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HMC862LP3ETR

Analog Devices

HMC862LP3ETR by Analog Devices

Analog Devices' HMC862LP3ETR is a 16-terminal telecom IC with matte tin finish, operating from -40 to 85 °C. It features a square chip carrier package style, suitable for industrial applications requiring a nominal voltage of 5V and terminal pitch of 0.5mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,252 parts In-Stock

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4,252

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Digiode

USA . 585 parts In-Stock

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585

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Chip Stock

USA . 262 parts In-Stock

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262

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

$11.442

100+ parts

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1k+ parts

$10.641

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1,372

$11.442

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$10.641

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IDEA Electronic Components Group

UK . 90 parts In-Stock

1+ parts

$12.303

100+ parts

$11.688

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$11.688

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90

$12.303

$11.688

$11.688

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AZTECH Wire

Italy . 697 parts In-Stock

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$16.115

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697

$16.115

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DigiPath Technology Company

USA . 1,339 parts In-Stock

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$19.193

100+ parts

$18.425

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$18.425

1,339

$19.193

$18.425

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$18.425

One Stop Electronics

USA . 1,519 parts In-Stock

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$29.000

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1,519

$29.000

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Semicontronic

India . 1,190 parts In-Stock

1+ parts

$577.000

100+ parts

$562.575

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$559.690

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1,190

$577.000

$562.575

$559.690

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Corphita

USA . 934 parts In-Stock

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934

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Overview

Unleash the power of cutting-edge technology with Analog Devices' HMC862LP3ETR. This innovative product, part of the Other Function Telecom Interface ICs category, offers unparalleled quality and reliability. With a package body material made of PLASTIC/EPOXY and a terminal finish of MATTE TIN, this chip carrier delivers exceptional performance in a compact form factor. Ideal for industrial applications, the HMC862LP3ETR boasts a wide operating temperature range and a nominal supply voltage of 5V. Upgrade your telecom circuits with this top-of-the-line solution from Analog Devices and experience the benefits of superior functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and mechanical protection, enhancing the durability and reliability of the product.

Surface Mount: YES

Surface mounting simplifies the assembly process, reduces space requirements, and improves overall product efficiency.

Package Shape: SQUARE

Square packages are easier to handle, store, and mount, making the product more user-friendly.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and compatibility with various systems, increasing the product's versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation, compact size, and improved electrical performance, making it ideal for telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring long-term functionality and reliability.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows the product to operate effectively in various climates and environments.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: QUAD

Quad terminal position allows for efficient signal transmission and connectivity, improving overall performance.

Maximum Seated Height: 1 mm

Having a low maximum seated height ensures compatibility with slim designs and compact spaces, making it suitable for space-constrained applications.

Width: 3 mm

Compact width enables easy integration into various systems and devices, maximizing flexibility and usability.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables reliable soldering and assembly processes, ensuring long-term product durability.

Length: 3 mm

Short length saves space, making the product suitable for compact designs and applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, increasing the product's durability and longevity.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces health risks, making the product eco-friendly.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type ensures optimized performance and compatibility in telecom systems.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is common in telecom applications, ensuring compatibility and efficient power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections, maximizing signal integrity and overall product performance.

Technical Specifications

Other Function Telecom Interface ICs HMC862LP3ETR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC862LP3ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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