

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One Stop Electronics

USA . 2,238 parts In-Stock

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$683.000

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Semicontronic

India . 1,266 parts In-Stock

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$732.000

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$713.700

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$710.040

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QUARKTWIN TECHNOLOGY LTD

USA . 24,113 parts In-Stock

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Corphita

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Corohmni

South Africa . 480 parts In-Stock

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Overview

Enhance the performance of your cellphone with the LTC5591IUH#TRPBF by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that are essential for achieving superior signal processing and communication capabilities. This innovative product boasts a sleek design and advanced technology, making it ideal for various applications in the telecommunications industry. Elevate your mobile experience with the LTC5591IUH#TRPBF and enjoy seamless connectivity, improved efficiency, and unparalleled functionality. Trust Analog Devices to provide you with the best in class solutions for all your cellphone IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for the Cellphone IC, making it suitable for portable devices.

Surface Mount: YES

The surface mount technology allows for easy and efficient assembly of the IC onto the PCB, saving space and reducing production time.

No. of Terminals: 24

Having 24 terminals allows for the IC to handle multiple functions within the cellphone, providing versatility in its usage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance and improved battery life for the cellphone.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is commonly used in mobile devices, ensuring compatibility with the power requirements of the cellphone IC.

Technical Specifications

Cellphone ICs LTC5591IUH#TRPBF attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

LTC5591IUH#TRPBF Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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