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AD8311ACBZ-P2

Analog Devices

AD8311ACBZ-P2 by Analog Devices

AD8311ACBZ-P2 by Analog Devices is a telecom IC with 6 terminals, operating at -40 to 85 °C. It has a supply voltage of 3V and low current draw of 0.0129mA. This rectangular package with very thin profile and fine pitch is ideal for telecom circuit applications.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 3,051 parts In-Stock

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Bristol Electronics

USA . 25 parts In-Stock

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Atlantic Semiconductor

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Digiode

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Native Components

USA . 10 parts In-Stock

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$5.085

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Parana Technologies

USA . 1,380 parts In-Stock

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$8.489

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$7.895

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IDEA Electronic Components Group

UK . 696 parts In-Stock

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DigiPath Technology Company

USA . 1,933 parts In-Stock

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AZTECH Wire

Italy . 621 parts In-Stock

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One Stop Electronics

USA . 714 parts In-Stock

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Semicontronic

India . 1,159 parts In-Stock

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$743.990

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Northwest PG Solutions

USA . 2,288 parts In-Stock

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Corphita

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Overview

Unlock the power of seamless communication with the AD8311ACBZ-P2 by Analog Devices. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. From its surface mount design to its industrial temperature grade, this product is built to exceed expectations. Perfect for a wide range of applications, this versatile IC delivers exceptional performance and efficiency. Experience the difference with Analog Devices and revolutionize your telecom solutions today.

Feature Benefit Bullets

Surface Mount YES

Allows for easy and efficient placement on PCBs, saving space and reducing assembly time.

Package Shape RECTANGULAR

Provides a standard and easily mountable form factor for compatibility with various PCB layouts.

Power Supplies (V) 3/5

Supports a range of power supply voltages, offering flexibility in design and compatibility with different systems.

No. of Terminals 6

Simplifies the connection and integration of the IC within the system, reducing complexity and potential points of failure.

Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high density integration of components, ideal for space-constrained applications and compact designs.

Maximum Operating Temperature 85 °C

Ensures reliable operation in various environmental conditions, suitable for industrial settings.

Minimum Operating Temperature -40 °C

Provides a wide operating temperature range, making the IC suitable for both extreme cold and hot environments.

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

Enhances the durability and conductivity of the terminals, ensuring reliable connections and performance.

Terminal Position BOTTOM

Facilitates easy and secure mounting on the PCB, improving overall stability and reliability of the IC.

Maximum Seated Height 0.675 mm

Low profile design saves space and enables compact product designs.

Width 0.95 mm

Compact width allows for efficient PCB layout and integration into tight spaces.

Maximum Time At Peak Reflow Temperature (s) 40

Ensures proper soldering during assembly, reducing the risk of component damage and ensuring reliability.

Peak Reflow Temperature °C 260

Withstands high reflow temperatures during assembly processes, ensuring proper solder joint formation.

Length 1.45 mm

Compact length allows for efficient PCB layout and integration into tight spaces.

Temperature Grade INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Terminal Form BALL

Provides a reliable and durable terminal connection, ensuring long-term performance of the IC.

Maximum Supply Current 0.0129 mA

Low supply current helps in minimizing power consumption and heat dissipation, ideal for energy-efficient devices.

Telecom IC Type TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in telecom systems.

Nominal Supply Voltage 3 V

Optimized for operation at 3V supply voltage, ensuring stable and reliable performance within specified limits.

Terminal Pitch 0.5 mm

Fine pitch terminal spacing allows for high density integration and compact PCB layout, ideal for space-constrained designs.

Technical Specifications

Other Function Telecom Interface ICs AD8311ACBZ-P2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0129 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

.95 mm

Trade Compliance

AD8311ACBZ-P2 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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