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HMC861LP3E

Analog Devices

HMC861LP3E by Analog Devices

Analog Devices' HMC861LP3E is a 16-terminal telecom IC with matte tin finish, suitable for industrial applications. With a nominal voltage of 5V, it operates b/w -40 to 85°C and has a terminal pitch of 0.5mm. The chip carrier package style features a very thin profile and square shape, making it ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,314 parts In-Stock

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Digiode

USA . 960 parts In-Stock

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960

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Cogito LLC

Ukraine . 8 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 56 parts In-Stock

1+ parts

$10.089

100+ parts

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$9.382

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56

$10.089

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$9.382

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

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$10.848

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$10.306

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$10.306

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1,606

$10.848

$10.306

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AZTECH Wire

Italy . 779 parts In-Stock

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$14.929

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$14.929

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DigiPath Technology Company

USA . 712 parts In-Stock

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$16.923

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$16.246

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$16.246

712

$16.923

$16.246

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$16.246

Semicontronic

India . 841 parts In-Stock

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$936.000

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$912.600

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$907.920

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841

$936.000

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One Stop Electronics

USA . 351 parts In-Stock

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$945.000

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Corphita

USA . 727 parts In-Stock

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Authorized Procurement Solutions

USA . 168 parts In-Stock

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Overview

Elevate your telecommunications systems with the HMC861LP3E by Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers top-quality Other Function Telecom Interface ICs that provide unparalleled performance and reliability. The HMC861LP3E offers customers unmatched value, benefits, and advantages, making it the ideal choice for a wide range of applications. Upgrade your telecom infrastructure with this cutting-edge product and experience seamless operations like never before. Trust Analog Devices to elevate your communication systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mount allows for easy installation and saves space on the PCB, making it suitable for compact applications.

Package Shape: SQUARE

The square package shape provides a uniform footprint for easy integration into PCB designs and better utilization of space.

No. of Terminals: 16

With 16 terminals, this product offers a versatile interface for connectivity options, suitable for various telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in a variety of environmental conditions, making it ideal for industrial use.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product is compatible with common power sources, making it easy to integrate into existing systems.

Technical Specifications

Other Function Telecom Interface ICs HMC861LP3E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC861LP3E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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