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LTC1757-2EMS

Analog Devices

LTC1757-2EMS by Analog Devices

LTC1757-2EMS by Analog Devices is a CMOS telecom IC with 10 terminals in a small outline package. It operates b/w -30 °C to 85°C, with power supplies of 3/5V. Ideal for telecom circuits, it features a gull wing terminal form and is surface mountable.

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 7,570 parts In-Stock

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Digiode

USA . 1,714 parts In-Stock

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Anansix

USA . 356 parts In-Stock

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R&J Components

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AZTECH Wire

Italy . 269 parts In-Stock

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$10.180

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Parana Technologies

USA . 4,261 parts In-Stock

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$11.235

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$10.449

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IDEA Electronic Components Group

UK . 273 parts In-Stock

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$12.081

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$11.477

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MARBEL Systems

Belgium . 40 parts In-Stock

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$13.758

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Texas Native Microelectronics

USA . 803 parts In-Stock

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$15.814

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$14.707

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$13.916

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DigiPath Technology Company

USA . 1,170 parts In-Stock

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$18.846

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$18.093

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Kenton Components

USA . 450 parts In-Stock

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Qasali Group International

UK . 1,865 parts In-Stock

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One Stop Electronics

USA . 1,034 parts In-Stock

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Semicontronic

India . 820 parts In-Stock

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$931.125

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$926.350

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Corphita

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Glotronic Ltd.

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Corohmni

South Africa . 365 parts In-Stock

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A-Z Elektronik GmbH

Germany . 297 parts In-Stock

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Kepictronics

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Overview

Experience the cutting-edge technology of Analog Devices with the LTC1757-2EMS, a top-of-the-line Other Function Telecom Interface IC. Manufactured with precision and expertise, this product offers unmatched quality and reliability. Perfect for a wide range of applications, this telecom circuit IC delivers superior performance and efficiency. With Analog Devices at the helm, customers can trust in the value, benefits, and advantages that the LTC1757-2EMS brings to their projects. Elevate your designs with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides good insulation and protection for the IC, making it durable and reliable.

Surface Mount: YES

Surface mount technology makes it easy to mount the IC on a PCB, saving space and allowing for automated assembly.

Package Shape: RECTANGULAR

Rectangular shape is commonly used in electronic components, allowing for efficient PCB layout and space utilization.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) enhances flexibility in system design and integration.

No. of Terminals: 10

Having 10 terminals allows for multiple connectivity options and functions to be supported by the IC.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style saves space on the PCB and enables compact designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliability and stable performance even in demanding environments.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature of -30 °C allows for operation in a wide range of environmental conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and solderability for reliable connections on the PCB.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection options for easy integration into various systems.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form facilitates surface mounting and soldering processes, improving ease of assembly and reliability.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC is optimized for performance, reliability, and compatibility in communication systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high density mounting on the PCB, enabling compact and space-efficient designs.

Technical Specifications

Other Function Telecom Interface ICs LTC1757-2EMS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e0

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

LTC1757-2EMS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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