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IPA65R110CFDXKSA1

Infineon Technologies

IPA65R110CFDXKSA1 by Infineon Technologies

Infineon's IPA65R110CFDXKSA1 is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 99.6A IDM, 845mJ EAS, and 0.11 ohm RDS(ON). Operating from -55 to 150 °C, it has a max power dissipation of 34.7W in a RECTANGULAR package with THROUGH-HOLE terminals.

Median Price

$1.750

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 9 parts In-Stock

1+ parts

$1.750

100+ parts

-

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9

$1.750

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Distributors (In-Stock)

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Digiode

USA . 14 parts In-Stock

1+ parts

$1.938

100+ parts

-

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14

$1.938

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$4.085

100+ parts

-

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200

$4.085

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Vyrian

USA . 4,408 parts In-Stock

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4,408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$0.763

100+ parts

$0.694

1k+ parts

$0.626

10k+ parts

-

5,000

$0.763

$0.694

$0.626

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Modulus Dynamics

Lithuania . 6,548 parts In-Stock

1+ parts

$1.447

100+ parts

$1.389

1k+ parts

$1.331

10k+ parts

-

6,548

$1.447

$1.389

$1.331

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Ampacity Inc.

Singapore . 9 parts In-Stock

1+ parts

$1.490

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9

$1.490

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Corphita

USA . 598 parts In-Stock

1+ parts

$1.836

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598

$1.836

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Netroflash

USA . 100 parts In-Stock

1+ parts

$4.085

100+ parts

$4.003

1k+ parts

$3.881

10k+ parts

$3.799

100

$4.085

$4.003

$3.881

$3.799

Continental Prestige Electronics

USA . 577 parts In-Stock

1+ parts

$5.400

100+ parts

$3.510

1k+ parts

$3.180

10k+ parts

-

577

$5.400

$3.510

$3.180

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AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$9.061

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633

$9.061

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Microchip USA

USA . 9,592 parts In-Stock

1+ parts

$28.939

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9,592

$28.939

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Perfect Parts

USA . 23,520 parts In-Stock

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23,520

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of innovation with the IPA65R110CFDXKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch Power Field Effect Transistors that provide unmatched reliability and performance. Ideal for switching applications, this N-CHANNEL transistor offers a breakthrough in efficiency and durability. With a minimum DS Breakdown Voltage of 650V and a maximum Pulsed Drain Current of 99.6A, this transistor is designed to meet the most demanding requirements. Experience the seamless operation and exceptional quality that only Infineon Technologies can offer. Elevate your projects with the IPA65R110CFDXKSA1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and are more commonly used in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and can offer better protection against back EMF.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications safely and effectively.

Terminal Form: THROUGH-HOLE

Through-hole terminals are easier to solder and provide a more secure connection compared to surface mount options.

Maximum Power Dissipation (Abs): 34.7 W

With a high power dissipation rating, this FET can handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this FET to be used in a wide variety of environments and applications.

Technical Specifications

Power Field Effect Transistors (FET) IPA65R110CFDXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

845 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

31.2 A

Maximum Drain Current (ID):

31.2 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

99.6 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA65R110CFDXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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