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AD8314ACP-REEL

Analog Devices

AD8314ACP-REEL by Analog Devices

AD8314ACP-REEL by Analog Devices is a telecom IC with 8 terminals, operating from -40 to 85 °C. It has a small outline package style, suitable for telecom circuits with a nominal voltage of 3V. The surface-mount IC measures 3x2mm and features tin-lead terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 8,185 parts In-Stock

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Vyrian

USA . 6,871 parts In-Stock

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Digiode

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 4,155 parts In-Stock

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$8.694

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$8.085

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$8.694

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$8.085

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

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$9.348

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$8.881

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$9.348

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AZTECH Wire

Italy . 334 parts In-Stock

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$9.360

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334

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DigiPath Technology Company

USA . 1,399 parts In-Stock

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$14.583

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$14.000

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$14.000

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$14.000

One Stop Electronics

USA . 1,201 parts In-Stock

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$310.000

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$310.000

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Semicontronic

India . 1,464 parts In-Stock

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$378.000

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$368.550

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$366.660

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Corphita

USA . 967 parts In-Stock

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Native Components

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Northwest PG Solutions

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Overview

Elevate your telecom interface designs with the AD8314ACP-REEL by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers cutting-edge solutions that exceed industry standards. This small outline, very thin profile package offers a wide range of applications in the telecom industry, providing customers with precise and efficient performance. With its industrial-grade temperature grade and nominal supply voltage of 3V, this Telecom Circuit IC is the perfect choice for your next project. Experience the value and benefits of Analog Devices' innovative technology with the AD8314ACP-REEL.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for mass production.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for more efficient use of space on the circuit board.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for various telecom interface functions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures enables this product to be used in both extreme cold and hot environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures reliable electrical connections and prevents corrosion.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connectivity.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and integration into space-constrained applications.

Width: 2 mm

Narrow width enables close packing of components on the circuit board, optimizing space usage.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures proper soldering and reliable connections during manufacturing.

Length: 3 mm

Compact length reduces the overall footprint of the product on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces the risk of lead contamination.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom interface functions, ensuring optimal performance in telecommunications applications.

Nominal Supply Voltage: 3 V

Stable 3V supply voltage is suitable for telecom interface ICs, ensuring consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting of components on the circuit board, ideal for space-constrained designs.

Technical Specifications

Other Function Telecom Interface ICs AD8314ACP-REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

AD8314ACP-REEL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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