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IPA60R165CPXKSA1

Infineon Technologies

IPA60R165CPXKSA1 by Infineon Technologies

Infineon's IPA60R165CPXKSA1 is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. Featuring a single configuration with built-in diode, it offers 61A max pulsed drain current and 0.165 ohm max RDS(on). With a package style of flange mount and operating temperature up to 150°C, this MOSFET is suitable for high-power electronics.

Median Price

$4.470

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 499 parts In-Stock

1+ parts

$4.470

100+ parts

$3.040

1k+ parts

$2.620

10k+ parts

-

499

$4.470

$3.040

$2.620

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Element14

Singapore . 486 parts In-Stock

1+ parts

$5.788

100+ parts

$3.590

1k+ parts

$3.013

10k+ parts

-

486

$5.788

$3.590

$3.013

-

Farnell

UK . 486 parts In-Stock

1+ parts

$6.214

100+ parts

$3.478

1k+ parts

$2.915

10k+ parts

-

486

$6.214

$3.478

$2.915

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Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.690

1k+ parts

$1.510

10k+ parts

$1.420

500

-

$1.690

$1.510

$1.420

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.887

10k+ parts

$1.775

500

-

-

$1.887

$1.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 864 parts In-Stock

1+ parts

$1.900

100+ parts

-

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-

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864

$1.900

-

-

-

Chip Stock

USA . 30,916 parts In-Stock

1+ parts

-

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30,916

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Vyrian

USA . 6,680 parts In-Stock

1+ parts

-

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6,680

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 942 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

942

$1.800

-

-

-

Modulus Dynamics

Lithuania . 860 parts In-Stock

1+ parts

$1.937

100+ parts

$1.860

1k+ parts

$1.782

10k+ parts

-

860

$1.937

$1.860

$1.782

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Continental Prestige Electronics

USA . 491 parts In-Stock

1+ parts

$4.100

100+ parts

$3.020

1k+ parts

$2.120

10k+ parts

-

491

$4.100

$3.020

$2.120

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Microchip USA

USA . 6,574 parts In-Stock

1+ parts

$23.130

100+ parts

-

1k+ parts

-

10k+ parts

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6,574

$23.130

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

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Perfect Parts

USA . 253 parts In-Stock

1+ parts

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253

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Overview

Unleash the power of innovation with the IPA60R165CPXKSA1 by Infineon Technologies, a leader in Power Field Effect Transistors. Designed for switching applications, this N-CHANNEL transistor offers a breakthrough in performance and reliability. With a high DS breakdown voltage of 650V and a maximum pulsed drain current of 61A, this transistor delivers unmatched efficiency and durability. Whether you're looking to optimize your power management system or enhance your electronic designs, the IPA60R165CPXKSA1 is the ultimate solution for all your needs. Experience the Infineon advantage today and take your projects to the next level.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type - N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration - SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit against voltage spikes and reverse currents, enhancing the overall reliability of the product.

Transistor Application - SWITCHING

Designed specifically for switching applications, offering fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage - 650 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for applications requiring high power handling capabilities.

Maximum Pulsed Drain Current (IDM) - 61 A

Capable of handling high current pulses, making it suitable for applications with short-duration peak currents.

Maximum Operating Temperature - 150 °C

Can operate efficiently at high temperatures, allowing for use in environments where temperature fluctuations are common.

Technical Specifications

Power Field Effect Transistors (FET) IPA60R165CPXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

522 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

61 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA60R165CPXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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