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HMC8108LC5TR-R5

Analog Devices

HMC8108LC5TR-R5 by Analog Devices

Analog Devices' HMC8108LC5TR-R5 is a 32-terminal telecom IC with a square chip carrier package. Operating b/w -40 to 85 °C, it has a peak reflow temp of 260°C and terminal pitch of 0.5mm. Ideal for telecom circuits, this industrial-grade IC suits applications requiring compact design and high-temperature tolerance.

Median Price

$58.092

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 2,000 parts In-Stock

1+ parts

$61.670

100+ parts

-

1k+ parts

$39.690

10k+ parts

-

2,000

$61.670

-

$39.690

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$54.514

10k+ parts

-

1,000

-

-

$54.514

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 316 parts In-Stock

1+ parts

$65.274

100+ parts

-

1k+ parts

-

10k+ parts

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316

$65.274

-

-

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Vyrian

USA . 9,891 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,891

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 4,212 parts In-Stock

1+ parts

$8.012

100+ parts

-

1k+ parts

$7.451

10k+ parts

-

4,212

$8.012

-

$7.451

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IDEA Electronic Components Group

UK . 396 parts In-Stock

1+ parts

$8.615

100+ parts

-

1k+ parts

$8.184

10k+ parts

-

396

$8.615

-

$8.184

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DigiPath Technology Company

USA . 896 parts In-Stock

1+ parts

$13.439

100+ parts

$12.902

1k+ parts

-

10k+ parts

$12.902

896

$13.439

$12.902

-

$12.902

AZTECH Wire

Italy . 658 parts In-Stock

1+ parts

$15.330

100+ parts

-

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658

$15.330

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Ampacity Inc.

Singapore . 998 parts In-Stock

1+ parts

$46.340

100+ parts

-

1k+ parts

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10k+ parts

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998

$46.340

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-

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Semicontronic

India . 644 parts In-Stock

1+ parts

$46.340

100+ parts

$45.182

1k+ parts

$44.950

10k+ parts

-

644

$46.340

$45.182

$44.950

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Corphita

USA . 310 parts In-Stock

1+ parts

$61.839

100+ parts

-

1k+ parts

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310

$61.839

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-

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Overview

Unleash the power of seamless telecom interface integration with the HMC8108LC5TR-R5 by Analog Devices. Manufactured with precision and expertise, this cutting-edge IC offers unparalleled reliability and performance in a compact chip carrier package. From telecommunications to network infrastructure, this versatile solution ensures optimal connectivity and efficiency. Elevate your projects with the value and benefits that only Analog Devices can deliver. Say goodbye to limitations and embrace limitless possibilities with the HMC8108LC5TR-R5.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making assembly more efficient.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during assembly.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Chip carrier package style with heat sink/slug ensures efficient heat dissipation and reliable performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables operation in extreme cold conditions, increasing product viability.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connectivity, reducing the risk of disconnection.

Maximum Seated Height: 1.12 mm

Low seated height contributes to a compact design, ideal for space-constrained applications.

Width: 4.9 mm

Narrow width makes the product suitable for compact electronic devices and PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for robust soldering and ensures product durability.

Length: 4.9 mm

Compact length facilitates easy integration into electronic assemblies without occupying too much space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions typically found in industrial settings.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations and promotes environmental sustainability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density board design, enabling more connections in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard precautions during storage and handling to prevent damage.

Technical Specifications

Other Function Telecom Interface ICs HMC8108LC5TR-R5 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.9 mm

Trade Compliance

HMC8108LC5TR-R5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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