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AD8312ACBZ-P2

Analog Devices

AD8312ACBZ-P2 by Analog Devices

AD8312ACBZ-P2 by Analog Devices is a telecom IC with 6 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features a very thin profile and fine pitch design for surface mount applications.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

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$1.430

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$1.280

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$1.210

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$1.430

$1.280

$1.210

Distributors (In-Stock)

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Digiode

USA . 67 parts In-Stock

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$1.510

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USA . 17,220 parts In-Stock

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Vyrian

USA . 5,416 parts In-Stock

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VNN

France . 2,551 parts In-Stock

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Dynamic Solutions

Germany . 1,200 parts In-Stock

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Electronic Expediters

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Nova Conductors

Japan . 150 parts In-Stock

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Sogenti Electronics

Canada . 45 parts In-Stock

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Connector Distribution Corp

USA . 20 parts In-Stock

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,715 parts In-Stock

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$1.350

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Semicontronic

India . 1,199 parts In-Stock

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$1.350

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$1.316

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$1.310

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Corphita

USA . 975 parts In-Stock

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$1.431

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Aztec Data Supply Inc.

USA . 184 parts In-Stock

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$5.950

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Parana Technologies

USA . 1,757 parts In-Stock

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$7.407

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$6.888

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Corohmni

South Africa . 37 parts In-Stock

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$7.924

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

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$7.964

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$7.566

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DigiPath Technology Company

USA . 1,876 parts In-Stock

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$12.424

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$11.927

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$11.927

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$11.927

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$11.927

Continental Prestige Electronics

USA . 6,125 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Argo Parts USA

USA . 3,033 parts In-Stock

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Metaverse IC Inc.

Canada . 1,856 parts In-Stock

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Kepictronics

USA . 1,318 parts In-Stock

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Assy Fe

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Bastille Electronics

Australia . 40 parts In-Stock

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Advanced Electronics

New Zealand . 36 parts In-Stock

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Overview

Discover the cutting-edge AD8312ACBZ-P2 by Analog Devices, a top-tier manufacturer known for its superior quality and innovation. This versatile telecom interface IC offers endless possibilities in various applications. With a sleek rectangular package body and surface mount capabilities, this product provides exceptional value and benefits to customers seeking high-performance solutions. Elevate your projects with the AD8312ACBZ-P2 and experience unparalleled reliability and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

With a surface mount feature, this IC can be easily integrated into various PCB designs for seamless assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, optimizing layout design.

No. of Terminals: 6

The 6 terminals provide sufficient connectivity options for different telecom interface requirements.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style ensures a compact design, reducing the overall footprint of the IC on the PCB.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

The low operating temperature range makes this IC suitable for use in a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish offers excellent conductivity and corrosion resistance for superior signal transmission.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout, allowing for a more compact design.

Maximum Seated Height: 0.675 mm

The low seated height saves space and enables a slim profile design for the IC.

Width: 0.95 mm

The narrow width of the IC facilitates compact PCB designs, ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification indicates the IC's ability to withstand high temperatures during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and bonding for reliable performance.

Length: 1.45 mm

The moderate length of the IC offers a balance between space-saving design and functional performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand harsh operating conditions and provide consistent performance.

Terminal Form: BALL

The ball terminal form offers secure connections and easy assembly, enhancing the overall reliability of the IC.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC ensures optimal performance and compatibility with telecom systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is suitable for various telecom applications, providing stable power for the IC.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density PCB designs, allowing for more connections in a limited space.

Technical Specifications

Other Function Telecom Interface ICs AD8312ACBZ-P2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

.95 mm

Trade Compliance

AD8312ACBZ-P2 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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