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AD8315ACP-REEL

Analog Devices

AD8315ACP-REEL by Analog Devices

AD8315ACP-REEL by Analog Devices is a small outline, heat sink package with 8 terminals. It operates b/w -30 to 85 °C and requires 2.7V nominal voltage. Ideal for telecom circuits, it has a low supply current of 0.0129mA and compact dimensions of 3x2mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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BCID Electronics Ltd.

Israel . 2,372 parts In-Stock

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Vyrian

USA . 2,288 parts In-Stock

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Digiode

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Northwest PG Solutions

USA . 1,565 parts In-Stock

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$2.365

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AZTECH Wire

Italy . 572 parts In-Stock

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Parana Technologies

USA . 1,925 parts In-Stock

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$8.007

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

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$8.610

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$8.180

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DigiPath Technology Company

USA . 88 parts In-Stock

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$13.432

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$12.894

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Semicontronic

India . 148 parts In-Stock

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One Stop Electronics

USA . 361 parts In-Stock

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Ampacity Inc.

Singapore . 385 parts In-Stock

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Metaverse IC Inc.

Canada . 6,040 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Glotronic Ltd.

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Native Components

USA . 301 parts In-Stock

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Corphita

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Overview

Enhance your telecom interface designs with the AD8315ACP-REEL by Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers reliable solutions for various applications in the telecommunications industry. This surface-mount IC boasts a small outline package style and dual terminal position, making it easy to integrate into your projects. With a wide operating temperature range and low power consumption, this IC offers exceptional value and performance. Upgrade your telecom systems today with the AD8315ACP-REEL and experience the benefits of Analog Devices' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making this product convenient for manufacturing and assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space and can easily fit into compact electronic devices.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V provide flexibility in voltage requirements for different applications.

No. of Terminals: 8

With 8 terminals, this product can support multiple connections and functions, enhancing its versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows this product to function effectively in cold environments.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enables space-saving designs and efficient heat dissipation.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good conductivity and solderability for secure connections.

Terminal Position: DUAL

The dual terminal position provides additional flexibility in circuit design and connection options.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact integration and space-efficient layouts.

Width: 2 mm

The narrow width of 2mm enables this product to fit into tight spaces and small electronic devices.

Peak Reflow Temperature °C: 240

The high peak reflow temperature of 240 °C ensures secure soldering and reliable connections during manufacturing processes.

Length: 3 mm

The short length of 3mm contributes to the compact size and footprint of this product, ideal for space-constrained applications.

Technology: BIPOLAR

The bipolar technology used in this product offers stable and reliable performance in telecommunications applications.

Terminal Form: NO LEAD

The no lead terminal form simplifies the installation process and reduces the risk of short circuits or contact damage.

Maximum Supply Current: 0.0129 mA

The low maximum supply current requirement of 0.0129mA ensures energy-efficient operation and minimizes power consumption.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility in telecommunications applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7V provides stable and reliable power delivery for consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for precise connections and compact circuit layouts, suitable for high-density designs.

Technical Specifications

Other Function Telecom Interface ICs AD8315ACP-REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0129 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

AD8315ACP-REEL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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