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Power Field Effect Transistors (FET)

Power Field Effect Transistors (FET) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as motor drives, power supplies, and switching regulators.

The Power FET is a three-terminal device that works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through a gate electrode. The gate electrode is insulated from the channel region by a thin oxide layer, which can be controlled by applying a voltage to the gate terminal. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.

Power FETs are designed to handle high current and voltage levels, and have a low on-resistance and high switching speed. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.

Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.

Power Field Effect Transistors (FET)

Available Parts 2,400+

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Avalanche Energy Rating (EAS) Case Connection Maximum Collector Current (IC) Configuration Minimum DC Current Gain (hFE) Minimum DS Breakdown Voltage Maximum Drain Current (Abs) (ID) Maximum Drain Current (ID) Maximum Drain-Source On Resistance Field Effect Transistor Technology Maximum Fall Time (tf) Maximum Feedback Capacitance (Crss) Maximum Gate-Emitter Threshold Voltage Highest Frequency Band JEDEC-95 Code JESD-30 Code JESD-609 Code Moisture Sensitivity Level (MSL) No. of Elements No. of Terminals Operating Mode Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Shape Package Style (Meter) Peak Reflow Temperature (C) Polarity or Channel Type Maximum Power Dissipation Ambient Maximum Power Dissipation (Abs) Maximum Pulsed Drain Current (IDM) Qualification Reference Standard Maximum Rise Time (tr) Sub-Category Surface Mount Terminal Finish Terminal Form Terminal Position Maximum Time At Peak Reflow Temperature (s) Transistor Application Transistor Element Material Maximum Turn Off Time (toff) Nominal Turn Off Time (toff) Maximum Turn On Time (ton) Nominal Turn On Time (ton) Maximum VCEsat
IPW90R1K2C3FKSA1 by Infineon Technologies

IPW90R1K2C3FKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; JESD-30 Code: R-PSFM-T3; JEDEC-95 Code: TO-247; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

68 mJ

SINGLE WITH BUILT-IN DIODE

900 V

5.1 A

1.2 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

10 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPW90R340C3FKSA1 by Infineon Technologies

IPW90R340C3FKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Operating Mode: ENHANCEMENT MODE; No. of Terminals: 3; JESD-30 Code: R-PSFM-T3;

678 mJ

SINGLE WITH BUILT-IN DIODE

900 V

15 A

.34 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

34 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPW11N60CFDFKSA1 by Infineon Technologies

SPW11N60CFDFKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Package Body Material: PLASTIC/EPOXY; Terminal Position: SINGLE; No. of Elements: 1;

AVALANCHE RATED

340 mJ

SINGLE WITH BUILT-IN DIODE

600 V

11 A

.44 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

28 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPW15N60CFDFKSA1 by Infineon Technologies

SPW15N60CFDFKSA1

Infineon Technologies

SPW15N60CFDFKSA1 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 33A and EAS of 460mJ, suitable for high-power operations. With a 0.33 ohm RDS(on), it operates in ENHANCEMENT MODE at up to 150°C, making it reliable for various industrial uses.

460 mJ

SINGLE WITH BUILT-IN DIODE

600 V

13.4 A

.33 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247AD

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

33 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPW20N60CFDFKSA1 by Infineon Technologies

SPW20N60CFDFKSA1

Infineon Technologies

SPW20N60CFDFKSA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 52A max pulsed drain current, 0.22 ohm max drain-source resistance, and 690mJ avalanche energy rating. Suitable for enhancement mode operation in high-power systems up to 150°C.

AVALANCHE RATED

690 mJ

SINGLE WITH BUILT-IN DIODE

600 V

20.7 A

.22 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

52 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPW24N60CFDFKSA1 by Infineon Technologies

SPW24N60CFDFKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Pulsed Drain Current (IDM): 55 A; Maximum Drain-Source On Resistance: .185 ohm; Avalanche Energy Rating (EAS): 780 mJ;

780 mJ

SINGLE WITH BUILT-IN DIODE

600 V

21.7 A

.185 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247AD

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

55 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPW35N60CFDFKSA1 by Infineon Technologies

SPW35N60CFDFKSA1

Infineon Technologies

SPW35N60CFDFKSA1 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, 85A IDM, and 0.118 ohm RDS(on). Ideal for power applications due to its 1300 mJ EAS rating. Suitable for use in enhancement mode operations at up to 150°C.

AVALANCHE RATED, HIGH VOLTAGE

1300 mJ

SINGLE WITH BUILT-IN DIODE

600 V

34.1 A

.118 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247AA

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

85 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SILICON

SPW47N60CFDFKSA1 by Infineon Technologies

SPW47N60CFDFKSA1

Infineon Technologies

SPW47N60CFDFKSA1 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, 115A IDM, and 0.083 ohm RDS(on). Ideal for power applications requiring high drain current handling and low on-resistance. Suitable for use in various electronic devices due to its robust design and high operating temperature of 150°C.

AVALANCHE RATED, HIGH VOLTAGE

1800 mJ

SINGLE WITH BUILT-IN DIODE

600 V

46 A

.083 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247AA

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

115 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SILICON

BSC0908NSATMA1 by Infineon Technologies

BSC0908NSATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 34 V; Case Connection: DRAIN; Package Shape: RECTANGULAR;

10 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

34 V

14 A

.0127 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F8

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

200 A

Not Qualified

YES

FLAT

DUAL

NOT SPECIFIED

SWITCHING

SILICON

BSO303PHXUMA1 by Infineon Technologies

BSO303PHXUMA1

Infineon Technologies

P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Position: DUAL; Maximum Drain Current (ID): 7 A; JESD-609 Code: e3;

LOGIC LEVEL COMPATIBLE

97 mJ

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

7 A

.021 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

3

2

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

32.8 A

Not Qualified

YES

TIN

GULL WING

DUAL

SILICON

IPA65R110CFDXKSA1 by Infineon Technologies

IPA65R110CFDXKSA1

Infineon Technologies

Infineon's IPA65R110CFDXKSA1 is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 99.6A IDM, 845mJ EAS, and 0.11 ohm RDS(ON). Operating from -55 to 150 °C, it has a max power dissipation of 34.7W in a RECTANGULAR package with THROUGH-HOLE terminals.

845 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

650 V

31.2 A

31.2 A

.11 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

NOT SPECIFIED

N-CHANNEL

34.7 W

99.6 A

Not Qualified

NO

Tin (Sn)

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPB65R110CFDATMA1 by Infineon Technologies

IPB65R110CFDATMA1

Infineon Technologies

IPB65R110CFDATMA1 by Infineon is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has a max IDM of 99.6A and EAS of 845mJ, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it features 0.11 ohm RDS(ON) and can handle up to 31.2A drain current, making it ideal for high-power electronics.

845 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

650 V

31.2 A

31.2 A

.11 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

99.6 A

Not Qualified

YES

Tin (Sn)

GULL WING

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPI65R110CFDXKSA1 by Infineon Technologies

IPI65R110CFDXKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 277.8 W; Maximum Drain Current (Abs) (ID): 31.2 A; Package Body Material: PLASTIC/EPOXY;

845 mJ

SINGLE WITH BUILT-IN DIODE

650 V

31.2 A

31.2 A

.11 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

NOT SPECIFIED

N-CHANNEL

277.8 W

99.6 A

Not Qualified

NO

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPP65R110CFDXKSA1 by Infineon Technologies

IPP65R110CFDXKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 277.8 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (Abs) (ID): 31.2 A;

845 mJ

SINGLE WITH BUILT-IN DIODE

650 V

31.2 A

31.2 A

.11 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

NOT SPECIFIED

N-CHANNEL

277.8 W

99.6 A

Not Qualified

NO

Tin (Sn)

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPW65R110CFDFKSA1 by Infineon Technologies

IPW65R110CFDFKSA1

Infineon Technologies

IPW65R110CFDFKSA1 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 99.6A Pulsed Drain Current, 845mJ Avalanche Energy Rating, and 0.11 ohm On Resistance. Operating in ENHANCEMENT MODE, it can handle up to 277.8W power dissipation efficiently at temperatures ranging from -55°C to 150°C.

845 mJ

SINGLE WITH BUILT-IN DIODE

650 V

31.2 A

31.2 A

.11 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

NOT SPECIFIED

N-CHANNEL

277.8 W

99.6 A

Not Qualified

NO

Tin (Sn)

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPS12CN10LGBKMA1 by Infineon Technologies

IPS12CN10LGBKMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Transistor Application: SWITCHING; JESD-30 Code: R-PSIP-T3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

LOGIC LEVL COMPATIBLE

150 mJ

SINGLE WITH BUILT-IN DIODE

100 V

69 A

.0118 ohm

METAL-OXIDE SEMICONDUCTOR

TO-251AA

R-PSIP-T3

e3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

NOT SPECIFIED

N-CHANNEL

276 A

Not Qualified

NO

MATTE TIN

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPB147N03LGATMA1 by Infineon Technologies

IPB147N03LGATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Element Material: SILICON; Package Style (Meter): SMALL OUTLINE; No. of Elements: 1;

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

20 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

20 A

.0217 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

140 A

Not Qualified

YES

GULL WING

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

SPA02N80C3XKSA1 by Infineon Technologies

SPA02N80C3XKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Package Style (Meter): FLANGE MOUNT;

AVALANCHE RATED, HIGH VOLTAGE

90 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

800 V

2 A

2.7 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

6 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPA04N80C3XKSA1 by Infineon Technologies

SPA04N80C3XKSA1

Infineon Technologies

Infineon's SPA04N80C3XKSA1 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. Features include 12A IDM, 170mJ EAS, and 1.3Ω RDS(on). With a max operating temp of 150°C, it suits various power control needs in industrial settings.

AVALANCHE RATED, HIGH VOLTAGE

170 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

800 V

4 A

1.3 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

12 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPA11N80C3XKSA1 by Infineon Technologies

SPA11N80C3XKSA1

Infineon Technologies

SPA11N80C3XKSA1 by Infineon is a N-CHANNEL FET with 800V DS breakdown voltage. Ideal for switching applications, it has 33A pulsed drain current and 0.45 ohm max on-resistance. Operating in enhancement mode, it features a built-in diode and can handle up to 150°C temperature.

AVALANCHE RATED

470 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

800 V

11 A

.45 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

33 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPD06N80C3BTMA1 by Infineon Technologies

SPD06N80C3BTMA1

Infineon Technologies

Infineon Technologies' SPD06N80C3BTMA1 is a power FET with N-channel configuration and built-in diode. It has a min DS breakdown voltage of 800V, making it suitable for switching applications. With a max pulsed drain current of 18A and low on-resistance of 0.9 ohm, it offers efficient performance in various electronic devices.

AVALANCHE RATED, HIGH VOLTAGE

230 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

800 V

6 A

.9 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

18 A

Not Qualified

YES

TIN

GULL WING

SINGLE

40

SWITCHING

SILICON

SPI08N80C3XKSA1 by Infineon Technologies

SPI08N80C3XKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; JESD-609 Code: e3; Package Style (Meter): IN-LINE; Package Body Material: PLASTIC/EPOXY;

AVALANCHE RATED, HIGH VOLTAGE

340 mJ

SINGLE WITH BUILT-IN DIODE

800 V

8 A

.65 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

N-CHANNEL

24 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPP02N80C3XKSA1 by Infineon Technologies

SPP02N80C3XKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Transistor Element Material: SILICON; Terminal Position: SINGLE; Additional Features: AVALANCHE RATED, HIGH VOLTAGE;

AVALANCHE RATED, HIGH VOLTAGE

90 mJ

SINGLE WITH BUILT-IN DIODE

800 V

2 A

2.7 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

6 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPP04N80C3XKSA1 by Infineon Technologies

SPP04N80C3XKSA1

Infineon Technologies

Infineon's SPP04N80C3XKSA1 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for SWITCHING applications. It features 12A IDM, 170mJ EAS, and 1.3 ohm RDS(on). The transistor operates in ENHANCEMENT MODE at up to 150°C, making it suitable for high-power systems.

AVALANCHE RATED, HIGH VOLTAGE

170 mJ

SINGLE WITH BUILT-IN DIODE

800 V

4 A

1.3 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

12 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPP18P06PHXKSA1 by Infineon Technologies

SPP18P06PHXKSA1

Infineon Technologies

SPP18P06PHXKSA1 by Infineon is a P-CHANNEL FET with 60V DS Breakdown Voltage, 74.8A IDM, and 0.13 ohm RDS(on). It is used in power applications due to its 81.1W Power Dissipation, 151mJ EAS rating, and -55 to +175°C Operating Temperature range.

AVALANCHE RATED

151 mJ

SINGLE WITH BUILT-IN DIODE

60 V

18.7 A

18.7 A

.13 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

P-CHANNEL

81.1 W

74.8 A

Other Transistors

NO

TIN

THROUGH-HOLE

SINGLE

SILICON

SPA17N80C3XKSA1 by Infineon Technologies

SPA17N80C3XKSA1

Infineon Technologies

Infineon's SPA17N80C3XKSA1 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. Features include 17A max drain current, 0.29 ohm max on resistance, and 51A pulsed drain current. Suitable for enhancement mode operation in various power electronics systems.

AVALANCHE RATED

670 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

800 V

17 A

.29 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

51 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPB65R280E6ATMA1 by Infineon Technologies

IPB65R280E6ATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PSSO-G2; Moisture Sensitivity Level (MSL): 1;

290 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

650 V

.28 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

39 A

YES

TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPD50R399CPBTMA1 by Infineon Technologies

IPD50R399CPBTMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Terminal Finish: TIN; Avalanche Energy Rating (EAS): 215 mJ;

215 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

500 V

9 A

.399 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

20 A

Not Qualified

YES

TIN

GULL WING

SINGLE

40

SWITCHING

SILICON

IPI60R099CPXKSA1 by Infineon Technologies

IPI60R099CPXKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Avalanche Energy Rating (EAS): 800 mJ; Maximum Drain Current (ID): 31 A; Transistor Element Material: SILICON;

800 mJ

SINGLE WITH BUILT-IN DIODE

600 V

31 A

.099 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

N-CHANNEL

93 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPA65R380E6XKSA1 by Infineon Technologies

IPA65R380E6XKSA1

Infineon Technologies

Infineon's IPA65R380E6XKSA1 is a N-CHANNEL FET with 650V DS breakdown voltage, 0.38 ohm RDS(on), and 29A IDM. Ideal for switching applications, it operates in enhancement mode with a max temperature of 150°C. The transistor features a built-in diode and offers an EAS of 215mJ for robust performance.

215 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

650 V

.38 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

29 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPD65R380E6BTMA1 by Infineon Technologies

IPD65R380E6BTMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: .38 ohm; Avalanche Energy Rating (EAS): 215 mJ; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

215 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

650 V

.38 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

29 A

Not Qualified

YES

TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPP65R380E6XKSA1 by Infineon Technologies

IPP65R380E6XKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; No. of Elements: 1; Avalanche Energy Rating (EAS): 215 mJ; Maximum Operating Temperature: 150 Cel;

215 mJ

SINGLE WITH BUILT-IN DIODE

650 V

.38 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

29 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPW65R080CFDFKSA1 by Infineon Technologies

IPW65R080CFDFKSA1

Infineon Technologies

Infineon's IPW65R080CFDFKSA1 is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 137A IDM and 1160mJ EAS, it operates in ENHANCEMENT MODE with 0.08 ohm RDS(ON). With a max power dissipation of 391W and temp range of -55 to 150 °C, it's suitable for high-power systems.

1160 mJ

SINGLE WITH BUILT-IN DIODE

650 V

43.3 A

43.3 A

.08 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

391 W

137 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

BSB008NE2LXXUMA1 by Infineon Technologies

BSB008NE2LXXUMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 89 W; Maximum Drain-Source On Resistance: .0008 ohm; Package Shape: RECTANGULAR;

ULTRA LOW RESISTANCE

600 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

25 V

180 A

.0008 ohm

METAL-OXIDE SEMICONDUCTOR

R-MBCC-N3

e4

3

1

3

ENHANCEMENT MODE

150 Cel

-40 Cel

METAL

RECTANGULAR

CHIP CARRIER

N-CHANNEL

89 W

400 A

Not Qualified

YES

SILVER NICKEL

NO LEAD

BOTTOM

SWITCHING

SILICON

BSC016N04LSGATMA1 by Infineon Technologies

BSC016N04LSGATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Avalanche Energy Rating (EAS): 295 mJ; Terminal Finish: TIN; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

295 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

40 V

100 A

.0023 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

400 A

Not Qualified

YES

TIN

FLAT

DUAL

SWITCHING

SILICON

BSF024N03LT3GXUMA1 by Infineon Technologies

BSF024N03LT3GXUMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Qualification: Not Qualified; Transistor Element Material: SILICON; Terminal Form: NO LEAD;

125 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

15 A

.0032 ohm

METAL-OXIDE SEMICONDUCTOR

R-MBCC-N3

1

3

ENHANCEMENT MODE

150 Cel

METAL

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

N-CHANNEL

400 A

Not Qualified

YES

NO LEAD

BOTTOM

NOT SPECIFIED

SWITCHING

SILICON

BSF030NE2LQXUMA1 by Infineon Technologies

BSF030NE2LQXUMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 28 W; No. of Terminals: 2; JESD-30 Code: R-MBCC-N2;

50 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

25 V

75 A

.0041 ohm

METAL-OXIDE SEMICONDUCTOR

R-MBCC-N2

e4

3

1

2

ENHANCEMENT MODE

150 Cel

-40 Cel

METAL

RECTANGULAR

CHIP CARRIER

N-CHANNEL

28 W

300 A

Not Qualified

YES

SILVER NICKEL

NO LEAD

BOTTOM

SWITCHING

SILICON

BSF050N03LQ3GXUMA1 by Infineon Technologies

BSF050N03LQ3GXUMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Terminal Position: BOTTOM;

20 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

15 A

.007 ohm

METAL-OXIDE SEMICONDUCTOR

R-MBCC-N2

1

2

ENHANCEMENT MODE

150 Cel

METAL

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

N-CHANNEL

240 A

Not Qualified

YES

NO LEAD

BOTTOM

NOT SPECIFIED

SWITCHING

SILICON

BSO613SPVGHUMA1 by Infineon Technologies

BSO613SPVGHUMA1

Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Element Material: SILICON; JESD-609 Code: e3; No. of Elements: 1;

AVALANCHE RATED

150 mJ

SINGLE WITH BUILT-IN DIODE

60 V

3.44 A

.13 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

3

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

P-CHANNEL

13.8 A

Not Qualified

YES

TIN

GULL WING

DUAL

SILICON

BSZ165N04NSGATMA1 by Infineon Technologies

BSZ165N04NSGATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 25 W; No. of Terminals: 8; Maximum Pulsed Drain Current (IDM): 124 A;

5 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

40 V

31 A

31 A

.0165 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

25 W

124 A

Not Qualified

FET General Purpose Powers

YES

TIN

FLAT

DUAL

SWITCHING

SILICON

IPA50R140CPXKSA1 by Infineon Technologies

IPA50R140CPXKSA1

Infineon Technologies

Infineon's IPA50R140CPXKSA1 is a N-CHANNEL FET with 500V DS breakdown voltage, ideal for switching applications. It features 56A max pulsed drain current and 0.14 ohm max drain-source resistance. The transistor operates in enhancement mode, with a package style of flange mount and an operating temperature up to 150°C.

616 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

500 V

23 A

.14 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

56 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPA60R165CPXKSA1 by Infineon Technologies

IPA60R165CPXKSA1

Infineon Technologies

Infineon's IPA60R165CPXKSA1 is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. Featuring a single configuration with built-in diode, it offers 61A max pulsed drain current and 0.165 ohm max RDS(on). With a package style of flange mount and operating temperature up to 150°C, this MOSFET is suitable for high-power electronics.

522 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

650 V

21 A

.165 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

61 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPA60R385CPXKSA1 by Infineon Technologies

IPA60R385CPXKSA1

Infineon Technologies

Infineon's IPA60R385CPXKSA1 is a N-CHANNEL FET with 650V DS breakdown voltage, 27A IDM, and 0.385 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max temp of 150°C.

227 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

650 V

9 A

.385 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

27 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPA90R1K0C3XKSA1 by Infineon Technologies

IPA90R1K0C3XKSA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; No. of Terminals: 3; Maximum Drain Current (ID): 5.7 A; Package Style (Meter): FLANGE MOUNT;

97 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

900 V

5.7 A

1 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

12 A

Not Qualified

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPB023N04NGATMA1 by Infineon Technologies

IPB023N04NGATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Position: SINGLE; Maximum Drain-Source On Resistance: .0023 ohm; Minimum DS Breakdown Voltage: 40 V;

150 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

40 V

90 A

.0023 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

N-CHANNEL

400 A

Not Qualified

YES

GULL WING

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPB039N04LGATMA1 by Infineon Technologies

IPB039N04LGATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 94 W; Case Connection: DRAIN; Maximum Operating Temperature: 175 Cel;

LOGIC LEVEL COMPATIBLE

60 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

40 V

80 A

80 A

.0052 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

94 W

400 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPP039N04LGXKSA1 by Infineon Technologies

IPP039N04LGXKSA1

Infineon Technologies

IPP039N04LGXKSA1 by Infineon Technologies is a N-CHANNEL FET with 40V DS Breakdown Voltage, 400A IDM, and 0.0052 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 175°C, making it suitable for high-power tasks.

LOGIC LEVEL COMPATIBLE

60 mJ

SINGLE WITH BUILT-IN DIODE

40 V

80 A

80 A

.0052 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

94 W

400 A

Not Qualified

FET General Purpose Power

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPB60R299CPATMA1 by Infineon Technologies

IPB60R299CPATMA1

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Qualification: Not Qualified; JESD-30 Code: R-PSSO-G2; No. of Elements: 1;

290 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

600 V

11 A

.299 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

34 A

Not Qualified

YES

TIN

GULL WING

SINGLE

SWITCHING

SILICON