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SPP06N80C3XK

Infineon Technologies

SPP06N80C3XK by Infineon Technologies

SPP06N80C3XK by Infineon is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and can handle up to 18A pulsed drain current. Operating in enhancement mode, this MOSFET has a max operating temperature of 150°C and 0.9 ohm on-resistance.

Median Price

$5.420

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 21,413 parts In-Stock

1+ parts

$5.420

100+ parts

$1.300

1k+ parts

$0.843

10k+ parts

$0.810

21,413

$5.420

$1.300

$0.843

$0.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 565 parts In-Stock

1+ parts

$5.149

100+ parts

-

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565

$5.149

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Vyrian

USA . 2,277 parts In-Stock

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2,277

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

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Corohmni

South Africa . 130 parts In-Stock

1+ parts

$0.749

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-

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130

$0.749

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.571

100+ parts

$1.492

1k+ parts

$1.492

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-

500

$1.571

$1.492

$1.492

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Aztec Data Supply Inc.

USA . 659 parts In-Stock

1+ parts

$1.850

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659

$1.850

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Modulus Dynamics

Lithuania . 5,475 parts In-Stock

1+ parts

$1.909

100+ parts

$1.833

1k+ parts

$1.756

10k+ parts

-

5,475

$1.909

$1.833

$1.756

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Ampacity Inc.

Singapore . 21,109 parts In-Stock

1+ parts

$4.610

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21,109

$4.610

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Semicontronic

India . 20,975 parts In-Stock

1+ parts

$4.610

100+ parts

$4.495

1k+ parts

$4.472

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20,975

$4.610

$4.495

$4.472

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Corphita

USA . 29 parts In-Stock

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$4.878

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29

$4.878

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AZTECH Wire

Italy . 122 parts In-Stock

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$22.180

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122

$22.180

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Component Stockers USA

USA . 556 parts In-Stock

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$99.990

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556

$99.990

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Continental Prestige Electronics

USA . 3,149 parts In-Stock

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3,149

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Argo Parts USA

USA . 2,643 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 237 parts In-Stock

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237

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Overview

Unlock the power of innovation with the SPP06N80C3XK by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a minimum DS Breakdown Voltage of 800V and a maximum Drain Current of 6A, this transistor is designed to exceed expectations. Whether you're looking to enhance your electronic devices or improve energy efficiency, the SPP06N80C3XK delivers exceptional quality and reliability. Experience the difference with this cutting-edge technology and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient and effective switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances overall system performance.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal functionality in such scenarios.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET offers robust protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular package shape provides easy installation and space-saving solutions.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections for better electrical performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for improved control and efficiency during use.

Maximum Pulsed Drain Current (IDM): 18 A

High pulsed drain current rating makes it suitable for demanding applications with peak power requirements.

Avalanche Energy Rating (EAS): 230 mJ

High avalanche energy rating ensures protection against voltage surges and transient events.

No. of Terminals: 3

Three terminals provide simple and efficient connectivity options for various circuit configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers mechanical stability and ease of mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOS technology for enhanced performance and reliability.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures stable performance in harsh environments.

Transistor Element Material: SILICON

Silicon transistor element material offers efficient electrical properties for high-performance applications.

Maximum Drain Current (ID): 6 A

With a high drain current rating, this FET can handle substantial power loads with ease.

Maximum Drain-Source On Resistance: 0.9 ohm

Low drain-source on resistance minimizes power loss and improves overall efficiency.

Terminal Position: SINGLE

Single terminal position simplifies installation and ensures a compact and space-saving design.

Technical Specifications

Power Field Effect Transistors (FET) SPP06N80C3XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

230 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPP06N80C3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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