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AMMP-6532-TR1G

Broadcom

AMMP-6532-TR1G by Broadcom

TELECOM CIRCUIT; Terminal Form: BUTT; No. of Terminals: 8; Package Code: BCC; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

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Vyrian

USA . 2,516 parts In-Stock

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Digiode

USA . 393 parts In-Stock

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Native Components

USA . 414 parts In-Stock

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$0.293

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Northwest PG Solutions

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Decca Corp

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AZTECH Wire

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Component Stockers USA

USA . 474 parts In-Stock

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$99.990

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Supply Digital

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Corphita

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Technical Specifications

Other Function Telecom Interface ICs AMMP-6532-TR1G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

S-XBCC-B8

JESD-609 Code:

e4

Length:

5.215 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.25 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

5.215 mm

Trade Compliance

AMMP-6532-TR1G Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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