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LTC1957-1EMS8

Analog Devices

LTC1957-1EMS8 by Analog Devices

LTC1957-1EMS8 by Analog Devices is a telecom IC with 8 terminals, operating b/w 0-70 °C. It has a nominal voltage of 3.6V and peak reflow temperature of 235°C. This small outline package is ideal for telecom circuit applications requiring thin profile design and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,098 parts In-Stock

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MRC Electronics

USA . 7,640 parts In-Stock

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7,640

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Digiode

USA . 5,283 parts In-Stock

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Anansix

USA . 1,656 parts In-Stock

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AZTECH Wire

Italy . 341 parts In-Stock

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$6.041

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$6.041

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Parana Technologies

USA . 4,594 parts In-Stock

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$6.228

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$5.792

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$5.792

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$6.697

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$6.362

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$6.697

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DigiPath Technology Company

USA . 607 parts In-Stock

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$10.447

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$10.029

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MARBEL Systems

Belgium . 10 parts In-Stock

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$11.317

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Texas Native Microelectronics

USA . 387 parts In-Stock

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$13.008

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$12.488

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$12.097

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$11.447

387

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$12.488

$12.097

$11.447

Kenton Components

USA . 90 parts In-Stock

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$15.610

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$13.736

90

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Qasali Group International

UK . 2,364 parts In-Stock

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$35.122

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$32.663

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$30.907

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$30.907

Semicontronic

India . 538 parts In-Stock

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$434.000

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$423.150

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$420.980

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$434.000

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One Stop Electronics

USA . 2,110 parts In-Stock

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$781.000

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,908 parts In-Stock

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Corphita

USA . 2,978 parts In-Stock

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Glotronic Ltd.

UK . 2,005 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Overview

Enhance your telecom interface systems with the LTC1957-1EMS8 by Analog Devices, a top-quality solution designed to meet your communication needs. Manufactured by industry leader Analog Devices, this product offers reliability and superior performance in a compact package. Ideal for a wide range of applications within the telecom industry, this innovative IC provides unmatched value, benefits, and advantages to customers looking to optimize their systems. Upgrade your telecom interface with the LTC1957-1EMS8 and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability of the product.

Surface Mount YES

Surface mount capability makes it easier to assemble and integrate into a variety of electronic devices.

Package Shape SQUARE

Square package shape allows for efficient use of space on circuit boards.

No. of Terminals 8

Having 8 terminals provides flexibility in connectivity options for different applications.

Package Style (Meter) SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style allows for compact and space-saving designs.

Maximum Operating Temperature 70 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature 0 °C

Low minimum operating temperature ensures the product can function in a wide range of temperature conditions.

Terminal Finish Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and electrical conductivity.

Terminal Position DUAL

Dual terminal position allows for secure and stable connections.

Maximum Seated Height 1.1 mm

Low maximum seated height helps in keeping the overall profile of the product compact.

Width 3 mm

Compact width makes it suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s) 20

Short reflow time at peak temperature helps in preventing damage to the product during manufacturing processes.

Peak Reflow Temperature °C 235

High peak reflow temperature ensures reliable solder connections during assembly.

Length 3 mm

Compact length allows for efficient use of space on circuit boards.

Temperature Grade COMMERCIAL

Commercial temperature grade makes it suitable for use in standard commercial applications.

Terminal Form GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering.

Telecom IC Type TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring compatibility and optimal performance in telecommunications applications.

Nominal Supply Voltage 3.6 V

Nominal supply voltage of 3.6V provides compatibility with a wide range of electronic systems.

Terminal Pitch 0.65 mm

Compact terminal pitch allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Other Function Telecom Interface ICs LTC1957-1EMS8 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3 mm

Trade Compliance

LTC1957-1EMS8 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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