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SPP04N80C3XKSA1

Infineon Technologies

SPP04N80C3XKSA1 by Infineon Technologies

Infineon's SPP04N80C3XKSA1 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for SWITCHING applications. It features 12A IDM, 170mJ EAS, and 1.3 ohm RDS(on). The transistor operates in ENHANCEMENT MODE at up to 150°C, making it suitable for high-power systems.

Median Price

$1.760

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 195 parts In-Stock

1+ parts

$1.430

100+ parts

$0.780

1k+ parts

$0.524

10k+ parts

$0.499

195

$1.430

$0.780

$0.524

$0.499

Mouser Electronics

USA . 42 parts In-Stock

1+ parts

$2.090

100+ parts

$0.906

1k+ parts

$0.664

10k+ parts

-

42

$2.090

$0.906

$0.664

-

Arrow

USA . 2,993 parts In-Stock

1+ parts

$2.099

100+ parts

$0.952

1k+ parts

$0.648

10k+ parts

$0.593

2,993

$2.099

$0.952

$0.648

$0.593

Element14

Singapore . 195 parts In-Stock

1+ parts

$2.410

100+ parts

$1.430

1k+ parts

$0.926

10k+ parts

$0.881

195

$2.410

$1.430

$0.926

$0.881

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.874

10k+ parts

$0.701

6,000

-

-

$0.874

$0.701

EBV Elektronik

Germany . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Rochester

USA . 213 parts In-Stock

1+ parts

-

100+ parts

$0.789

1k+ parts

$0.655

10k+ parts

$0.584

213

-

$0.789

$0.655

$0.584

Distrelec

Netherlands . 25 parts In-Stock

1+ parts

-

100+ parts

-

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-

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25

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 258 parts In-Stock

1+ parts

$0.484

100+ parts

-

1k+ parts

-

10k+ parts

-

258

$0.484

-

-

-

Vyrian

USA . 254 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$0.510

-

-

-

NAC Semi

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.060

10k+ parts

-

1,000

-

-

$2.060

-

IBS Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.020

1k+ parts

$1.949

10k+ parts

-

500

-

$2.020

$1.949

-

Rutronik

Germany . 300 parts In-Stock

1+ parts

-

100+ parts

$0.748

1k+ parts

$0.598

10k+ parts

$0.577

300

-

$0.748

$0.598

$0.577

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,238 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

10k+ parts

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1,238

$0.433

-

-

-

Corphita

USA . 208 parts In-Stock

1+ parts

$0.459

100+ parts

-

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-

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208

$0.459

-

-

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Modulus Dynamics

Lithuania . 20,752 parts In-Stock

1+ parts

$1.440

100+ parts

$1.382

1k+ parts

$1.325

10k+ parts

-

20,752

$1.440

$1.382

$1.325

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Microchip USA

USA . 5,968 parts In-Stock

1+ parts

$12.350

100+ parts

-

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5,968

$12.350

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Perfect Parts

USA . 11,585 parts In-Stock

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11,585

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Glotronic Ltd.

UK . 244 parts In-Stock

1+ parts

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244

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Enhance your power applications with the SPP04N80C3XKSA1 by Infineon Technologies. Manufactured with precision and quality, this N-channel Power FET is designed for switching operations, offering a maximum drain current of 4A and a low on-resistance of 1.3 ohms. With its single configuration and built-in diode, this transistor provides reliable performance and efficiency. Whether you need to control high voltages or handle pulsed currents, this FET delivers superior functionality and value. Upgrade your power systems with the SPP04N80C3XKSA1 for optimal performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling and protection against reverse current flow, making this product suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency in these types of circuits.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this transistor can handle high voltages and provide robust protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder and securely connect the transistor in a circuit board.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low on-resistance, making this product ideal for high-frequency switching applications.

Maximum Pulsed Drain Current (IDM): 12 A

With a high pulsed drain current rating, this transistor can handle transient current spikes without failure.

Avalanche Energy Rating (EAS): 170 mJ

The high avalanche energy rating ensures that the transistor can withstand high-energy spikes and surges without damage.

No. of Terminals: 3

The 3-terminal design allows for easy connection in a circuit and provides flexibility in circuit design.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and heatsinking of the transistor, ensuring optimal thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-resistance and high switching speeds, making this product highly efficient for switching applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability and performance, making this product a durable choice for various applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring secure connections in a circuit.

Maximum Drain Current (ID): 4 A

With a high maximum drain current rating, this transistor can handle moderate current loads without overheating or failure.

Maximum Drain-Source On Resistance: 1.3 ohm

The low on-resistance allows for efficient power transfer and minimal power loss in the transistor, resulting in higher efficiency.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and integration, providing ease of use for the end user.

Technical Specifications

Power Field Effect Transistors (FET) SPP04N80C3XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

170 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

1.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPP04N80C3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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