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BUTT Other Function Telecom Interface ICs 34

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
AFEM-S106-BLKG by Broadcom

AFEM-S106-BLKG

Broadcom

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Code: HBCC; Package Shape: SQUARE;

S-XBCC-B14

3.2 mm

3

1

14

85 Cel

-30 Cel

UNSPECIFIED

HBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

3.3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

BOTTOM

3.2 mm

AFEM-S106-TR1G by Broadcom

AFEM-S106-TR1G

Broadcom

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Code: HBCC; Package Shape: SQUARE;

S-XBCC-B14

3.2 mm

3

1

14

85 Cel

-30 Cel

UNSPECIFIED

HBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

3.3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

BOTTOM

3.2 mm

WL1801MODGBMOCR by Texas Instruments

WL1801MODGBMOCR

Texas Instruments

WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCR by Texas Instruments

WL1805MODGBMOCR

Texas Instruments

Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCT by Texas Instruments

WL1805MODGBMOCT

Texas Instruments

WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1831MODGBMOCT by Texas Instruments

WL1831MODGBMOCT

Texas Instruments

WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

BGS12AL74E6327XTSA1 by Infineon Technologies

BGS12AL74E6327XTSA1

Infineon Technologies

Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.

R-XBCC-B6

e4

2.3 mm

1

1

6

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.5 mm

2.8 V

YES

TELECOM CIRCUIT

OTHER

GOLD

BUTT

.55 mm

BOTTOM

1.5 mm

BGS12AL76E6327XTMA1 by Infineon Technologies

BGS12AL76E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B6

e4

1.26 mm

1

1

6

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

2.8 V

YES

TELECOM CIRCUIT

OTHER

GOLD

BUTT

.48 mm

BOTTOM

1.4 mm

BGS12SL6E6327XTSA1 by Infineon Technologies

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B6

1.1 mm

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

.32 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

NOT SPECIFIED

.7 mm

MGA-43040-BLKG by Broadcom

MGA-43040-BLKG

Broadcom

TELECOM CIRCUIT; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HVBCC; Package Shape: SQUARE; Nominal Supply Voltage: 5 V;

S-XBCC-B28

5 mm

1

28

UNSPECIFIED

HVBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.91 mm

5 V

YES

TELECOM CIRCUIT

BUTT

.5 mm

BOTTOM

5 mm

MGA-43040-TR1G by Broadcom

MGA-43040-TR1G

Broadcom

TELECOM CIRCUIT; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HVBCC; Package Shape: SQUARE; No. of Functions: 1;

S-XBCC-B28

5 mm

1

28

UNSPECIFIED

HVBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.91 mm

5 V

YES

TELECOM CIRCUIT

BUTT

.5 mm

BOTTOM

5 mm

AMMP-6532-BLKG by Broadcom

AMMP-6532-BLKG

Broadcom

TELECOM CIRCUIT; Terminal Form: BUTT; No. of Terminals: 8; Package Code: BCC; Package Shape: SQUARE; Terminal Finish: NICKEL GOLD;

S-XBCC-B8

e4

5.215 mm

3

1

8

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

260

Not Qualified

2.25 mm

3 V

YES

TELECOM CIRCUIT

NICKEL GOLD

BUTT

BOTTOM

20

5.215 mm

AMMP-6532-TR1G by Broadcom

AMMP-6532-TR1G

Broadcom

TELECOM CIRCUIT; Terminal Form: BUTT; No. of Terminals: 8; Package Code: BCC; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-XBCC-B8

e4

5.215 mm

3

1

8

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

260

Not Qualified

2.25 mm

3 V

YES

TELECOM CIRCUIT

NICKEL GOLD

BUTT

BOTTOM

20

5.215 mm

XCC2564MODNCMOET by Texas Instruments

XCC2564MODNCMOET

Texas Instruments

Texas Instruments XCC2564MODNCMOET is a 33-terminal SQUARE CHIP CARRIER IC with operating temperatures from -20 to 70°C. It's a TELECOM CIRCUIT suitable for telecom interfaces, featuring a nominal voltage of 3.6V and surface mount compatibility.

S-XBCC-B33

7 mm

1

33

70 Cel

-20 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

1.4 mm

3.6 V

YES

TELECOM CIRCUIT

OTHER

BUTT

BOTTOM

7 mm

ZED-F9P-01B by U-blox Ag

ZED-F9P-01B

U-blox Ag

ZED-F9P-01B by U-blox Ag is a GNSS Module with 54 terminals, operating temperature range of -40 to 85°C. It is surface mountable and suitable for industrial applications requiring precise positioning and timing accuracy.

R-XBGA-B54

1

54

85 Cel

-40 Cel

LGA

RECTANGULAR

GRID ARRAY

TS 16949

3 V

YES

GNSS Module

INDUSTRIAL

BUTT

BOTTOM

BGS13SL9E6327XTSA1 by Infineon Technologies

BGS13SL9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 9; Package Code: BCC; Package Shape: SQUARE;

S-XBCC-B9

1.15 mm

1

9

85 Cel

-30 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

.32 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

1.15 mm

WL1807MODGIMOCT by Texas Instruments

WL1807MODGIMOCT

Texas Instruments

WL1807MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -40 to 85°C, it has a nominal voltage of 3.7V and supports data rates up to 100 Mbps. Ideal for industrial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

SL3S1202FTB1,115 by NXP Semiconductors

SL3S1202FTB1,115

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;

R-PBCC-B3

e3

1.45 mm

1

1

3

85 Cel

-40 Cel

PLASTIC/EPOXY

BCC

LCC3(UNSPEC)

RECTANGULAR

CHIP CARRIER

260

Not Qualified

.5 mm

Other Telecom ICs

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.55 mm

BOTTOM

30

1 mm

SARA-U260-00S by U-blox Ag

SARA-U260-00S

U-blox Ag

SARA-U260-00S by U-blox Ag is a telecom IC with 96 terminals, operating temperature range of -40 to 85°C. It has a compact rectangular package style, suitable for industrial applications requiring a nominal voltage of 3.8V. With surface mount capability and low profile design, it is ideal for space-constrained environments.

R-XXMA-B96

26 mm

4

1

96

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3 mm

3.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

UNSPECIFIED

16 mm

SARA-U270-03S by U-blox Ag

SARA-U270-03S

U-blox Ag

SARA-U270-03S by U-blox Ag is a telecom IC with 96 terminals, operating at -40 to 85°C. It has a supply voltage of 3.8V and MSL level of 4, suitable for industrial applications requiring surface mount technology in compact microelectronic assemblies.

R-XXMA-B96

26 mm

4

1

96

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.25 mm

3.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

UNSPECIFIED

16 mm

SARA-U201-03B by U-blox Ag

SARA-U201-03B

U-blox Ag

SARA-U201-03B by U-blox Ag is a telecom IC with 96 terminals, operating at -40 to 85°C. It has a supply voltage of 3.8V and compact dimensions of 16mm x 26mm x 3.25mm. Ideal for industrial applications requiring reliable telecom circuitry in surface-mount packages.

R-XXMA-B96

26 mm

4

1

96

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.25 mm

3.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

UNSPECIFIED

16 mm

BGM111E256V2 by Silicon Labs

BGM111E256V2

Silicon Labs

Silicon Labs BGM111E256V2 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm, suitable for TELECOM CIRCUIT applications in INDUSTRIAL settings.

R-XXMA-B31

15 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.15 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

1.2 mm

UNSPECIFIED

12.9 mm

ADRF5044BCCZN by Analog Devices

ADRF5044BCCZN

Analog Devices

Analog Devices' ADRF5044BCCZN is a 24-terminal SQUARE IC with -40 to 85°C temp range. Ideal for TELECOM CIRCUITS, it operates at 3.3V, has a 0.5mm terminal pitch, and MSL of 3.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

BGS13PN10E6327XTSA1 by Infineon Technologies

BGS13PN10E6327XTSA1

Infineon Technologies

BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.

R-XBCC-B10

e3

1.5 mm

1

1

10

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

2.85 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.4 mm

BOTTOM

1.1 mm

BGS18GA14E6327XTSA1 by Infineon Technologies

BGS18GA14E6327XTSA1

Infineon Technologies

BGS18GA14E6327XTSA1 by Infineon Technologies is a telecom interface IC with 14 terminals in a square package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits requiring a nominal voltage of 3V. With surface mount capability and compact dimensions of 2x2mm, it is ideal for microelectronic assembly applications.

S-XQMA-B14

2 mm

1

1

14

85 Cel

-30 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

.65 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BUTT

QUAD

2 mm

ADRF5045BCCZN-R7 by Analog Devices

ADRF5045BCCZN-R7

Analog Devices

Analog Devices' ADRF5045BCCZN-R7 is a 24-terminal IC with -40 to 85°C operating temp, suitable for telecom circuits. It features a 3.3V nominal voltage, 0.5mm terminal pitch, and industrial temperature grade. The package style is grid array with heat sink/slug in a square shape, making it ideal for surface mount applications.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

ADRF5045BCCZN by Analog Devices

ADRF5045BCCZN

Analog Devices

Analog Devices' ADRF5045BCCZN is a 24-terminal SQUARE IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3V supply voltage and nickel palladium gold finish. The GRID ARRAY package style with 0.5mm pitch makes it suitable for industrial use in telecom interfaces.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

ADRF5044BCCZN-R7 by Analog Devices

ADRF5044BCCZN-R7

Analog Devices

Analog Devices' ADRF5044BCCZN-R7 is a 24-terminal SQUARE package IC with -40 to 85 °C operating temp. Ideal for TELECOM CIRCUIT applications, it has a 3.3 V nominal voltage and 0.5 mm terminal pitch. With NICKEL PALLADIUM GOLD finish, it suits INDUSTRIAL-grade telecom interfaces.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

BGS110MN20E6327XTSA1 by Infineon Technologies

BGS110MN20E6327XTSA1

Infineon Technologies

BGS110MN20E6327XTSA1 by Infineon is a 20-terminal telecom IC with a nominal voltage of 3.5V. It operates b/w -30°C to 85°C, in a square chip carrier package style. With terminals at the bottom and 0.4mm pitch, it's ideal for telecom interface applications.

S-XBCC-B20

2.3 mm

1

1

20

85 Cel

-30 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

.77 mm

3.5 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

2.3 mm

BGA5M1BN6E6327XTSA1 by Infineon Technologies

BGA5M1BN6E6327XTSA1

Infineon Technologies

Infineon's BGA5M1BN6E6327XTSA1 is a RECTANGULAR CHIP CARRIER with 6 terminals, operating from -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT IC with a supply voltage of 1.8V, suitable for telecom interface applications due to its compact size and surface-mount capability.

R-XBCC-B6

1.1 mm

1

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

.7 mm

ADAR1000ACCZN-R7 by Analog Devices

ADAR1000ACCZN-R7

Analog Devices

ADAR1000ACCZN-R7 by Analog Devices is a telecom IC with 88 terminals, operating temp range of -40 to 85°C. It has a nominal voltage of 3.3V and negative supply voltage of -5V. Ideal for telecom circuits, this IC comes in a square package style with surface mount feature.

S-PBGA-B88

7 mm

3

-5 V

1

88

85 Cel

-40 Cel

PLASTIC/EPOXY

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.5 mm

BOTTOM

7 mm

ADAR1000ACCZN by Analog Devices

ADAR1000ACCZN

Analog Devices

ADAR1000ACCZN by Analog Devices is a telecom IC with 88 terminals in a grid array package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V and negative supply voltage of -5V. This IC is designed for telecom circuits requiring precise temperature control and industrial-grade performance.

S-PBGA-B88

7 mm

-5 V

1

88

85 Cel

-40 Cel

PLASTIC/EPOXY

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

NOT SPECIFIED

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.5 mm

BOTTOM

NOT SPECIFIED

7 mm

BGAU1A10E6327XTSA1 by Infineon Technologies

BGAU1A10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B10

1.5 mm

1

1

10

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.65 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

1.1 mm

ZED-F9T-00B by U-blox Ag

ZED-F9T-00B

U-blox Ag

ZED-F9T-00B by U-blox Ag is a 54-terminal RECTANGULAR GRID ARRAY IC with -40 to 85 °C temp range. Ideal for TELECOM CIRCUIT applications, it operates at 3V with 1.1mm terminal pitch and AEC-Q100 screening level.

R-XBGA-B54

22 mm

4

1

54

85 Cel

-40 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

AEC-Q100

2.6 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

1.1 mm

BOTTOM

17 mm