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SPP08P06PHXK

Infineon Technologies

SPP08P06PHXK by Infineon Technologies

SPP08P06PHXK by Infineon is a P-CHANNEL FET with 60V DS Breakdown Voltage and 35.2A IDM. Ideal for power applications, it features a built-in diode, 0.3 ohm RDS(on), and 70mJ EAS rating. The FLANGE MOUNT package with THROUGH-HOLE terminals suits various enhancement mode operations.

Median Price

$0.815

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.815

100+ parts

-

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50

$0.815

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Vyrian

USA . 760 parts In-Stock

1+ parts

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760

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Digiode

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,081 parts In-Stock

1+ parts

$0.815

100+ parts

-

1k+ parts

-

10k+ parts

$0.799

6,081

$0.815

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$0.799

Argo Parts USA

USA . 1,269 parts In-Stock

1+ parts

$0.815

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1,269

$0.815

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Modulus Dynamics

Lithuania . 15,580 parts In-Stock

1+ parts

$1.259

100+ parts

$1.209

1k+ parts

$1.158

10k+ parts

-

15,580

$1.259

$1.209

$1.158

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Aztec Data Supply Inc.

USA . 4,773 parts In-Stock

1+ parts

$1.390

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4,773

$1.390

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Corohmni

South Africa . 290 parts In-Stock

1+ parts

$1.896

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290

$1.896

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Semicontronic

India . 1,411 parts In-Stock

1+ parts

$6.050

100+ parts

$5.899

1k+ parts

$5.868

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-

1,411

$6.050

$5.899

$5.868

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AZTECH Wire

Italy . 593 parts In-Stock

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$18.352

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593

$18.352

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Andel Nordic

Denmark . 4,261 parts In-Stock

1+ parts

$34.450

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$24.114

10k+ parts

$24.114

4,261

$34.450

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$24.114

$24.114

Ampacity Inc.

Singapore . 674 parts In-Stock

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$49.050

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674

$49.050

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Perfect Parts

USA . 2,518 parts In-Stock

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2,518

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Corphita

USA . 116 parts In-Stock

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116

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$0.799

1k+ parts

$0.774

10k+ parts

$0.758

50

-

$0.799

$0.774

$0.758

Overview

Upgrade your power management solutions with the SPP08P06PHXK by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers high-quality Power Field Effect Transistors that offer exceptional performance and reliability. With a P-CHANNEL configuration and built-in diode, this FET is perfect for various applications. From enhancing efficiency to increasing power capabilities, this product provides value, benefits, and advantages that will exceed your expectations. Experience seamless power control with the SPP08P06PHXK and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliable performance and durability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs generally have lower ON resistances and higher current carrying capabilities compared to N-channel FETs, making them suitable for a variety of applications.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can withstand higher voltages without breakdown, making it suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse currents, enhancing the overall performance of the transistor.

Maximum Pulsed Drain Current (IDM): 35.2 A

Capable of handling high current pulses, making it suitable for applications with sudden power demands or short-duration peaks.

Avalanche Energy Rating (EAS): 70 mJ

High avalanche energy rating ensures the FET can withstand voltage spikes and transients, improving reliability in harsh operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds, low input capacitance, and high input impedance, making it suitable for high-frequency applications.

Maximum Drain Current (ID): 8.8 A

Capable of handling continuous high current levels, suitable for applications requiring sustained power delivery.

Maximum Drain-Source On Resistance: 0.3 ohm

Low ON resistance leads to reduced power losses and improved efficiency in the circuit, making it a good choice for power management applications.

Technical Specifications

Power Field Effect Transistors (FET) SPP08P06PHXK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

70 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

8.8 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

35.2 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

SPP08P06PHXK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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