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SPP08P06PHXKSA1

Infineon Technologies

SPP08P06PHXKSA1 by Infineon Technologies

SPP08P06PHXKSA1 by Infineon Technologies is a P-CHANNEL Power FET with 60V DS Breakdown Voltage and 35.2A IDM. Ideal for applications requiring high drain current handling, such as power supplies and motor control systems. Features include a built-in diode, 0.3 ohm RDS(on), and 70mJ EAS rating.

Median Price

$0.353

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.353

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-

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450

$0.353

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Chip Stock

USA . 312,500 parts In-Stock

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312,500

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Vyrian

USA . 4,096 parts In-Stock

1+ parts

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4,096

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Digiode

USA . 991 parts In-Stock

1+ parts

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991

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Bristol Electronics

USA . 143 parts In-Stock

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,700 parts In-Stock

1+ parts

$0.353

100+ parts

-

1k+ parts

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$0.346

1,700

$0.353

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$0.346

Argo Parts USA

USA . 1,118 parts In-Stock

1+ parts

$0.353

100+ parts

-

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10k+ parts

$0.342

1,118

$0.353

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-

$0.342

Modulus Dynamics

Lithuania . 25,153 parts In-Stock

1+ parts

$0.353

100+ parts

$0.339

1k+ parts

$0.325

10k+ parts

-

25,153

$0.353

$0.339

$0.325

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Corohmni

South Africa . 577 parts In-Stock

1+ parts

$0.353

100+ parts

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577

$0.353

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Aztec Data Supply Inc.

USA . 7,467 parts In-Stock

1+ parts

$0.420

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7,467

$0.420

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.783

100+ parts

$1.623

1k+ parts

$1.462

10k+ parts

-

2,000

$1.783

$1.623

$1.462

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AZTECH Wire

Italy . 516 parts In-Stock

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$12.563

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516

$12.563

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Semicontronic

India . 340 parts In-Stock

1+ parts

$17.050

100+ parts

$16.624

1k+ parts

$16.538

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340

$17.050

$16.624

$16.538

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Ampacity Inc.

Singapore . 387 parts In-Stock

1+ parts

$38.050

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387

$38.050

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 2,184 parts In-Stock

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Microchip USA

USA . 158 parts In-Stock

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158

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$0.346

1k+ parts

$0.335

10k+ parts

$0.328

100

-

$0.346

$0.335

$0.328

Corphita

USA . 60 parts In-Stock

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60

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Overview

Upgrade your power systems with the SPP08P06PHXKSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon brings you high-quality Power Field Effect Transistors (FET) with unparalleled performance and reliability. Whether you're designing for automotive, industrial, or consumer electronics applications, this P-CHANNEL transistor with a built-in diode offers superior efficiency and protection. Say goodbye to power limitations and hello to endless possibilities with the SPP08P06PHXKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term performance.

Polarity or Channel Type: P-CHANNEL

Suitable for specific circuit configurations and applications requiring P-channel FETs.

Minimum DS Breakdown Voltage: 60 V

Allows for safe operation within a range of voltages, suitable for various applications.

Maximum Pulsed Drain Current (IDM): 35.2 A

Capable of handling high transient currents, making it reliable in power applications.

Avalanche Energy Rating (EAS): 70 mJ

Provides protection against energy spikes and ensures reliable performance under adverse conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and fast switching speeds, ideal for power management applications.

Maximum Drain Current (ID): 8.8 A

Allows for sustained high currents, suitable for power delivery applications.

Maximum Drain-Source On Resistance: 0.3 ohm

Low on-resistance results in minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) SPP08P06PHXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

70 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

8.8 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

35.2 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

SPP08P06PHXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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