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AD8315ACHIPS

Analog Devices

AD8315ACHIPS by Analog Devices

AD8315ACHIPS by Analog Devices is a rectangular unencased chip for telecom circuits. It operates at a nominal voltage of 2.7V, suitable for surface mount applications. The terminal position is upper with no lead, making it ideal for various telecom interface ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,353 parts In-Stock

1+ parts

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3,353

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Digiode

USA . 694 parts In-Stock

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694

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 362 parts In-Stock

1+ parts

$1.575

100+ parts

-

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362

$1.575

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Northwest PG Solutions

USA . 697 parts In-Stock

1+ parts

$1.733

100+ parts

-

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697

$1.733

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AZTECH Wire

Italy . 815 parts In-Stock

1+ parts

$8.748

100+ parts

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815

$8.748

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Parana Technologies

USA . 1,694 parts In-Stock

1+ parts

$11.339

100+ parts

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$10.545

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1,694

$11.339

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$10.545

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IDEA Electronic Components Group

UK . 1,274 parts In-Stock

1+ parts

$12.192

100+ parts

$11.582

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$11.582

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1,274

$12.192

$11.582

$11.582

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DigiPath Technology Company

USA . 1,817 parts In-Stock

1+ parts

$19.020

100+ parts

$18.259

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$18.259

1,817

$19.020

$18.259

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$18.259

One Stop Electronics

USA . 254 parts In-Stock

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$160.000

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254

$160.000

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Semicontronic

India . 477 parts In-Stock

1+ parts

$238.000

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$232.050

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$230.860

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477

$238.000

$232.050

$230.860

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Corphita

USA . 719 parts In-Stock

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719

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Overview

Elevate your telecom interface with the AD8315ACHIPS by Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers exceptional performance and reliability in every product. This rectangular, surface-mount unencased chip offers a range of applications in the telecom industry, providing customers with unparalleled value and benefits. Upgrade your systems with the AD8315ACHIPS and experience superior results in your telecom projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular packages are common and easy to handle, making this product compatible with standard manufacturing processes.

Package Style (Meter): UNCASED CHIP

The unencased chip design offers a compact and lightweight solution, suitable for space-constrained applications.

Terminal Position: UPPER

The upper terminal position facilitates easy connection and integration with other components in the system.

Terminal Form: NO LEAD

The absence of leads simplifies the assembly process and reduces the risk of potential short circuits.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC ensures reliable and efficient communication performance.

Nominal Supply Voltage: 2.7 V

The low nominal supply voltage makes this product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Telecom Interface ICs AD8315ACHIPS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N

No. of Functions:

1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

AD8315ACHIPS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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