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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU115-L1FLVA1517I by Xilinx

XCKU115-L1FLVA1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCVU065-2FFVC1517I by Xilinx

XCVU065-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

783300

520

520

600

600 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU080-2FFVD1517E by Xilinx

XCVU080-2FFVD1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-2FFVC1517E by Xilinx

XCVU095-2FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-2FFVC1517I by Xilinx

XCVU095-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-2FFVD1517E by Xilinx

XCVU095-2FFVD1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU085-1FLVA1517I by Xilinx

XCKU085-1FLVA1517I

Xilinx

Xilinx XCKU085-1FLVA1517I FPGA features 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. With a max supply voltage of 0.979 V, it is ideal for industrial applications requiring high-performance computing in a compact square package with grid array style.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU095-2FFVC1517E by Xilinx

XCKU095-2FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-1FLVA1517C by Xilinx

XCKU085-1FLVA1517C

Xilinx

Xilinx XCKU085-1FLVA1517C FPGA boasts 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at 0.95V with a max temperature of 85°C, making it suitable for various industrial and commercial projects.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-3FLVA1517E by Xilinx

XCKU085-3FLVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU095-1FFVC1517C by Xilinx

XCKU095-1FFVC1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVA1517E by Xilinx

XCKU085-2FLVA1517E

Xilinx

Xilinx XCKU085-2FLVA1517E FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with PLASTIC/EPOXY body material. Operating temperature range from 0 to 100 °C suits various industrial needs.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU095-2FFVC1517I by Xilinx

XCKU095-2FFVC1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVA1517I by Xilinx

XCKU085-2FLVA1517I

Xilinx

Xilinx XCKU085-2FLVA1517I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C. The package style is grid array with a square shape and ball terminals for surface mount assembly.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU11P-1FFVE1517E by Xilinx

XCKU11P-1FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-1FFVE1517I by Xilinx

XCKU11P-1FFVE1517I

Xilinx

XCKU11P-1FFVE1517I by Xilinx is a PLASTIC/EPOXY FPGA with 653100 logic cells and 37320 CLBs. It has applications in industrial settings, offering a wide temperature range (-40 to 100 °C) and high reliability (Moisture Sensitivity Level 4).

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-2FFVE1517I by Xilinx

XCKU11P-2FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-3FFVE1517E by Xilinx

XCKU11P-3FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-L1FFVE1517I by Xilinx

XCKU11P-L1FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-L2FFVE1517E by Xilinx

XCKU11P-L2FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-1FFVE1517E by Xilinx

XCKU15P-1FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-1FFVE1517I by Xilinx

XCKU15P-1FFVE1517I

Xilinx

Xilinx XCKU15P-1FFVE1517I FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a max supply voltage of 0.876V.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-2FFVE1517I by Xilinx

XCKU15P-2FFVE1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-3FFVE1517E by Xilinx

XCKU15P-3FFVE1517E

Xilinx

Xilinx XCKU15P-3FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V.

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-L2FFVE1517E by Xilinx

XCKU15P-L2FFVE1517E

Xilinx

Xilinx XCKU15P-L2FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.742 V. Suitable for industries needing reliable and efficient solutions in a compact square package style with a grid array design.

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU065-H1FFVC1517E by Xilinx

XCVU065-H1FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

783300

520

520

44760

44760 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-H1FFVC1517E by Xilinx

XCVU095-H1FFVC1517E

Xilinx

Xilinx XCVU095-H1FFVC1517E FPGA features 1176000 logic cells, 67200 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatile package style and operating temperature range from 0 to 100°C.

FPGA

1176000

832

832

67200

67200 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-1FFVC1517E by Xilinx

XCVU3P-1FFVC1517E

Xilinx

Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.

FPGA

862050

520

520

49260

49260 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-2FFVC1517I by Xilinx

XCVU3P-2FFVC1517I

Xilinx

Xilinx XCVU3P-2FFVC1517I FPGA offers 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and grid array package style.

FPGA

862050

520

520

49260

49260 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-3FFVC1517E by Xilinx

XCVU3P-3FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

862050

520

520

49260

49260 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-L2FFVC1517E by Xilinx

XCVU3P-L2FFVC1517E

Xilinx

Xilinx XCVU3P-L2FFVC1517E FPGA boasts 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing, such as data centers, networking equipment, and advanced driver-assistance systems (ADAS).

FPGA

862050

520

520

49260

49260 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-2FFVE1517E by Xilinx

XCKU11P-2FFVE1517E

Xilinx

Xilinx XCKU11P-2FFVE1517E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high-speed processing and complex algorithms in industries like telecommunications, aerospace, and automotive. Operating temperature range from 0 to 100°C with a max supply voltage of 0.876V.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-2FFVE1517E by Xilinx

XCKU15P-2FFVE1517E

Xilinx

Xilinx XCKU15P-2FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V and operating temperature range from 0 to 100 °C. Suitable for various industries due to its advanced programmable features and compact grid array package style.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-2FFVC1517E by Xilinx

XCVU3P-2FFVC1517E

Xilinx

Xilinx XCVU3P-2FFVC1517E FPGA offers 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. This GRID ARRAY package is suitable for various industries due to its versatility and reliability.

FPGA

862050

520

520

49260

49260 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

10AX066N1F40I1HG by Intel

10AX066N1F40I1HG

Intel

Intel's 10AX066N1F40I1HG FPGA boasts 660,000 logic cells and 25,168 CLBs. Utilizing TSMC technology, it offers 588 inputs/outputs for industrial applications requiring high-performance programmable ICs in a compact square package with a grid array style.

FPGA

660000

588

588

25168

TSMC

25168 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.35 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXFB5K4F40I5G by Intel

5AGXFB5K4F40I5G

Intel

Intel's 5AGXFB5K4F40I5G FPGA features 420,000 logic cells and TSMC technology. With 15849 CLBs and 704 inputs/outputs, it is ideal for industrial applications requiring high performance in a compact package with a max operating temperature of 100°C.

FPGA

420000

704

704

15849

TSMC

15849 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXFB7K4F40I5G by Intel

5AGXFB7K4F40I5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: HBGA; Package Shape: SQUARE;

FPGA

504000

704

704

19024

TSMC

19024 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

EP4SGX230KF40C2G by Intel

EP4SGX230KF40C2G

Intel

EP4SGX230KF40C2G by Intel is a FPGA with 9120 CLBs and 744 inputs. Operating b/w 0-85 °C, it has a supply voltage range of 0.87-0.93 V. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

744

9120

9120 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

10AX066N2F40E1HG by Intel

10AX066N2F40E1HG

Intel

Intel's 10AX066N2F40E1HG FPGA boasts 660K logic cells, 25168 CLBs, and TSMC technology. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications and aerospace.

FPGA

660000

588

588

25168

TSMC

25168 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.35 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXBB1D4F40I5G by Intel

5AGXBB1D4F40I5G

Intel

Intel's 5AGXBB1D4F40I5G FPGA boasts 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for industrial applications with a max operating temp of 100°C, it features a grid array package style and supports up to 704 inputs/outputs.

FPGA

300000

704

704

11321

TSMC

11321 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXMB3G6F40C6G by Intel

5AGXMB3G6F40C6G

Intel

Intel's 5AGXMB3G6F40C6G FPGA boasts 362K logic cells, TSMC technology, and 1.13V max supply voltage. Ideal for applications requiring high-speed data processing, such as telecommunications infrastructure and industrial automation systems.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXFB3H4F40I5G by Intel

5AGXFB3H4F40I5G

Intel

Intel's 5AGXFB3H4F40I5G FPGA boasts 362K logic cells, TSMC technology, and 13688 CLBs. With a max supply voltage of 1.13V, it is ideal for industrial applications requiring high-performance computing in a compact form factor with a grid array package style.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXFB1H4F40C5G by Intel

5AGXFB1H4F40C5G

Intel

Intel's 5AGXFB1H4F40C5G FPGA features 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for applications requiring high-speed data processing, such as telecommunications equipment and industrial automation systems.

FPGA

300000

704

704

11321

TSMC

11321 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

EP4SGX530KH40I4G by Intel

EP4SGX530KH40I4G

Intel

Intel's EP4SGX530KH40I4G is a FPGA with 531,200 logic cells and 21,248 CLBs. Operating b/w -40 to 100°C, it has a supply voltage range of 0.87-0.93V. Ideal for applications requiring high-performance programmable ICs in a compact square grid array package.

FPGA

531200

21248

21248 CLBS

0.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517