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Analog Devices Cellphone ICs 76

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
ADF4360-5BCPZ by Analog Devices

ADF4360-5BCPZ

Analog Devices

Analog Devices' ADF4360-5BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, BICMOS technology, and -40 to 85 °C operating temperature range. It features a square package shape, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-6BCPZ by Analog Devices

ADF4360-6BCPZ

Analog Devices

Analog Devices' ADF4360-6BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85 °C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-6BCPZRL7 by Analog Devices

ADF4360-6BCPZRL7

Analog Devices

Analog Devices' ADF4360-6BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for baseband circuits in industrial telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AD6654BBC by Analog Devices

AD6654BBC

Analog Devices

AD6654BBC by Analog Devices is a Cellphone IC with 256 terminals in a square grid array package. It operates b/w -25 °C to 85°C, with a nominal voltage of 1.8V. This BASEBAND CIRCUIT IC is designed for telecom applications, featuring surface mount capability and TIN LEAD SILVER terminal finish.

S-PBGA-B256

e0

17 mm

3

1

256

85 Cel

-25 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

240

Not Qualified

1.85 mm

1.8 V

YES

BASEBAND CIRCUIT

OTHER

TIN LEAD SILVER

BALL

1 mm

BOTTOM

17 mm

AD607ARSZ by Analog Devices

AD607ARSZ

Analog Devices

AD607ARSZ by Analog Devices is a cellphone IC with 20 terminals in a small outline package. Operating temp range -25 to 85°C, nominal voltage of 3V, and peak reflow temp of 260°C. Ideal for telecom applications as a baseband circuit due to its compact size and gull wing terminal form.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

AD6634BBCZ by Analog Devices

AD6634BBCZ

Analog Devices

AD6634BBCZ by Analog Devices is a Cellphone IC with 196 terminals in a square grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features CMOS technology, 2.5V supply voltage, and baseband circuit for telecom applications.

S-PBGA-B196

e1

15 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

15 mm

ADF7901BRUZ-RL by Analog Devices

ADF7901BRUZ-RL

Analog Devices

Analog Devices' ADF7901BRUZ-RL is a cellphone IC with 24 terminals, operating at 0-50 °C. It features a 3V supply voltage, RF and baseband circuitry for telecom applications. The small outline package has a thin profile, matte tin finish, and dual terminal position.

R-PDSO-G24

e3

7.8 mm

1

1

24

50 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

AD607ARSZ-REEL by Analog Devices

AD607ARSZ-REEL

Analog Devices

AD607ARSZ-REEL by Analog Devices is a BASEBAND CIRCUIT for cellphones. It operates b/w -25 to 85°C with a supply voltage of 3V. This SMALL OUTLINE IC has 20 terminals, matte tin finish, and measures 7.2mm x 5.3mm in size for telecom applications.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

ADF7025BCPZ by Analog Devices

ADF7025BCPZ

Analog Devices

Analog Devices' ADF7025BCPZ is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

ADF7021-VBCPZ-RL by Analog Devices

ADF7021-VBCPZ-RL

Analog Devices

Analog Devices' ADF7021-VBCPZ-RL is a cellphone IC with 48 terminals in a square chip carrier package. It operates at -40 to 85 °C, with a supply voltage of 3V. Ideal for RF and baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grades.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7021-VBCPZ by Analog Devices

ADF7021-VBCPZ

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7020-1BCPZ by Analog Devices

ADF7020-1BCPZ

Analog Devices

Analog Devices' ADF7020-1BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuits for telecom applications, and a compact square package suitable for surface mounting in industrial settings.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADRF5545ABCPZN-RL by Analog Devices

ADRF5545ABCPZN-RL

Analog Devices

Analog Devices' ADRF5545ABCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial telecom applications. With RF and baseband circuits, it has a nominal voltage of 5V and terminal pitch of 0.5mm.

S-XQCC-N40

e4

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

ADRF5549BCPZN-R7 by Analog Devices

ADRF5549BCPZN-R7

Analog Devices

Analog Devices' ADRF5549BCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

ADRF5549BCPZN-RL by Analog Devices

ADRF5549BCPZN-RL

Analog Devices

Analog Devices' ADRF5549BCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

ADRF5547BCPZN-RL by Analog Devices

ADRF5547BCPZN-RL

Analog Devices

Analog Devices' ADRF5547BCPZN-RL is a 40-terminal cellphone IC with a square package shape and chip carrier style. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF front end circuits. With a nominal voltage of 5V, it features a terminal pitch of 0.5mm and can withstand peak reflow temperature of 260°C for up to 30 seconds.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

6 mm

ADRF6658BCPZ-RL7 by Analog Devices

ADRF6658BCPZ-RL7

Analog Devices

Analog Devices' ADRF6658BCPZ-RL7 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADRF6658BCPZ by Analog Devices

ADRF6658BCPZ

Analog Devices

Analog Devices' ADRF6658BCPZ is a 48-terminal cellphone IC with a square package shape and matte tin terminal finish. Operating b/w -40 to 105 °C, it's ideal for RF and baseband circuits in telecom applications. With a compact size of 7x7mm and no-lead terminal form, it offers industrial-grade performance at 3.3V supply voltage.

S-XQCC-N48

e3

7 mm

3

1

48

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

HMC832ALP6GETR by Analog Devices

HMC832ALP6GETR

Analog Devices

Analog Devices' HMC832ALP6GETR is a cellphone IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications. It features RF and baseband circuits, operates at 3.3V, and has a compact size of 6x6mm with a terminal pitch of 0.5mm.

S-XQCC-N40

e3

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

6 mm

HMC832ALP6GE by Analog Devices

HMC832ALP6GE

Analog Devices

Analog Devices' HMC832ALP6GE is a 40-terminal cellphone IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for compact designs requiring high performance.

S-XQCC-N40

e3

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

30

6 mm

AD6688BBPZRL-3000 by Analog Devices

AD6688BBPZRL-3000

Analog Devices

AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

.975 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

ADRF5545ABCPZN by Analog Devices

ADRF5545ABCPZN

Analog Devices

Analog Devices' ADRF5545ABCPZN is a 40-terminal cellphone IC with a square package shape and nickel palladium gold finish. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF and baseband circuit integration. The chip carrier has a very thin profile, measures 6x6 mm, and supports a nominal voltage of 5V.

S-XQCC-N40

e4

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

ADRF5549BCPZN by Analog Devices

ADRF5549BCPZN

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

6 mm

ADRF5547BCPZN by Analog Devices

ADRF5547BCPZN

Analog Devices

Analog Devices' ADRF5547BCPZN is a 40-terminal cellphone IC with a square surface mount package. It operates b/w -40 to 105°C, ideal for industrial telecom applications. With a nominal voltage of 5V and RF front end circuit type, it offers high performance in a compact chip carrier package.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

6 mm

ADRF6650ACPZ-RL7 by Analog Devices

ADRF6650ACPZ-RL7

Analog Devices

Analog Devices' ADRF6650ACPZ-RL7 is a 56-terminal cellphone IC with BICMOS technology, operating from -40 to 105 °C. It features RF and baseband circuits, suitable for telecom applications. The chip carrier package has a very thin profile, measuring 8mm x 8mm in size.

S-XQCC-N56

8 mm

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

ADRF6650ACPZ by Analog Devices

ADRF6650ACPZ

Analog Devices

Analog Devices' ADRF6650ACPZ is a 56-terminal cellphone IC in a square chip carrier package. Operating from -40 to 105°C, it's ideal for RF and baseband circuits with a nominal voltage of 3.3V. Utilizing BiCMOS technology, this industrial-grade IC has a very thin profile at 0.8mm seated height.

S-XQCC-N56

8 mm

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

AD9361BBCZ-CSL by Analog Devices

AD9361BBCZ-CSL

Analog Devices

AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

150 mA

1.3 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9986BBPZ-4D2AC by Analog Devices

AD9986BBPZ-4D2AC

Analog Devices

AD9986BBPZ-4D2AC by Analog Devices is a Cellphone IC with 324 terminals in a square package. It operates b/w -40 to 120 °C, consuming 4070mA at 1V. This RF and baseband circuit is ideal for mobile phone applications due to its compact size and high performance capabilities.

S-PBGA-B324

15 mm

3

1

324

120 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

260

1.72 mm

4070 mA

1 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

30

15 mm