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LTC1757A-2EMS#PBF

Analog Devices

LTC1757A-2EMS#PBF by Analog Devices

LTC1757A-2EMS#PBF by Analog Devices is a Telecom IC with 10 terminals, operating b/w -30 to 85 °C. It features CMOS technology, matte tin terminal finish, and a small outline package style. Ideal for telecom circuits, it has a nominal voltage of 3.6V and measures 3x3mm in size.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,127 parts In-Stock

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Digiode

USA . 5,387 parts In-Stock

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Anansix

USA . 2,691 parts In-Stock

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AZTECH Wire

Italy . 609 parts In-Stock

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$6.377

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609

$6.377

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MARBEL Systems

Belgium . 100 parts In-Stock

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$14.800

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100

$14.800

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Parana Technologies

USA . 776 parts In-Stock

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$15.523

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$14.436

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776

$15.523

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$14.436

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IDEA Electronic Components Group

UK . 834 parts In-Stock

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$16.691

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$15.856

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$15.856

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834

$16.691

$15.856

$15.856

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Texas Native Microelectronics

USA . 121 parts In-Stock

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$17.011

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$15.820

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$14.970

121

$17.011

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$14.970

Kenton Components

USA . 4,799 parts In-Stock

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$20.413

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$17.964

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$17.964

DigiPath Technology Company

USA . 423 parts In-Stock

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$26.038

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$24.996

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$24.996

423

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$24.996

Qasali Group International

UK . 5,915 parts In-Stock

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$45.930

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One Stop Electronics

USA . 3,159 parts In-Stock

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$134.000

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Semicontronic

India . 877 parts In-Stock

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$989.000

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$964.275

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$959.330

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$989.000

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Corphita

USA . 2,301 parts In-Stock

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Corohmni

South Africa . 184 parts In-Stock

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Overview

Unlock the power of advanced telecom interfaces with the LTC1757A-2EMS#PBF by Analog Devices. Known for their top-notch quality and cutting-edge technology, Analog Devices delivers a product that exceeds expectations in the telecom interface ICs category. With a small outline, thin profile, and shrink pitch package style, this product offers unparalleled performance and reliability. Perfect for a wide range of applications, this telecom circuit is a game-changer for those seeking optimal functionality and seamless communication. Experience the difference with Analog Devices and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and lightweight design, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and offers a more compact and efficient design for electronic devices.

Package Shape: SQUARE

The square package shape allows for easier handling during assembly and provides a uniform footprint for better integration into circuit layouts.

No. of Terminals: 10

With 10 terminals, this product offers a sufficient number of connection points for versatile connectivity options in telecom interfaces.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding operating conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows for operation in cold environments without compromising functionality.

Terminal Finish: Matte Tin (Sn)

The matte tin finish on the terminals provides excellent corrosion resistance and reliable solder joints for long-term performance.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1 mm allows for a compact overall design, suitable for space-constrained applications.

Width: 3 mm

The narrow width of 3 mm enables efficient PCB layout and saves space in electronic assemblies.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand the high temperatures of reflow soldering processes, ensuring reliable connections.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it ideal for telecom interface applications.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage of 3.6 V ensures compatibility with standard power sources and reliable operation within specified voltage range.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and facilitates fine-pitch connections in telecom interface circuits.

Technical Specifications

Other Function Telecom Interface ICs LTC1757A-2EMS#PBF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

LTC1757A-2EMS#PBF Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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