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HMC862LP3E

Analog Devices

HMC862LP3E by Analog Devices

Analog Devices' HMC862LP3E is a 16-terminal telecom IC with a 5V supply voltage, operating b/w -40 to 85°C. It features matte tin finish, chip carrier package style, and quad terminal position. Ideal for telecom circuits, this surface-mount IC in plastic/epoxy body suits industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,287 parts In-Stock

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Digiode

USA . 617 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 374 parts In-Stock

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$14.894

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374

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Parana Technologies

USA . 1,989 parts In-Stock

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$15.270

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$14.201

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IDEA Electronic Components Group

UK . 1,179 parts In-Stock

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$16.419

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$15.598

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$15.598

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$15.598

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DigiPath Technology Company

USA . 2,742 parts In-Stock

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$25.614

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$24.589

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$24.589

2,742

$25.614

$24.589

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$24.589

Semicontronic

India . 266 parts In-Stock

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$143.000

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$139.425

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$138.710

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266

$143.000

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$138.710

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One Stop Electronics

USA . 507 parts In-Stock

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$518.000

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507

$518.000

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Ampacity Inc.

Singapore . 1,109 parts In-Stock

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$532.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 392 parts In-Stock

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Corphita

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Overview

Elevate your telecom interface solutions with the HMC862LP3E from Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge technology in the form of this versatile IC. Perfect for a wide range of applications in the telecom industry, this product offers unmatched value and benefits to customers looking to optimize their systems. Say goodbye to subpar performance and hello to seamless connectivity with the HMC862LP3E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and allows for reliable performance in various telecom applications.

Surface Mount: YES

Enables easy installation and reduces the overall size of the product, making it suitable for space-constrained environments.

Package Shape: SQUARE

A compact shape that optimizes space utilization on PCBs and ensures efficient heat dissipation.

No. of Terminals: 16

Offers multiple connection points for versatile connectivity and integration with other components.

Maximum Operating Temperature: 85 °C

Allows the product to operate effectively in high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Ensures functionality even in extremely cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish: MATTE TIN

Provides excellent electrical conductivity and corrosion resistance, enhancing the longevity of the product.

Nominal Supply Voltage: 5 V

Standard voltage requirement that is easily attainable in most applications, ensuring compatibility and ease of use.

Technical Specifications

Other Function Telecom Interface ICs HMC862LP3E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC862LP3E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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