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INDUSTRIAL Other Function Telecom Interface ICs 799

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
AD9363ABCZ by Analog Devices

AD9363ABCZ

Analog Devices

AD9363ABCZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features a low profile design and ball terminal form.

S-PBGA-B144

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

10 mm

ADS58J64IRMPR by Texas Instruments

ADS58J64IRMPR

Texas Instruments

ADS58J64IRMPR by Texas Instruments is a telecom interface IC with 72 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a max analog input of 2V, and nominal voltage of 1.15V. Ideal for industrial applications requiring high-speed data processing in compact form factors.

2 V

S-XQCC-N72

e4

10 mm

3

1

72

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.15 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

10 mm

ADS58J64IRMPT by Texas Instruments

ADS58J64IRMPT

Texas Instruments

Texas Instruments ADS58J64IRMPT is a 72-terminal IC with max analog input of 2V. Ideal for telecom circuits, it operates b/w -40 to 85°C, featuring a compact square chip carrier package style at just 0.9mm height.

2 V

S-XQCC-N72

e4

10 mm

3

1

72

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.15 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

10 mm

ATA8210-GHQW by Microchip Technology

ATA8210-GHQW

Microchip Technology

ATA8210-GHQW by Microchip Technology is a 32-terminal telecom IC with 0.08 Mbps data rate. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Surface mountable chip carrier package style with matte tin finish, ideal for telecom interface circuits.

.08 Mbps

S-XQCC-N32

e3

5 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

5 mm

ATA8215-GHQW by Microchip Technology

ATA8215-GHQW

Microchip Technology

ATA8215-GHQW by Microchip Technology is a 32-terminal telecom IC with 0.08 Mbps data rate. It operates b/w -40 to 85 °C, suitable for industrial use. This square chip carrier has a very thin profile and matte tin finish, ideal for telecom circuit applications.

.08 Mbps

S-XQCC-N32

e3

5 mm

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

5 mm

SPWF04SA by STMicroelectronics

SPWF04SA

STMicroelectronics

SPWF04SA by STMicroelectronics is a telecom IC with 30 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.524mm. Ideal for industrial applications requiring compact surface mount telecom interface ICs.

R-XXMA-N30

26.924 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.3 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.524 mm

UNSPECIFIED

NOT SPECIFIED

15.24 mm

SPWF04SC by STMicroelectronics

SPWF04SC

STMicroelectronics

SPWF04SC by STMicroelectronics is a compact telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a 3.3V nominal voltage and comes in a rectangular package with 30 terminals. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

R-XXMA-N30

26.924 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.3 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.524 mm

UNSPECIFIED

NOT SPECIFIED

15.24 mm

PI3USB30532ZLE by Diodes Incorporated

PI3USB30532ZLE

Diodes Incorporated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-XQCC-N40

6 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

3 mm

EFR32BG1B232F256GJ43-C0 by Silicon Labs

EFR32BG1B232F256GJ43-C0

Silicon Labs

EFR32BG1B232F256GJ43-C0 by Silicon Labs is a 43-terminal IC with telecom circuit type, operating at -40 to 85°C. It has a nominal voltage of 3.3V and uses ball terminal form. This industrial-grade IC in grid array package is ideal for telecom interface applications.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

EFR32BG1P332F256GJ43-C0 by Silicon Labs

EFR32BG1P332F256GJ43-C0

Silicon Labs

EFR32BG1P332F256GJ43-C0 by Silicon Labs is a Telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and tin silver copper finish. Ideal for telecom circuits, it has a very thin profile and fine pitch design for industrial applications.

R-PBGA-B43

e1

3.295 mm

1

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

40

3.143 mm

EFR32BG1V132F256GJ43-C0 by Silicon Labs

EFR32BG1V132F256GJ43-C0

Silicon Labs

EFR32BG1V132F256GJ43-C0 by Silicon Labs is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and 0.4mm pitch, suitable for industrial applications requiring thin profile and fine pitch components.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

HMC8108LC5TR-R5 by Analog Devices

HMC8108LC5TR-R5

Analog Devices

Analog Devices' HMC8108LC5TR-R5 is a 32-terminal telecom IC with a square chip carrier package. Operating b/w -40 to 85 °C, it has a peak reflow temp of 260°C and terminal pitch of 0.5mm. Ideal for telecom circuits, this industrial-grade IC suits applications requiring compact design and high-temperature tolerance.

S-XQCC-N32

4.9 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.12 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4.9 mm

HMC8108LC5TR by Analog Devices

HMC8108LC5TR

Analog Devices

Analog Devices' HMC8108LC5TR is a 32-terminal telecom IC with a square package style. It operates b/w -40 to 85 °C, suitable for industrial applications. With a terminal pitch of 0.5mm, it's ideal for telecom circuit interfaces in compact designs.

S-XQCC-N32

4.9 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.12 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4.9 mm

HMC8108LC5 by Analog Devices

HMC8108LC5

Analog Devices

Analog Devices' HMC8108LC5 is a 32-terminal telecom IC with square chip carrier package. Operating from -40 to 85°C, it has a terminal pitch of 0.5mm and no-lead terminal form. Ideal for industrial applications, this IC measures 4.9x4.9mm and can withstand peak reflow temperature of 260°C for up to 30 seconds.

S-XQCC-N32

4.9 mm

3

1

32

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.12 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

4.9 mm

PI3PCIE3242ZLEX by Diodes Incorporated

PI3PCIE3242ZLEX

Diodes Incorporated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-XQCC-N30

4.5 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

30

2.5 mm

EFR32BG1B132F256GM32-C0R by Silicon Labs

EFR32BG1B132F256GM32-C0R

Silicon Labs

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e3

5 mm

2

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Matte Tin (Sn)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

NEO-M8Q-0 by U-blox Ag

NEO-M8Q-0

U-blox Ag

NEO-M8Q-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With AEC-Q100 screening and TS 16949 certification, it's ideal for industrial applications requiring a 3V supply voltage. Its compact rectangular package measures 12.2mm x 16mm with a seated height of 2.6mm, making it suitable for space-constrained designs in automotive or telecommunications systems.

R-XDMA-N24

16 mm

4

1

24

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

AEC-Q100; TS 16949

2.6 mm

3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

12.2 mm

BGM111E256V2 by Silicon Labs

BGM111E256V2

Silicon Labs

Silicon Labs BGM111E256V2 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm, suitable for TELECOM CIRCUIT applications in INDUSTRIAL settings.

R-XXMA-B31

15 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.15 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

1.2 mm

UNSPECIFIED

12.9 mm

ADRF6821ACPZ-RL7 by Analog Devices

ADRF6821ACPZ-RL7

Analog Devices

Analog Devices' ADRF6821ACPZ-RL7 is a BICMOS telecom IC with 56 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use at 3.3V supply voltage. With a compact size of 8x8mm and terminal pitch of 0.5mm, it's ideal for telecom circuit applications requiring high reliability.

S-XQCC-N56

e4

8 mm

3

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

ADRF6821ACPZ by Analog Devices

ADRF6821ACPZ

Analog Devices

Analog Devices' ADRF6821ACPZ is a BICMOS telecom IC with 56 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use at 3.3V supply voltage. With a compact size of 8x8mm and terminal pitch of 0.5mm, it's ideal for telecom circuit applications requiring high reliability.

S-XQCC-N56

e4

8 mm

3

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

BICMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

BM71BLE01FC2-0B02AA by Microchip Technology

BM71BLE01FC2-0B02AA

Microchip Technology

BM71BLE01FC2-0B02AA by Microchip Technology is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 17 terminals, operating from -40 to 85 °C. It's a TELECOM CIRCUIT IC with 3V supply voltage, 0.0086 Mbps data rate, suitable for industrial applications like telecom interfaces.

.0086 Mbps

R-XQMA-N17

8 mm

1

17

85 Cel

-40 Cel

UNSPECIFIED

QMA

MODULE,17LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

1.66 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

QUAD

30

6 mm

HPA01211RHBR by Texas Instruments

HPA01211RHBR

Texas Instruments

Texas Instruments' HPA01211RHBR is a telecom interface IC with 2 channels, operating at -40 to 85°C. It features a square chip carrier package with 32 terminals, nickel palladium gold finish, and no-lead terminal form. Ideal for industrial applications requiring a nominal voltage of 1.8V and surface mount installation in compact spaces.

S-PQCC-N32

e4

5 mm

2

2

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

5 mm

TC35678FSG-002 by Toshiba

TC35678FSG-002

Toshiba

TC35678FSG-002 by Toshiba is a telecom interface IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It has a nominal voltage of 3V and terminal pitch of 0.4mm, making it ideal for telecom circuit integration.

S-PQCC-N40

5 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

5 mm

SL869GNS117T001 by Telit Communications Plc

SL869GNS117T001

Telit Communications Plc

Telit Communications Plc's SL869GNS117T001 is a small outline telecom IC with 24 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is surface-mountable. Ideal for industrial applications requiring compact telecom circuitry with dual terminal positions.

R-PDSO-N24

16 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

NOT SPECIFIED

12.2 mm

MGM111A256V1 by Silicon Labs

MGM111A256V1

Silicon Labs

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Code: XMA; Package Shape: RECTANGULAR;

.25 Mbps

R-XXMA-N31

15 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

12.9 mm

AD9172BBPZRL by Analog Devices

AD9172BBPZRL

Analog Devices

AD9172BBPZRL by Analog Devices is a 144-terminal IC with package style GRID ARRAY, FINE PITCH. It operates b/w -40 to 85 °C and has a nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial temperature-grade applications.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

NOT SPECIFIED

1.71 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9172BBPZ by Analog Devices

AD9172BBPZ

Analog Devices

AD9172BBPZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1V. This IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

NOT SPECIFIED

1.71 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

BGM111A256V21 by Silicon Labs

BGM111A256V21

Silicon Labs

BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.

R-XXMA-N31

15 mm

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

12.9 mm

TUSB214QRWBTQ1 by Texas Instruments

TUSB214QRWBTQ1

Texas Instruments

TUSB214QRWBTQ1 by Texas Instruments is a telecom interface IC with 12 terminals in a chip carrier package. It operates at temperatures ranging from -40 to 105°C, with a data rate of 480.24 Mbps. Ideal for industrial applications requiring a supply voltage of 3.3V and low supply current of 0.03mA.

480.24 Mbps

S-PQCC-N12

e4

1.6 mm

2

1

1

12

105 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

AEC-Q100

.4 mm

.03 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

TUSB212QRWBRQ1 by Texas Instruments

TUSB212QRWBRQ1

Texas Instruments

TUSB212QRWBRQ1 by Texas Instruments is a telecom IC with 480.24 Mbps data rate, operating at -40 to 105°C. It features a 3.3V supply voltage, 0.03 mA supply current, and AEC-Q100 screening for industrial applications in automotive or telecommunications due to its compact chip carrier package design.

480.24 Mbps

S-PQCC-N12

e4

1.6 mm

2

1

1

12

105 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

AEC-Q100

.4 mm

.03 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

SI4060-B1B-FM by Silicon Labs

SI4060-B1B-FM

Silicon Labs

SI4060-B1B-FM by Silicon Labs is a telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial applications requiring very thin profile and surface mount compatibility.

S-XQCC-N20

e3

4 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

40

4 mm

ADC32RF82IRMPR by Texas Instruments

ADC32RF82IRMPR

Texas Instruments

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 72; Package Code: VQCCN; Package Shape: SQUARE;

480.24 Mbps

S-PQCC-N72

e4

10 mm

3

1

72

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

1.15 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

10 mm

ADC32RF82IRMPT by Texas Instruments

ADC32RF82IRMPT

Texas Instruments

Texas Instruments ADC32RF82IRMPT is a 72-terminal telecom IC with data rate of 12500 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has a supply voltage of 1.15 V. The chip carrier package style makes it suitable for telecom circuit applications.

12500 Mbps

S-PQCC-N72

e4

10 mm

3

1

72

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

1.15 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

10 mm

ADRF5044BCCZN by Analog Devices

ADRF5044BCCZN

Analog Devices

Analog Devices' ADRF5044BCCZN is a 24-terminal SQUARE IC with -40 to 85°C temp range. Ideal for TELECOM CIRCUITS, it operates at 3.3V, has a 0.5mm terminal pitch, and MSL of 3.

S-XBGA-B24

e4

4 mm

3

-3.3 V

1

24

85 Cel

-40 Cel

UNSPECIFIED

HLGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

.96 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BUTT

.5 mm

BOTTOM

30

4 mm

TUSB214IRWBR by Texas Instruments

TUSB214IRWBR

Texas Instruments

TUSB214IRWBR by Texas Instruments is a telecom IC with data rate of 480.24 Mbps, operating at 3.3V. It features a quad terminal position, very thin profile chip carrier package style, and industrial temperature grade suitability. Ideal for telecom interface applications requiring low supply current and high-speed data transmission in compact designs.

480.24 Mbps

S-PQCC-N12

e4

1.6 mm

2

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

.4 mm

.03 mA

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

1.6 mm

ATSAMB11-XR2100A by Microchip Technology

ATSAMB11-XR2100A

Microchip Technology

ATSAMB11-XR2100A by Microchip: Telecom IC with 49 terminals, 3.6V supply voltage, and -40 to 85°C operating range. Ideal for telecom circuits in industrial applications due to TS 16949 screening level and compact GRID ARRAY package style.

R-XBGA-N49

5.5 mm

1

49

85 Cel

-40 Cel

UNSPECIFIED

HLGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

TS 16949

1.4 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

BOTTOM

4.5 mm

FIDO5100BBCZ by Analog Devices

FIDO5100BBCZ

Analog Devices

FIDO5100BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With CMOS technology and a supply voltage of 1.2V, it's ideal for telecom circuit integration in compact spaces.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5200BBCZ by Analog Devices

FIDO5200BBCZ

Analog Devices

FIDO5200BBCZ by Analog Devices is a telecom IC with 144 terminals in a low-profile grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it's ideal for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MAX-8Q by U-blox Ag

MAX-8Q

U-blox Ag

The U-blox Ag MAX-8Q is a telecom IC with 18 terminals, operating temperature range of -40 to 85°C. It is AEC-Q100 and TS 16949 compliant, suitable for industrial applications requiring a nominal voltage of 3V. The package is made of PLASTIC/EPOXY material, surface mountable in a small outline style for telecom circuit interfaces.

R-PDSO-N18

1

18

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

AEC-Q100; TS 16949

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

NOT SPECIFIED

ESP32-D2WD by Espressif Systems (Shanghai)

ESP32-D2WD

Espressif Systems (Shanghai)

ESP32-D2WD by Espressif Systems is a 48-terminal IC with CMOS technology. Operating from -40 to 105°C, it has a supply voltage of 3.3V. Ideal for telecom circuits, this chip carrier is surface-mountable and features a very thin profile for industrial applications.

S-XQCC-N48

5 mm

1

48

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.35 mm

QUAD

5 mm

CC2564BYFVR-XI by Texas Instruments

CC2564BYFVR-XI

Texas Instruments

CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.

4 Mbps

R-XBGA-B54

e1

3.26 mm

1

1

54

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.93 mm

L80-M39 by Quectel Wireless Solutions

L80-M39

Quectel Wireless Solutions

L80-M39 by Quectel is a telecom interface IC with 1 function. It has a square package shape, 12 terminals, and a max operating temperature of 85°C. This IC is commonly used in industrial applications requiring reliable telecom circuitry.

S-XDMA-N12

16 mm

1

12

85 Cel

-40 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

7.05 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2.54 mm

DUAL

NOT SPECIFIED

16 mm

EFR32BG12P432F1024GM48-C by Silicon Labs

EFR32BG12P432F1024GM48-C

Silicon Labs

EFR32BG12P432F1024GM48-C by Silicon Labs is a 48-terminal IC with 3.3V supply voltage, operating at -40 to 85°C. It offers a data rate of 2 Mbps and is ideal for telecom circuit applications due to its compact square chip carrier package style.

2 Mbps

S-XQCC-N48

7 mm

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

7 mm

CC2560BYFVR by Texas Instruments

CC2560BYFVR

Texas Instruments

CC2560BYFVR by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

CC2560BYFVT by Texas Instruments

CC2560BYFVT

Texas Instruments

CC2560BYFVT by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

STA8090EXGAJTR by STMicroelectronics

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGAJ by STMicroelectronics

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGATR by STMicroelectronics

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm