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HMC8108LC5

Analog Devices

HMC8108LC5 by Analog Devices

Analog Devices' HMC8108LC5 is a 32-terminal telecom IC with square chip carrier package. Operating from -40 to 85°C, it has a terminal pitch of 0.5mm and no-lead terminal form. Ideal for industrial applications, this IC measures 4.9x4.9mm and can withstand peak reflow temperature of 260°C for up to 30 seconds.

Median Price

$67.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 254 parts In-Stock

1+ parts

$61.110

100+ parts

-

1k+ parts

$39.690

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254

$61.110

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$39.690

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Mouser Electronics

USA . 19 parts In-Stock

1+ parts

$74.390

100+ parts

$55.160

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-

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19

$74.390

$55.160

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-

DigiKey

USA . 2 parts In-Stock

1+ parts

$74.390

100+ parts

$55.167

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-

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2

$74.390

$55.167

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-

Verical

USA . 252 parts In-Stock

1+ parts

-

100+ parts

$47.199

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-

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252

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$47.199

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 460 parts In-Stock

1+ parts

$44.812

100+ parts

-

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460

$44.812

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Vyrian

USA . 7,250 parts In-Stock

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7,250

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

$11.022

100+ parts

-

1k+ parts

$10.251

10k+ parts

-

1,399

$11.022

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$10.251

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IDEA Electronic Components Group

UK . 523 parts In-Stock

1+ parts

$11.852

100+ parts

$11.259

1k+ parts

$11.259

10k+ parts

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523

$11.852

$11.259

$11.259

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DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

$18.489

100+ parts

$17.750

1k+ parts

-

10k+ parts

$17.750

1,015

$18.489

$17.750

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$17.750

Semicontronic

India . 210 parts In-Stock

1+ parts

$40.090

100+ parts

$39.088

1k+ parts

$38.887

10k+ parts

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210

$40.090

$39.088

$38.887

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Ampacity Inc.

Singapore . 91 parts In-Stock

1+ parts

$40.090

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91

$40.090

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Corphita

USA . 167 parts In-Stock

1+ parts

$42.453

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167

$42.453

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Enhance your telecom systems with the HMC8108LC5 by Analog Devices, a top-quality product designed for superior performance and reliability. With its advanced technology and innovative design, this telecom interface IC offers unparalleled value and benefits to customers in various applications. Trust the expertise of Analog Devices, a leading manufacturer in the industry, and elevate your communication systems to new heights with the HMC8108LC5.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design for the product.

No. of Terminals: 32

The high number of terminals allows for versatile connectivity options and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG

The package style ensures efficient heat dissipation, leading to better performance and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold environments.

Terminal Position: QUAD

Quad terminal position enables better connectivity and stability in the circuit.

Maximum Seated Height: 1.12 mm

Low maximum seated height allows for a slim and sleek design, suitable for compact devices.

Width: 4.9 mm

Compact width enables the product to be used in space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures efficient and reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and bonding of components during assembly.

Length: 4.9 mm

Compact length contributes to a smaller overall footprint of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh industrial environments.

Terminal Form: NO LEAD

No-lead terminal form offers environmental benefits and enhanced connectivity reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and functionality in communication systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 ensures the product is protected against moisture damage during storage and handling.

Technical Specifications

Other Function Telecom Interface ICs HMC8108LC5 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.9 mm

Trade Compliance

HMC8108LC5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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