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AD8312ACPZ-REEL7

Analog Devices

AD8312ACPZ-REEL7 by Analog Devices

AD8312ACPZ-REEL7 by Analog Devices is a telecom IC with 6 terminals, operating from -40 to 85°C. It features a very thin profile grid array package style and requires a nominal voltage of 3V. Ideal for telecom circuits, this IC has a compact size of 1.45mm x 0.95mm x 0.675mm for various applications in the industry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,584 parts In-Stock

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Digiode

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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Native Components

USA . 666 parts In-Stock

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$1.450

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666

$1.450

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Northwest PG Solutions

USA . 1,378 parts In-Stock

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$1.595

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$1.595

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Parana Technologies

USA . 1,391 parts In-Stock

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$7.644

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$7.109

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$7.644

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$7.109

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IDEA Electronic Components Group

UK . 1,836 parts In-Stock

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$8.219

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$7.808

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1,836

$8.219

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DigiPath Technology Company

USA . 1,067 parts In-Stock

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$12.822

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$12.309

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$12.309

1,067

$12.822

$12.309

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$12.309

AZTECH Wire

Italy . 428 parts In-Stock

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$14.682

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428

$14.682

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One Stop Electronics

USA . 1,373 parts In-Stock

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$423.000

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$423.000

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Semicontronic

India . 1,008 parts In-Stock

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$516.000

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$503.100

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$500.520

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$516.000

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Corphita

USA . 309 parts In-Stock

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Overview

Elevate your telecom interface designs with the AD8312ACPZ-REEL7 by Analog Devices. With a reputation for quality and innovation, Analog Devices delivers cutting-edge solutions for various applications in the telecom industry. This surface-mount IC boasts a sleek rectangular package shape and a grid array with a very thin profile, making it ideal for space-constrained designs. The AD8312ACPZ-REEL7 offers unmatched value with its reliable performance, precise measurements, and industrial-grade temperature range. Upgrade your telecom systems with the superior functionality and efficiency of this Telecom Circuit IC.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly, making this product easy to integrate into electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor for easy handling and mounting on the PCB.

No. of Terminals: 6

Six terminals enable a sufficient number of connections for telecom interface applications, ensuring versatility and compatibility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial environments where temperature fluctuations occur.

Nominal Supply Voltage: 3 V

A 3V nominal supply voltage is common in many electronic systems, making this product compatible with a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs AD8312ACPZ-REEL7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1.45 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

.95 mm

Trade Compliance

AD8312ACPZ-REEL7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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