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LTC1757-1EMS8

Analog Devices

LTC1757-1EMS8 by Analog Devices

LTC1757-1EMS8 by Analog Devices is a CMOS telecom IC with 3/5V power supplies, 8 terminals in a small outline package. It operates b/w -30 to 85 °C and is ideal for telecom circuit applications requiring surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,174 parts In-Stock

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Digiode

USA . 3,220 parts In-Stock

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Anansix

USA . 2,116 parts In-Stock

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Parana Technologies

USA . 1,446 parts In-Stock

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$10.217

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$9.502

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$10.217

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$9.502

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IDEA Electronic Components Group

UK . 1,926 parts In-Stock

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$10.986

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$10.437

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$10.437

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MARBEL Systems

Belgium . 676 parts In-Stock

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$11.318

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Texas Native Microelectronics

USA . 650 parts In-Stock

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$13.009

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$12.489

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$12.098

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$11.448

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$13.009

$12.489

$12.098

$11.448

Kenton Components

USA . 1,213 parts In-Stock

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$15.611

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$13.738

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DigiPath Technology Company

USA . 186 parts In-Stock

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$17.138

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$16.453

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$16.453

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$16.453

AZTECH Wire

Italy . 735 parts In-Stock

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$17.953

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Qasali Group International

UK . 500 parts In-Stock

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$35.124

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$32.666

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$30.909

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$35.124

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$32.666

$30.909

Semicontronic

India . 644 parts In-Stock

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$168.000

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$163.800

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$162.960

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644

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One Stop Electronics

USA . 1,404 parts In-Stock

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Corphita

USA . 1,087 parts In-Stock

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Corohmni

South Africa . 99 parts In-Stock

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Overview

Elevate your telecom interface systems with the LTC1757-1EMS8 by Analog Devices. Known for their top-notch quality and reliable performance, Analog Devices delivers yet again with this versatile IC. With its compact design and wide operating temperature range, this product is perfect for a variety of applications in the telecom industry. Experience seamless power supply management with the LTC1757-1EMS8, offering customers unmatched value, efficiency, and convenience. Upgrade your systems today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good protection for the internal components of the IC, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into circuit boards, allowing for more compact and efficient designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on the circuit board, helping with assembly and manufacturing processes.

Power Supplies (V): 3/5

The ability to operate with both 3V and 5V power supplies provides flexibility in system design, accommodating different power requirements.

No. of Terminals: 8

Having 8 terminals allows for a sufficient number of connections, enabling the IC to interface with other components and devices effectively.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances the overall compactness and efficiency of the design, saving space on the circuit board.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can withstand high temperature environments, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C makes this IC suitable for a wide range of applications, including those in harsh or cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, ensuring secure connections and stable performance in the circuit.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in board layout and installation, making it easier to integrate the IC into different types of systems.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption, high noise immunity, and compatibility with various digital systems, making it a versatile and efficient choice.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical support and stability during assembly and soldering processes, enhancing the overall reliability of the connections.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers specialized features and functionality to support communications systems, making it a reliable choice for telecom interface applications.

Terminal Pitch: 0.635 mm

The 0.635mm terminal pitch allows for fine-pitch connections, enabling high-density integration and precise alignment on the circuit board, contributing to efficient designs.

Technical Specifications

Other Function Telecom Interface ICs LTC1757-1EMS8 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LTC1757-1EMS8 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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